全球積體電路（IC）近場通訊市場－產業趨勢及2028年預測

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全球積體電路（IC）近場通訊市場－產業趨勢及2028年預測

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  • Oct 2021
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  • 350 页面
  • 桌子數： 220
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  • Author : Megha Gupta
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全球積體電路 (IC)近場通訊市場，依操作模式（讀/寫模式、點對點模式、卡片模擬模式）、最終用戶（零售、運輸、汽車、住宅和商業、醫療和保健、消費電子、銀行和金融、酒店、其他）、國家（美國、加拿大、墨西哥、巴西、阿根廷、南美洲其他地區、德國、法國、義大利、英國、比利時、西班牙、俄羅斯、土耳其、荷蘭、瑞士、歐洲其他地區、日本、中國、印度、韓國、澳洲、新加坡、馬來西亞、泰國、印尼、菲律賓、亞太其他地區、阿聯酋、沙烏地阿拉伯、埃及、南非、以色列、中東和非洲其他地區）產業趨勢與預測到2028 年。

積體電路（IC）近場通訊市場

市場分析與洞察：全球積體電路（IC）近場通訊市場

積體電路近場通訊市場預計將在 2021 年至 2028 年的預測期內實現市場成長。 Data Bridge Market Research 分析該市場到 2028 年將達到 541.955 億美元的估計價值，並在上述預測期內以 14.20% 的複合年增長率增長。

近場通訊IC或晶片本質上是一種積體電路（IC）或矽元件，可根據應用以各種方式使用。連接到適當的天線後，晶片可實現兩個電子設備之間的短距離、非接觸式或無線通訊。這提供了額外的安全保障，因為只有彼此靠近的設備才能透過NFC進行通訊。

對資料傳輸便利性和安全性的需求，以及智慧型手機的普及等因素預計將成為加速積體電路 (IC) 近場通訊市場成長的重要因素。此外，對提升客戶體驗的需求以及基於 NFC 的行動錢包（例如 Apple Pay、Samsung Pay、Google Pay 和 Android Pay）的廣泛採用，將進一步促進積體電路 (IC) 近場通訊市場的成長。然而，對安全性及其較短操作範圍的擔憂可能會阻礙技術的演進，從而限制積體電路 (IC) 近場通訊市場的成長。

創新先進的消費性電子產品（例如支援NFC的可穿戴技術）的出現預計將為積體電路(IC)近場通訊市場帶來豐厚的利潤。為因應新冠病毒疫情而採取的預防性封鎖和限制措施導致消費需求下降，這將對積體電路(IC)近場通訊市場構成挑戰。

本積體電路 (IC) 近場通訊市場報告詳細介紹了最新發展動態、貿易法規、進出口分析、生產分析、價值鏈優化、市場份額、國內和本地市場參與者的影響，並分析了新興收入來源、市場法規變化、戰略市場增長分析、市場規模、品類市場增長、應用領域和市場主導地位、產品審批、產品發布、地域、地如需了解更多關於積體電路 (IC) 近場通訊市場的信息，請聯繫 Data Bridge 市場研究部門以獲取分析師簡報，我們的團隊將協助您做出明智的市場決策，以實現市場成長。

全球積體電路（IC）近場通訊市場範圍與市場規模

積體電路 (IC) 近場通訊市場根據營運模式和最終用戶進行細分。不同細分市場之間的成長有助於您了解預計在整個市場中普遍存在的不同成長因素，並制定不同的策略，以識別核心應用領域和目標市場的差異。

  • 根據操作模式，積體電路（IC）近場通訊市場分為讀取/寫入模式、點對點模式和卡片模擬模式。
  • 根據最終用戶，積體電路（IC）近場通訊市場細分為零售、運輸、汽車、住宅和商業、醫療保健、消費性電子、銀行和金融、旅館業和其他。零售業細分為門禁控制、產品識別和交易。交通運輸細分為票務和門禁控制。汽車細分為低端、中端和高端。住宅和商業細分為實體訪問、考勤、自動鎖定係統和智慧照明。醫療保健細分為醫療設備和門禁控制。消費性電子細分為穿戴式裝置、手機/平板電腦、筆記型電腦/個人電腦、相機、印表機、遊戲裝置和其他。銀行和金融細分為電子貨幣服務和多外匯卡。酒店業細分為存取控制和交易。其他細分為教育和政府。

