سوق أشباه الموصلات العالمي للسيارات - اتجاهات الصناعة والتوقعات حتى عام 2029

1 INTRODUCTION

1.1 OBJECTIVES OF THE STUDY

1.2 MARKET DEFINITION

1.3 OVERVIEW OF GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET

1.4 CURRENCY AND PRICING

1.5 LIMITATION

1.6 MARKETS COVERED

2 MARKET SEGMENTATION

2.1 KEY TAKEAWAYS

2.2 ARRIVING AT THE GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET

2.3 VENDOR POSITIONING GRID

2.4 TECHNOLOGY LIFE LINE CURVE

2.5 MARKET GUIDE

2.6 MULTIVARIATE MODELLING

2.7 TOP TO BOTTOM ANALYSIS

2.8 STANDARDS OF MEASUREMENT

2.9 VENDOR SHARE ANALYSIS

2.1 DATA POINTS FROM KEY PRIMARY INTERVIEWS

2.11 DATA POINTS FROM KEY SECONDARY DATABASES

2.12 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET: RESEARCH SNAPSHOT

2.13 ASSUMPTIONS

3 MARKET OVERVIEW

3.1 DRIVERS

3.2 RESTRAINTS

3.3 OPPORTUNITIES

3.4 CHALLENGES

4 EXECUTIVE SUMMARY

5 PREMIUM INSIGHTS

5.1 PORTERS FIVE FORCES

5.2 REGULATORY STANDARDS

5.3 TECHNOLOGICAL TRENDS

5.4 GROWTH SECTOR IN AUTOMOTIVE INDUSTRY

5.4.1 ELECTRIC VEHICLE

5.4.2 AUTONOMOUS VEHICLE

5.4.3 CONNECTED VEHICLE

5.4.4 MOBILITY AS A SERVICE

5.5 VALUE CHAIN ANALYSIS

5.6 PATENT ANALYSIS

5.7 COMPANY COMPARITIVE ANALYSIS

6 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY COMPONENT

6.1 OVERVIEW

6.2 PROCESSOR

6.2.1 MICROPROCESSOR UNITS (MPUS)

6.2.2 MICROCONTROLLER UNITS (MCUS)

6.2.3 DIGITAL SIGNAL PROCESSORS (DSPS)

6.2.4 GRAPHIC PROCESSING UNITS (GPUS)

6.3 ANALOG IC

6.3.1 ASICS AND ASSPS

6.3.2 AMPLIFIERS

6.3.3 INTERFACES

6.3.4 LOGIC ICS

6.3.5 CONVERTORS

6.3.6 COMPARATORS

6.3.7 INFOTAINMENTS, TELEMATICS, AND CONNECTIVITY DEVICES

6.4 DISCRETE POWER DEVICES

6.4.1 POWER TRANSISTORS

6.4.2 SMALL SIGNAL TRANSISTORS

6.4.3 RECTIFIERS AND DIODES

6.4.4 THYRISTORS

6.5 SENSOR

6.5.1 IMAGE SENSORS

6.5.1.1. COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSORS

6.5.1.2. CHARGE-COUPLED DEVICES (CCDS)

6.5.2 INERTIAL SENSORS

6.5.2.1. ACCELEROMETERS

6.5.2.2. GYROSCOPES

6.5.3 PRESSURE SENSORS

6.5.4 TEMPERATURE SENSORS

6.5.5 RADARS

6.5.6 OTHERS

6.6 MEMORY DEVICE

6.6.1 DYNAMIC RANDOM-ACCESS MEMORY (DRAM)

6.6.2 STATIC RANDOM-ACCESS MEMORY (SRAM)

6.7 LIGHTING DEVICE

