Europe Potting and Encapsulating Compounds Market, By Type (Epoxy, Polyurethane, Silicone, Polyester System, Polyamide, Polyolefin and Others), Substrate Type (Glass, Metal, Ceramic, Others), Function (Electrical Insulation, Heat Dissipation, Corrosion Protection, Shock Resistance, Chemical Protection, Others), Curing Technique (Room Temperature Cured, High Temperature or Thermally Cured, UV Cured), Distribution Channel ( Offline, Online), Application (Electronics, Electrical) and End-User industry (Electronics, Automotive, Aerospace, Marine, Energy & Power, Telecommunication, Healthcare, Others), Country (Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, and Rest of Europe) Industry Trends and Forecast to 2028.
Market Analysis and Insights: Europe Potting and Encapsulating Compounds Market
Europe potting and encapsulating compounds market is expected to gain market growth in the forecast period of 2021 to 2028. Data Bridge Market Research analyses that the market is growing at a CAGR of 4.3% in the forecast period of 2021 to 2028 and expected to reach USD 907,011.37 million by 2028.
Potting is the process of filling a complete electronic assembly with a solid or gelatinous compound such as acrylic, silicone, or resins and improves vibration and shock resistance, protecting against corrosive substances and dampness. On the other hand, encapsulation uses a reusable mold to build a frame around an item and fill the gap between the frame and the object with chemicals. Encapsulation's primary function is to build a protective shell around the electronic assembly.
Increased consumer spending throughout the world is accelerating the expansion of the electronics sector. Consumer demand for electronics rises in response to the growth of developing countries. Electronics-producing countries have large customer bases who can afford innovative electronic items, resulting to a growth of Europe potting and encapsulating compounds market.
This potting and encapsulating compounds market report provides details of market share, new developments, and product pipeline analysis, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, product approvals, strategic decisions, product launches, geographic expansions, and technological innovations in the market. To understand the analysis and the market scenario contact us for an Analyst Brief, our team will help you create a revenue impact solution to achieve your desired goal.
Europe Potting and Encapsulating Compounds Market Scope and Market Size
Europe potting and encapsulating compounds market is segmented of the categorized into type, substrate type, function, curing technique, distribution channel, application, and end-user. The growth among segments helps you analyse niche pockets of growth and strategies to approach the market and determine your core application areas and the difference in your target markets.
- On the basis of type, Europe potting and encapsulating compounds market are segmented into epoxy, polyurethane, silicone, polyester, polyamide, polyolefin and others. In the European region, the demand for the epoxy segment is increasing as epoxies are used as raw materials in manufacturing several electrical products which result in an increase in its demand in the European countries.
- On the basis of substrate type, Europe potting and encapsulating compounds market is segmented into glass, metal, ceramic and others. In the European region, metal substrate type is dominating as metals are less brittle in nature compared to other substrate types.
- On the basis of function, Europe potting and encapsulating compounds market is segmented into electrical insulation, heat dissipation, corrosion protection, shock resistance, chemical protection and others. In the European region, electrical insulation segment is dominating as electrical insulator emits less pollution which increases its demand in the region.
- On the basis of curing technique, Europe potting and encapsulating compounds market is segmented into room temperature cured, high temperature or thermally cured and UV cured. In the European region, the UV cured segment is dominating as this technique is mechanically strong compared to other techniques which increase its demand in the region.
- On the basis of distribution channel, Europe potting and encapsulating compounds market is segmented into offline and online. In the European region, the offline segment is dominating as this channel provides a variety of choices which increases its demand in the region.
- On the basis of application, Europe potting and encapsulating compounds market is segmented into electronics and electrical. In the European region, the electrical segment is dominating due to an increase in the demand for high-efficiency potting and encapsulating products in the region.
- On the basis of end-use, Europe potting and encapsulating compounds market is segmented into electronics, automotive, aerospace, marine, energy & power, telecommunication, healthcare, and others. In the Europe, the electronics sector is dominating the market as the demand for miniaturization devices has increased in the region where these compounds are mainly used.
Europe Potting and Encapsulating Compounds Market Country Level Analysis
Europe potting and encapsulating compounds market is analysed and market size information is provided by country, type, substrate type, function, curing technique, distribution channel, application, and end-user.
The countries covered in Europe potting and encapsulating compounds market report are Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, and rest of Europe.
- In Europe, Germany is expected to dominate due to increased demand for eco-friendly potting compounds.
The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as new sales, replacement sales, country demographics, regulatory acts and import-export tariffs are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of Europe brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of sales channels are considered while providing forecast analysis of the country data.
Growth in Consumer Electronics Sector
Increased consumer spending throughout the world is accelerating the expansion of the electronics sector. Consumer demand for electronics rises in response to the growth of developing countries. Electronics-producing countries have large customer bases who can afford innovative electronic items, resulting to a growth of Europe potting and encapsulating compounds market.
Competitive Landscape and Potting and Encapsulating Compounds Market Share Analysis
Europe potting and encapsulating compounds market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, Europe presence, production sites and facilities, company strengths and weaknesses, product launch, clinical trials pipelines, brand analysis, product approvals, patents, product width and breath, application dominance, technology lifeline curve. The above data points provided are only related to the company’s focus related to Europe potting and encapsulating compounds market.
The major market players engaged in the Europe potting and encapsulating compounds market are Wacker Chemie AG, CHT Germany GmbH, Showa Denko Materials Co., Ltd. (A Subsidiary of Hitachi, Ltd.), 3M, Electrolube, Epoxies Etc., Dymax, Master Bond Inc., DELO, INTERTRONICS, ALTANA, Epic Resins, MG Chemicals, Nagase America LLC., DuPont, Avantor, Inc., Creative Materials Inc., Henkel AG & Co. KGaA, PARKER HANNIFIN CORP, Momentive, HERNON MANUFACTURING INC., and ITW Performance Polymers among others.
For instance,
- In October 2020, Epoxies Etc. formulated a new epoxy product, 20-3305, which was developed to withstand high-voltage electronic needs and protects electronic assemblies from heat cycling and stress. This product was launched to bring a variety to their product portfolio in terms of thermal shock resistance.
- In April 2021, Master Bond Inc. launched a new product, MasterSil 153AO, an adding cured two-part silicone with a self-priming property with a thermally conductive and electrically insulating structure. The product launch was made to bring variety to their existing product portfolio.
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