積體電路（IC）近場通訊市場國家級分析

對集成電路（IC）近場通訊市場進行了分析，並按上述營運模式和最終用戶提供了市場規模和數量資訊。

積體電路（IC）近場通訊市場報告涵蓋的國家包括北美洲的美國、加拿大和墨西哥，歐洲的德國、法國、英國、荷蘭、瑞士、比利時、俄羅斯、義大利、西班牙、土耳其，歐洲其他地區，中國、日本、印度、韓國、新加坡、馬來西亞、澳洲、泰國、印尼、菲律賓，亞太地區（APAC）的其他地區，沙烏地阿拉伯、阿拉伯聯合大公國、以色列、泰國、印尼、菲律賓，亞太地區（APAC）的其他地區，沙烏地阿拉伯、阿聯酋其他地區的其他地區，AME、AME、AME、AME）。

預計北美將在預測期內主導積體電路 (IC) 近場通訊市場，這得益於該地區在先進技術方面的高投入和發達的網路架構。另一方面，由於 NFC 技術在交通運輸和零售業的應用和認知度不斷提高，亞太地區預計將呈現豐厚的成長。

積體電路 (IC) 近場通訊市場報告的國家部分還提供了各個市場的影響因素以及國內市場監管變化，這些變化會影響市場的當前和未來趨勢。消費量、生產基地和產量、進出口分析、價格趨勢分析、原材料成本、上下游價值鏈分析等數據點是預測各國市場狀況的主要指標。此外，在對國家/地區數據進行預測分析時，還考慮了全球品牌的存在和供應情況，以及它們因本土和國內品牌的激烈競爭或稀缺而面臨的挑戰，國內關稅和貿易路線的影響。

競爭格局與積體電路（IC）近場通訊市場佔有率分析

積體電路 (IC) 近場通訊市場競爭格局提供了按競爭對手劃分的詳細資訊。詳細資訊包括公司概況、公司財務狀況、收入、市場潛力、研發投入、新市場計劃、全球佈局、生產基地和設施、生產能力、公司優勢和劣勢、產品發布、產品寬度和廣度以及應用主導地位。以上提供的數據僅與公司在積體電路 (IC) 近場通訊市場的重點相關。

積體電路 (IC) 近場通訊市場報告涵蓋的主要參與者包括 Broadcom、Identive. Inc、MagTek Inc、NXP Semiconductors、Qualcomm Technologies, Inc、Thales Group、Texas Instruments Incorporated、Telit、STMicroelectronics、Sony Corporation、PolSUNG、Panasonic Incorporated、Telit、STMicroelectronics、Sony Corporation、PolSUNG、Panasonic Corporation Incorporated、Telit、STMicroelectronics、Sony Corporation、PolSUNG、Panasonic Corporation. DENNISON CORPORATION、CCL Industries、Lintec Corporation、Robert Bosch GmbH、Telefonaktiebolaget LM Ericsson 以及其他國內和全球參與者。市佔率數據分別提供全球、北美、歐洲、亞太地區 (APAC)、中東和非洲 (MEA) 和南美。 DBMR 分析師了解競爭優勢，並為每個競爭對手分別提供競爭分析。