7 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY FUEL TYPE

7.1 OVERVIEW

7.2 GASOLINE

7.3 DIESEL

7.4 ELECTRIC VEHICLE

7.4.1 BATTERY ELECTRIC VEHICLE (BEV)

7.4.2 HYBRID ELECTRIC VEHICLE (HEV)

7.4.3 PLUG-IN HYBRID ELECTRIC VEHICLE (PHEV)

8 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY VEHICLE TYPE

8.1 OVERVIEW

8.2 PASSENGER CAR

8.2.1 PROCESSOR

8.2.1.1. MICROPROCESSOR UNITS (MPUS)

8.2.1.2. MICROCONTROLLER UNITS (MCUS)

8.2.1.3. DIGITAL SIGNAL PROCESSORS (DSPS)

8.2.1.4. GRAPHIC PROCESSING UNITS (GPUS)

8.2.2 ANALOG IC

8.2.2.1. AMPLIFIERS

8.2.2.2. INTERFACES

8.2.2.3. CONVERTORS

8.2.2.4. COMPARATORS

8.2.2.5. ASICS AND ASSPS

8.2.2.6. LOGIC ICS

8.2.2.7. INFOTAINMENTS, TELEMATICS, AND CONNECTIVITY DEVICES

8.2.3 DISCRETE POWER DEVICES

8.2.3.1. SMALL SIGNAL TRANSISTORS

8.2.3.2. POWER TRANSISTORS

8.2.3.3. THYRISTORS

8.2.3.4. RECTIFIERS AND DIODES

8.2.4 SENSOR

8.2.4.1. IMAGE SENSORS

8.2.4.1.1. COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSORS

8.2.4.1.2. CHARGE-COUPLED DEVICES (CCDS)

8.2.4.2. PRESSURE SENSORS

8.2.4.3. INERTIAL SENSORS

8.2.4.3.1. ACCELEROMETERS

8.2.4.3.2. GYROSCOPES

8.2.4.4. TEMPERATURE SENSORS

8.2.4.5. RADARS

8.2.5 MEMORY DEVICE

8.2.5.1. DYNAMIC RANDOM-ACCESS MEMORY (DRAM)

8.2.5.2. STATIC RANDOM-ACCESS MEMORY (SRAM)

8.2.6 LIGHTING DEVICE

8.3 LIGHT COMMERCIAL VEHICLE (LCV)

8.3.1 PROCESSOR

8.3.1.1. MICROPROCESSOR UNITS (MPUS)

8.3.1.2. MICROCONTROLLER UNITS (MCUS)

8.3.1.3. DIGITAL SIGNAL PROCESSORS (DSPS)

8.3.1.4. GRAPHIC PROCESSING UNITS (GPUS)

8.3.2 ANALOG IC

8.3.2.1. AMPLIFIERS

8.3.2.2. INTERFACES

8.3.2.3. CONVERTORS

8.3.2.4. COMPARATORS

8.3.2.5. ASICS AND ASSPS

8.3.2.6. LOGIC ICS

8.3.2.7. INFOTAINMENTS, TELEMATICS, AND CONNECTIVITY DEVICES

8.3.3 DISCRETE POWER DEVICES

8.3.3.1. SMALL SIGNAL TRANSISTORS

8.3.3.2. POWER TRANSISTORS

8.3.3.3. THYRISTORS

8.3.3.4. RECTIFIERS AND DIODES

8.3.4 SENSOR

8.3.4.1. IMAGE SENSORS

8.3.4.1.1. COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSORS

8.3.4.1.2. CHARGE-COUPLED DEVICES (CCDS)

8.3.4.2. PRESSURE SENSORS

8.3.4.3. INERTIAL SENSORS

8.3.4.3.1. ACCELEROMETERS

8.3.4.3.2. GYROSCOPES

8.3.4.4. TEMPERATURE SENSORS

8.3.4.5. RADARS

8.3.5 MEMORY DEVICE

8.3.5.1. DYNAMIC RANDOM-ACCESS MEMORY (DRAM)