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目录

1 INTRODUCTION

1.1 OBJECTIVES OF THE STUDY

1.2 MARKET DEFINITION

1.3 OVERVIEW OF GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET

1.4 CURRENCY AND PRICING

1.5 LIMITATION

1.6 MARKETS COVERED

2 MARKET SEGMENTATION

2.1 KEY TAKEAWAYS

2.2 ARRIVING AT THE GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET

2.2.1 VENDOR POSITIONING GRID

2.2.2 TECHNOLOGY LIFE LINE CURVE

2.2.3 MARKET GUIDE

2.2.4 COMPANY POSITIONING GRID

2.2.5 MULTIVARIATE MODELLING

2.2.6 STANDARDS OF MEASUREMENT

2.2.7 TOP TO BOTTOM ANALYSIS

2.2.8 VENDOR SHARE ANALYSIS

2.2.9 DATA POINTS FROM KEY PRIMARY INTERVIEWS

2.2.10 DATA POINTS FROM KEY SECONDARY DATABASES

2.3 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET: RESEARCH SNAPSHOT

2.4 ASSUMPTIONS

3 MARKET OVERVIEW

3.1 DRIVERS

3.2 RESTRAINTS

3.3 OPPORTUNITIES

3.4 CHALLENGES

4 EXECUTIVE SUMMARY

5 PREMIUM INSIGHTS

5.1 CASE STUDIES

5.2 REGULATORY FRAMEWORK

5.3 TECHNOLOGICAL TRENDS

5.4 PRICING ANALYSIS

5.5 VALUE CHAIN ANALYSIS

6 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET, BY OFFERING

6.1 OVERVIEW

6.2 NON-AUXILIARY PRODUCTS

6.2.1 NFC TAGS

6.2.2 NFC ICS & ANTENNAS

6.2.3 NFC READERS

6.3 AUXILIARY PRODUCTS

6.3.1 NFC SIM/UICC CARDS

6.3.2 NFC MICRO SD CARDS

6.3.3 NFC COVERS

7 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET, BY OPERATING MODE

7.1 OVERVIEW

7.2 READER EMULATION

7.3 CARD EMULATION

7.4 PEER-TO-PEER

8 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET, BY ORGANIZATION SIZE

8.1 OVERVIEW

8.2 SMALL SCALE ORGANIZATIONS

8.3 MEDIUM SCALE ORGANIZATIONS

8.4 LARGE SCALE ORGANIZATIONS

9 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET, BY APPLICATION

9.1 OVERVIEW

9.2 BFSI

9.2.1 BY OFFERING

9.2.1.1. NON-AUXILIARY PRODUCTS

9.2.1.1.1. NFC TAGS

9.2.1.1.2. NFC ICS & ANTENNAS

9.2.1.1.3. NFC READERS

9.2.1.2. AUXILIARY PRODUCTS

9.2.1.2.1. NFC SIM/UICC CARDS

9.2.1.2.2. NFC MICRO SD CARDS

9.2.1.2.3. NFC COVERS

 

9.3 AUTOMOTIVE

9.3.1 BY OFFERING

9.3.1.1. NON-AUXILIARY PRODUCTS

9.3.1.1.1. NFC TAGS

9.3.1.1.2. NFC ICS & ANTENNAS

9.3.1.1.3. NFC READERS

9.3.1.2. AUXILIARY PRODUCTS

9.3.1.2.1. NFC SIM/UICC CARDS

9.3.1.2.2. NFC MICRO SD CARDS

9.3.1.2.3. NFC COVERS

9.4 CONSUMER ELECTRONICS

9.4.1 BY OFFERING

9.4.1.1. NON-AUXILIARY PRODUCTS

9.4.1.1.1. NFC TAGS

9.4.1.1.2. NFC ICS & ANTENNAS

9.4.1.1.3. NFC READERS

9.4.1.2. AUXILIARY PRODUCTS

9.4.1.2.1. NFC SIM/UICC CARDS

9.4.1.2.2. NFC MICRO SD CARDS

9.4.1.2.3. NFC COVERS

9.5 MEDICAL & HEALTHCARE

9.5.1 BY OFFERING

9.5.1.1. NON-AUXILIARY PRODUCTS

9.5.1.1.1. NFC TAGS

9.5.1.1.2. NFC ICS & ANTENNAS

9.5.1.1.3. NFC READERS

9.5.1.2. AUXILIARY PRODUCTS

9.5.1.2.1. NFC SIM/UICC CARDS

9.5.1.2.2. NFC MICRO SD CARDS

9.5.1.2.3. NFC COVERS

9.6 RETAIL

9.6.1 BY OFFERING

9.6.1.1. NON-AUXILIARY PRODUCTS

9.6.1.1.1. NFC TAGS

9.6.1.1.2. NFC ICS & ANTENNAS

9.6.1.1.3. NFC READERS

9.6.1.2. AUXILIARY PRODUCTS

9.6.1.2.1. NFC SIM/UICC CARDS

9.6.1.2.2. NFC MICRO SD CARDS

9.6.1.2.3. NFC COVERS

9.7 TRANSPORTATION & LOGISTICS

9.7.1 BY OFFERING

9.7.1.1. NON-AUXILIARY PRODUCTS

9.7.1.1.1. NFC TAGS

9.7.1.1.2. NFC ICS & ANTENNAS

9.7.1.1.3. NFC READERS

9.7.1.2. AUXILIARY PRODUCTS

9.7.1.2.1. NFC SIM/UICC CARDS

9.7.1.2.2. NFC MICRO SD CARDS

9.7.1.2.3. NFC COVERS

9.8 OTHERS

9.8.1 BY OFFERING

9.8.1.1. NON-AUXILIARY PRODUCTS

9.8.1.1.1. NFC TAGS

9.8.1.1.2. NFC ICS & ANTENNAS

9.8.1.1.3. NFC READERS

9.8.1.2. AUXILIARY PRODUCTS

9.8.1.2.1. NFC SIM/UICC CARDS

9.8.1.2.2. NFC MICRO SD CARDS

9.8.1.2.3. NFC COVERS

10 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET, BY REGION

GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)

10.1 NORTH AMERICA

10.1.1 U.S.

10.1.2 CANADA

10.1.3 MEXICO

 

10.2 EUROPE

10.2.1 GERMANY

10.2.2 FRANCE

10.2.3 U.K.

10.2.4 ITALY

10.2.5 SPAIN

10.2.6 RUSSIA

10.2.7 TURKEY

10.2.8 BELGIUM

10.2.9 NETHERLANDS

10.2.10 SWITZERLAND

10.2.11 REST OF EUROPE

10.3 ASIA PACIFIC

10.3.1 JAPAN

10.3.2 CHINA

10.3.3 SOUTH KOREA

10.3.4 INDIA

10.3.5 AUSTRALIA

10.3.6 SINGAPORE

10.3.7 THAILAND

10.3.8 MALAYSIA

10.3.9 INDONESIA

10.3.10 PHILIPPINES

10.3.11 REST OF ASIA PACIFIC

10.4 SOUTH AMERICA

10.4.1 BRAZIL

10.4.2 ARGENTINA

10.4.3 REST OF SOUTH AMERICA

10.5 MIDDLE EAST AND AFRICA

10.5.1 SOUTH AFRICA

10.5.2 EGYPT

10.5.3 SAUDI ARABIA

10.5.4 U.A.E

10.5.5 ISRAEL

10.5.6 REST OF MIDDLE EAST AND AFRICA

 

11 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET,COMPANY LANDSCAPE

11.1 COMPANY SHARE ANALYSIS: GLOBAL

11.2 COMPANY SHARE ANALYSIS: NORTH AMERICA

11.3 COMPANY SHARE ANALYSIS: EUROPE

11.4 COMPANY SHARE ANALYSIS: ASIA-PACIFIC

11.5 MERGERS & ACQUISITIONS

11.6 NEW PRODUCT DEVELOPMENT AND APPROVALS

11.7 EXPANSIONS

11.8 REGULATORY CHANGES

11.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS

12 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET, SWOT AND DBMR ANALYSIS