8.3.5.2. STATIC RANDOM-ACCESS MEMORY (SRAM)

8.3.6 LIGHTING DEVICE

8.4 HEAVY COMMERCIAL VEHICLE (HCV)

8.4.1 PROCESSOR

8.4.1.1. MICROPROCESSOR UNITS (MPUS)

8.4.1.2. MICROCONTROLLER UNITS (MCUS)

8.4.1.3. DIGITAL SIGNAL PROCESSORS (DSPS)

8.4.1.4. GRAPHIC PROCESSING UNITS (GPUS)

8.4.2 ANALOG IC

8.4.2.1. AMPLIFIERS

8.4.2.2. INTERFACES

8.4.2.3. CONVERTORS

8.4.2.4. COMPARATORS

8.4.2.5. ASICS AND ASSPS

8.4.2.6. LOGIC ICS

8.4.2.7. INFOTAINMENTS, TELEMATICS, AND CONNECTIVITY DEVICES

8.4.3 DISCRETE POWER DEVICES

8.4.3.1. SMALL SIGNAL TRANSISTORS

8.4.3.2. POWER TRANSISTORS

8.4.3.3. THYRISTORS

8.4.3.4. RECTIFIERS AND DIODES

8.4.4 SENSOR

8.4.4.1. IMAGE SENSORS

8.4.4.1.1. COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSORS

8.4.4.1.2. CHARGE-COUPLED DEVICES (CCDS)

8.4.4.2. PRESSURE SENSORS

8.4.4.3. INERTIAL SENSORS

8.4.4.3.1. ACCELEROMETERS

8.4.4.3.2. GYROSCOPES

8.4.4.4. TEMPERATURE SENSORS

8.4.4.5. RADARS

8.4.5 MEMORY DEVICE

8.4.5.1. DYNAMIC RANDOM-ACCESS MEMORY (DRAM)

8.4.5.2. STATIC RANDOM-ACCESS MEMORY (SRAM)

8.4.6 LIGHTING DEVICE

9 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY APPLICATION

9.1 OVERVIEW

9.2 POWERTRAIN

9.2.1 STARTER/ALTERNATOR

9.2.2 TRANSMISSION CONTROL UNIT

9.2.3 ENGINE CONTROL UNIT

9.3 SAFETY

9.3.1 AIR BAG

9.3.2 ADAPTIVE CRUISE CONTROL

9.3.3 PARKING ASSISTANCE

9.3.4 NIGHT VISION

9.3.5 ELECTRONIC SAFETY CONTROL

9.3.6 OTHERS

9.4 TELEMATICS AND INFOTAINMENT

9.4.1 NAVIGATION UNIT

9.4.2 AUDIO UNIT

9.4.3 DISPLAY UNIT

9.4.4 WIDE & SHORT RANGE COMMUNICATION

9.4.5 DASHBOARDS

9.4.6 INSTRUMENT CLUSTER

9.4.6.1. ANALOG

9.4.6.2. DIGITAL

9.4.6.3. HYBRID

9.5 BODY ELECTRONICS

9.5.1 BODY CONTROL MODULES

9.5.2 MIRROR AND WINDOW CONTROL

9.5.3 HVAC SYSTEM

9.5.4 LOGHT, LIGHTING CONTROL

9.5.5 POWER OPERATED SYSTEM (SEAT & DOOR)

9.5.6 OTHERS

9.6 CHASSIS

9.6.1 SUSPENSION

9.6.2 STEERING

9.6.3 VEHICLE DYNAMIC MANAGEMENT

9.6.4 TRACTION CONTROL

9.6.5 BRAKES

10 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY SALES CHANNEL

10.1 OVERVIEW

10.2 DIRECT SALES

10.3 INDIRECT SALES

11 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY GEOGRAPHY

GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)

11.1 NORTH AMERICA

11.1.1 U.S.

11.1.2 CANADA

11.1.3 MEXICO

11.2 EUROPE

11.2.1 GERMANY

11.2.2 FRANCE

11.2.3 U.K.

11.2.4 ITALY

11.2.5 SPAIN

11.2.6 RUSSIA

11.2.7 TURKEY

11.2.8 BELGIUM

11.2.9 NETHERLANDS

11.2.10 SWITZERLAND

11.2.11 SWEDEN

11.2.12 DENMARK

11.2.13 POLAND

11.2.14 REST OF EUROPE

11.3 ASIA PACIFIC

11.3.1 JAPAN

11.3.2 CHINA

11.3.3 SOUTH KOREA

11.3.4 INDIA

11.3.5 AUSTRALIA AND NEW ZEALAND

11.3.6 SINGAPORE

11.3.7 THAILAND

11.3.8 MALAYSIA

11.3.9 INDONESIA

11.3.10 PHILIPPINES

11.3.11 TAIWAN

11.3.12 VIETNAM

11.3.13 REST OF ASIA PACIFIC

11.4 SOUTH AMERICA

11.4.1 BRAZIL

11.4.2 ARGENTINA

11.4.3 REST OF SOUTH AMERICA

11.5 MIDDLE EAST AND AFRICA

11.5.1 SOUTH AFRICA

11.5.2 EGYPT

11.5.3 SAUDI ARABIA

11.5.4 U.A.E

11.5.5 ISRAEL

11.5.6 KUWAIT

11.5.7 QATAR

11.5.8 REST OF MIDDLE EAST AND AFRICA

11.6 KEY PRIMARY INSIGHTS: BY MAJOR COUNTRIES

12 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET,COMPANY LANDSCAPE

12.1 COMPANY SHARE ANALYSIS: GLOBAL

12.2 COMPANY SHARE ANALYSIS: NORTH AMERICA

12.3 COMPANY SHARE ANALYSIS: EUROPE

12.4 COMPANY SHARE ANALYSIS: ASIA PACIFIC

12.5 MERGERS & ACQUISITIONS

12.6 NEW PRODUCT DEVELOPMENT AND APPROVALS

12.7 EXPANSIONS

12.8 REGULATORY CHANGES

12.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS

13 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET , SWOT & DBMR ANALYSIS