13 GLOBAL INTEGRATED CIRCUIT (IC) NEAR FIELD COMMUNICATIONS MARKET, COMPANY PROFILE

13.1 TOSHIBA CORPORATION

13.1.1 COMPANY SNAPSHOT

13.1.2 REVENUE ANALYSIS

13.1.3 GEOGRAPHIC PRESENCE

13.1.4 PRODUCT PORTFOLIO

13.1.5 RECENT DEVELOPMENTS

13.2 BROADCOM CORPORATION

13.2.1 COMPANY SNAPSHOT

13.2.2 REVENUE ANALYSIS

13.2.3 GEOGRAPHIC PRESENCE

13.2.4 PRODUCT PORTFOLIO

13.2.5 RECENT DEVELOPMENTS

13.3 NXP SEMICONDUCTORS

13.3.1 COMPANY SNAPSHOT

13.3.2 REVENUE ANALYSIS

13.3.3 GEOGRAPHIC PRESENCE

13.3.4 PRODUCT PORTFOLIO

13.3.5 RECENT DEVELOPMENTS

13.4 QUALCOMM

13.4.1 COMPANY SNAPSHOT

13.4.2 REVENUE ANALYSIS

13.4.3 GEOGRAPHIC PRESENCE

13.4.4 PRODUCT PORTFOLIO

13.4.5 RECENT DEVELOPMENTS

13.5 AVERY DENNISON

13.5.1 COMPANY SNAPSHOT

13.5.2 REVENUE ANALYSIS

13.5.3 GEOGRAPHIC PRESENCE

13.5.4 PRODUCT PORTFOLIO

13.5.5 RECENT DEVELOPMENTS

13.6 THALES GROUP

13.6.1 COMPANY SNAPSHOT

13.6.2 REVENUE ANALYSIS

13.6.3 GEOGRAPHIC PRESENCE

13.6.4 PRODUCT PORTFOLIO

13.6.5 RECENT DEVELOPMENTS

13.7 INFINEON TECHNOLOGIES

13.7.1 COMPANY SNAPSHOT

13.7.2 REVENUE ANALYSIS

13.7.3 GEOGRAPHIC PRESENCE

13.7.4 PRODUCT PORTFOLIO

13.7.5 RECENT DEVELOPMENTS

13.8 INTEL CORPORATION

13.8.1 COMPANY SNAPSHOT

13.8.2 REVENUE ANALYSIS

13.8.3 GEOGRAPHIC PRESENCE

13.8.4 PRODUCT PORTFOLIO

13.8.5 RECENT DEVELOPMENTS

13.9 RENESAS ELECTRONICS

13.9.1 COMPANY SNAPSHOT

13.9.2 REVENUE ANALYSIS

13.9.3 GEOGRAPHIC PRESENCE

13.9.4 PRODUCT PORTFOLIO

13.9.5 RECENT DEVELOPMENTS

13.1 AMS

13.10.1 COMPANY SNAPSHOT

13.10.2 REVENUE ANALYSIS

13.10.3 GEOGRAPHIC PRESENCE

13.10.4 PRODUCT PORTFOLIO

13.10.5 RECENT DEVELOPMENTS

 

13.11 IDENTISYS

13.11.1 COMPANY SNAPSHOT

13.11.2 REVENUE ANALYSIS

13.11.3 GEOGRAPHIC PRESENCE

13.11.4 PRODUCT PORTFOLIO

13.11.5 RECENT DEVELOPMENTS

13.12 SONY CORPORATION

13.12.1 COMPANY SNAPSHOT

13.12.2 REVENUE ANALYSIS

13.12.3 GEOGRAPHIC PRESENCE

13.12.4 PRODUCT PORTFOLIO

13.12.5 RECENT DEVELOPMENTS

13.13 FLOMIO

13.13.1 COMPANY SNAPSHOT

13.13.2 REVENUE ANALYSIS

13.13.3 GEOGRAPHIC PRESENCE

13.13.4 PRODUCT PORTFOLIO

13.13.5 RECENT DEVELOPMENTS

13.14 PANTHRONICS

13.14.1 COMPANY SNAPSHOT

13.14.2 REVENUE ANALYSIS

13.14.3 GEOGRAPHIC PRESENCE

13.14.4 PRODUCT PORTFOLIO

13.14.5 RECENT DEVELOPMENTS

13.15 STMICROELECTRONICS

13.15.1 COMPANY SNAPSHOT

13.15.2 REVENUE ANALYSIS

13.15.3 GEOGRAPHIC PRESENCE

13.15.4 PRODUCT PORTFOLIO

13.15.5 RECENT DEVELOPMENTS

13.16 TEXAS INSTRUMENTS

13.16.1 COMPANY SNAPSHOT

13.16.2 REVENUE ANALYSIS

13.16.3 GEOGRAPHIC PRESENCE

13.16.4 PRODUCT PORTFOLIO

13.16.5 RECENT DEVELOPMENTS

 