14 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, COMPANY PROFILE

14.1 NXP SEMICONDUCTORS N.V.

14.1.1 COMPANY SNAPSHOT

14.1.2 REVENUE ANALYSIS

14.1.3 PRODUCT PORTFOLIO

14.1.4 RECENT DEVELOPMENTS

14.2 RENESAS ELECTRONICS CORP.

14.2.1 COMPANY SNAPSHOT

14.2.2 REVENUE ANALYSIS

14.2.3 PRODUCT PORTFOLIO

14.2.4 RECENT DEVELOPMENTS

14.3 INFINEON TECHNOLOGIES AG

14.3.1 COMPANY SNAPSHOT

14.3.2 REVENUE ANALYSIS

14.3.3 PRODUCT PORTFOLIO

14.3.4 RECENT DEVELOPMENTS

14.4 STMICROELECTRONICS N.V.

14.4.1 COMPANY SNAPSHOT

14.4.2 REVENUE ANALYSIS

14.4.3 PRODUCT PORTFOLIO

14.4.4 RECENT DEVELOPMENTS

14.5 ROBERT BOSCH GMBH

14.5.1 COMPANY SNAPSHOT

14.5.2 REVENUE ANALYSIS

14.5.3 PRODUCT PORTFOLIO

14.5.4 RECENT DEVELOPMENTS

14.6 TEXAS INSTRUMENTS INC.

14.6.1 COMPANY SNAPSHOT

14.6.2 REVENUE ANALYSIS

14.6.3 PRODUCT PORTFOLIO

14.6.4 RECENT DEVELOPMENTS

14.7 SEMICONDUCTOR CORP.

14.7.1 COMPANY SNAPSHOT

14.7.2 REVENUE ANALYSIS

14.7.3 PRODUCT PORTFOLIO

14.7.4 RECENT DEVELOPMENTS

14.8 ON SEMICONDUCTORS CORP.

14.8.1 COMPANY SNAPSHOT

14.8.2 REVENUE ANALYSIS

14.8.3 PRODUCT PORTFOLIO

14.8.4 RECENT DEVELOPMENTS

14.9 ROHM CO. LTD.

14.9.1 COMPANY SNAPSHOT

14.9.2 REVENUE ANALYSIS

14.9.3 PRODUCT PORTFOLIO

14.9.4 RECENT DEVELOPMENTS

14.1 TOSHIBA CORPORATION

14.10.1 COMPANY SNAPSHOT

14.10.2 REVENUE ANALYSIS

14.10.3 PRODUCT PORTFOLIO

14.10.4 RECENT DEVELOPMENTS

14.11 ANALOG DEVICES INC.

14.11.1 COMPANY SNAPSHOT

14.11.2 REVENUE ANALYSIS

14.11.3 PRODUCT PORTFOLIO

14.11.4 RECENT DEVELOPMENTS

14.12 MITSUBISHI ELECTRIC SOLUTIONS

14.12.1 COMPANY SNAPSHOT

14.12.2 REVENUE ANALYSIS

14.12.3 PRODUCT PORTFOLIO

14.12.4 RECENT DEVELOPMENTS

14.13 SAMSUNG

14.13.1 COMPANY SNAPSHOT

14.13.2 REVENUE ANALYSIS

14.13.3 PRODUCT PORTFOLIO

14.13.4 RECENT DEVELOPMENTS

14.14 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

14.14.1 COMPANY SNAPSHOT

14.14.2 REVENUE ANALYSIS

14.14.3 PRODUCT PORTFOLIO

14.14.4 RECENT DEVELOPMENTS

14.15 INTEL CORPORATION

14.15.1 COMPANY SNAPSHOT

14.15.2 REVENUE ANALYSIS

14.15.3 PRODUCT PORTFOLIO

14.15.4 RECENT DEVELOPMENTS

14.16 BROADCOM INC.

14.16.1 COMPANY SNAPSHOT

14.16.2 REVENUE ANALYSIS

14.16.3 PRODUCT PORTFOLIO

14.16.4 RECENT DEVELOPMENTS

14.17 ASE

14.17.1 COMPANY SNAPSHOT

14.17.2 REVENUE ANALYSIS

14.17.3 PRODUCT PORTFOLIO

14.17.4 RECENT DEVELOPMENTS

14.18 NANJING SEMIDRIVE TECHNOLOGY LTD.

14.18.1 COMPANY SNAPSHOT

14.18.2 REVENUE ANALYSIS

14.18.3 PRODUCT PORTFOLIO

14.18.4 RECENT DEVELOPMENTS

14.19 CALTERAH SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO., LTD.

14.19.1 COMPANY SNAPSHOT

14.19.2 REVENUE ANALYSIS

14.19.3 PRODUCT PORTFOLIO

14.19.4 RECENT DEVELOPMENTS

14.2 LATTICE SEMICONDUCTOR

14.20.1 COMPANY SNAPSHOT

14.20.2 REVENUE ANALYSIS

14.20.3 PRODUCT PORTFOLIO

14.20.4 RECENT DEVELOPMENTS

14.21 SK HYNIX INC.

14.21.1 COMPANY SNAPSHOT

14.21.2 REVENUE ANALYSIS

14.21.3 PRODUCT PORTFOLIO

14.21.4 RECENT DEVELOPMENTS

14.22 QUALCOMM TECHNOLOGIES

14.22.1 COMPANY SNAPSHOT

14.22.2 REVENUE ANALYSIS

14.22.3 PRODUCT PORTFOLIO

14.22.4 RECENT DEVELOPMENTS

14.23 MICRON TECHNOLOGY INC.

14.23.1 COMPANY SNAPSHOT

14.23.2 REVENUE ANALYSIS

14.23.3 PRODUCT PORTFOLIO

14.23.4 RECENT DEVELOPMENTS

14.24 MICROCHIP TECHNOLOGY INCORPORATED

14.24.1 COMPANY SNAPSHOT

14.24.2 REVENUE ANALYSIS

14.24.3 PRODUCT PORTFOLIO

14.24.4 RECENT DEVELOPMENTS

14.25 NVIDIA CORPORATION

14.25.1 COMPANY SNAPSHOT

14.25.2 REVENUE ANALYSIS

14.25.3 PRODUCT PORTFOLIO

14.25.4 RECENT DEVELOPMENTS

*NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDY AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST

15 RELATED REPORTS

16 QUESTIONNAIRE

17 ABOUT DATA BRIDGE MARKET RESEARCH