13.17 IDENTIV

13.17.1 COMPANY SNAPSHOT

13.17.2 REVENUE ANALYSIS

13.17.3 GEOGRAPHIC PRESENCE

13.17.4 PRODUCT PORTFOLIO

13.17.5 RECENT DEVELOPMENTS

13.18 SAMSUNG CO LTD

13.18.1 COMPANY SNAPSHOT

13.18.2 REVENUE ANALYSIS

13.18.3 GEOGRAPHIC PRESENCE

13.18.4 PRODUCT PORTFOLIO

13.18.5 RECENT DEVELOPMENTS

13.19 MAGTEK

13.19.1 COMPANY SNAPSHOT

13.19.2 REVENUE ANALYSIS

13.19.3 GEOGRAPHIC PRESENCE

13.19.4 PRODUCT PORTFOLIO

13.19.5 RECENT DEVELOPMENTS

13.2 HID GLOBAL

13.20.1 COMPANY SNAPSHOT

13.20.2 REVENUE ANALYSIS

13.20.3 GEOGRAPHIC PRESENCE

13.20.4 PRODUCT PORTFOLIO

13.20.5 RECENT DEVELOPMENTS

NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDIES AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST.

14 CONCLUSION

15 QUESTIONNAIRE

16 RELATED REPORTS

17 ABOUT DATA BRIDGE MARKET RESEARCH

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研究方法

数据收集和基准年分析是使用具有大样本量的数据收集模块完成的。该阶段包括通过各种来源和策略获取市场信息或相关数据。它包括提前检查和规划从过去获得的所有数据。它同样包括检查不同信息源中出现的信息不一致。使用市场统计和连贯模型分析和估计市场数据。此外，市场份额分析和关键趋势分析是市场报告中的主要成功因素。要了解更多信息，请请求分析师致电或下拉您的询问。

DBMR 研究团队使用的关键研究方法是数据三角测量，其中包括数据挖掘、数据变量对市场影响的分析和主要（行业专家）验证。数据模型包括供应商定位网格、市场时间线分析、市场概览和指南、公司定位网格、专利分析、定价分析、公司市场份额分析、测量标准、全球与区域和供应商份额分析。要了解有关研究方法的更多信息，请向我们的行业专家咨询。

可定制

Data Bridge Market Research 是高级形成性研究领域的领导者。我们为向现有和新客户提供符合其目标的数据和分析而感到自豪。报告可定制，包括目标品牌的价格趋势分析、了解其他国家的市场（索取国家列表）、临床试验结果数据、文献综述、翻新市场和产品基础分析。目标竞争对手的市场分析可以从基于技术的分析到市场组合策略进行分析。我们可以按照您所需的格式和数据样式添加您需要的任意数量的竞争对手数据。我们的分析师团队还可以为您提供原始 Excel 文件数据透视表（事实手册）中的数据，或者可以帮助您根据报告中的数据集创建演示文稿。

Frequently Asked Questions

市场是基于 全球積體電路 (IC)近場通訊市場，依操作模式（讀/寫模式、點對點模式、卡片模擬模式）、最終用戶（零售、運輸、汽車、住宅和商業、醫療和保健、消費電子、銀行和金融、酒店、其他）、國家（美國、加拿大、墨西哥、巴西、阿根廷、南美洲其他地區、德國、法國、義大利、英國、比利時、西班牙、俄羅斯、土耳其、荷蘭、瑞士、歐洲其他地區、日本、中國、印度、韓國、澳洲、新加坡、馬來西亞、泰國、印尼、菲律賓、亞太其他地區、阿聯酋、沙烏地阿拉伯、埃及、南非、以色列、中東和非洲其他地區）產業趨勢與預測到2028 年。 进行细分的。
在2021年，全球積體電路（IC）近場通訊市場的规模估计为0.00 USD Million美元。
全球積體電路（IC）近場通訊市場预计将在2022年至2028年的预测期内以CAGR 0%的速度增长。
市场上的主要参与者包括Broadcom, Identive. Inc, MagTek Inc, NXP Semiconductors, Qualcomm TechnologiesInc, Thales Group, Texas Instruments Incorporated,Telit, STMicroelectronics, Sony Corporation, SAMSUNG, Panasonic Corporation, Alpine Electronics Inc., Polaris. Inc., FeliCa Networks. Inc, 3M, AVERY DENNISON CORPORATION, CCL Industries, Lintec Corporation, Robert Bosch GmbH , Telefonaktiebolaget LM Ericsson。

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