السوق العالمية لمقابس متحكمات الحزمة الرباعية المسطحة (QFP) - اتجاهات الصناعة والتوقعات حتى عام 2030

1 INTRODUCTION

1.1 OBJECTIVES OF THE STUDY

1.2 MARKET DEFINITION

1.3 OVERVIEW OF GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET

1.4 CURRENCY AND PRICING

1.5 LIMITATION

1.6 MARKETS COVERED

2 MARKET SEGMENTATION

2.1 KEY TAKEAWAYS

2.2 ARRIVING AT THE GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET

2.2.1 VENDOR POSITIONING GRID

2.2.2 TECHNOLOGY LIFE LINE CURVE

2.2.3 MARKET GUIDE

2.2.4 COMPANY POSITIONING GRID

2.2.5 COMAPANY MARKET SHARE ANALYSIS

2.2.6 MULTIVARIATE MODELLING

2.2.7 TOP TO BOTTOM ANALYSIS

2.2.8 STANDARDS OF MEASUREMENT

2.2.9 VENDOR SHARE ANALYSIS

2.2.10 DATA POINTS FROM KEY PRIMARY INTERVIEWS

2.2.11 DATA POINTS FROM KEY SECONDARY DATABASES

2.3 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET: RESEARCH SNAPSHOT

2.4 ASSUMPTIONS

3 MARKET OVERVIEW

3.1 DRIVERS

3.2 RESTRAINTS

3.3 OPPORTUNITIES

3.4 CHALLENGES

4 EXECUTIVE SUMMARY

5 PREMIUM INSIGHT

5.1 PORTERS FIVE FORCES

5.2 REGULATORY STANDARDS

5.3 TECHNOLOGICAL TRENDS

5.4 PATENT ANALYSIS

5.5 CASE STUDY

5.6 VALUE CHAIN ANALYSIS

5.7 COMPANY COMPARITIVE ANALYSIS

5.8 PRICING ANALYSIS

6 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY TYPE

6.1 OVERVIEW

6.2 THIN QUAD FLAT PACK (TQFP)

6.2.1 BY BODY SIZE

6.2.1.1. UPTO 5 SQ. MM.

6.2.1.2. 5 SQ. MM. TO 15 SQ. MM.

6.2.1.3. 15 SQ. MM. & ABOVE

6.2.2 BY LEAD PITCH

6.2.2.1. 0.4 MM

6.2.2.2. 0.5 MM

6.2.2.3. 0.65 MM

6.2.2.4. 0.8 MM

6.2.2.5. 1.0 MM

6.2.3 BY LEAD COUNT RANGE

6.2.3.1. UPTO 32

6.2.3.2. 32 TO 64

6.2.3.3. 64 TO 128

6.2.3.4. 128 & ABOVE

6.3 LOW PROFILE QUAD FLAT PACK (LQFP)

6.3.1 BY BODY SIZE

6.3.1.1. UPTO 7 SQ. MM.

6.3.1.2. 7 SQ. MM. TO 14 SQ. MM.

6.3.1.3. 14 SQ. MM. & ABOVE

6.3.2 BY LEAD PITCH

6.3.2.1. 0.4 MM

6.3.2.2. 0.5 MM

6.3.2.3. 0.6 MM

6.3.2.4. 0.8 MM

6.3.3 BY LEAD COUNT RANGE

6.3.3.1. UPTO 40

6.3.3.2. 04 TO 100

6.3.3.3. 100 TO 200

6.3.3.4. 200 & ABOVE

6.4 METRIC QUAD FLAT PACK (MQFP)

6.4.1 BY BODY SIZE

6.4.1.1. UPTO 10 SQ.MM

6.4.1.2. 10 SQ. MM. TO 14 SQ. MM.

6.4.1.3. 14 SQ.MM TO 28 SQ.MM

6.4.1.4. 28 SQ. MM. & ABOVE

6.4.2 BY LEAD PITCH

6.4.2.1. 0.5 MM

6.4.2.2. 0.6 MM

6.4.2.3. 0.8 MM

6.4.3 BY LEAD COUNT RANGE

6.4.3.1. UPTO 44

6.4.3.2. 44 TO 120

6.4.3.3. 120 TO 200

6.4.3.4. 200 & ABOVE

6.5 BUMPERED QUAD FLAT PACK PACKAGES（BQFP)

6.6 OTHERS

7 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY SUBSTRATES

7.1 OVERVIEW

7.2 PLASTIC

7.3 CERAMIC

7.4 METAL

8 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY PACKAGE TYPE

8.1 OVERVIEW

8.2 QFP32

8.3 QFP64

8.4 QFP100

8.5 QFP144

8.6 QFP208

8.7 OTHERS

9 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY TECHNOLOGY

9.1 OVERVIEW

9.2 SURFACE MOUNT TECHNOLOGY

9.3 THROUGH-HOLE TECHNOLOGY

10 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY SALES CHANNEL

10.1 OVERVIEW

10.2 OEM

10.3 AFTERMARKET

11 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY DISTRIBUTION CHANNEL

11.1 OVERVIEW

11.2 DIRECT SALES

11.3 INDIRECT SALES

12 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY APPLICATION

12.1 OVERVIEW

12.2 CONSUMER ELECTRONICS

12.2.1 BY TYPE

12.2.1.1. THIN QUAD FLAT PACK (TQFP)

12.2.1.1.1. BY BODY SIZE

12.2.1.1.1.1 UPTO 5 SQ. MM.

12.2.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.

12.2.1.1.1.3 15 SQ. MM. & ABOVE

12.2.1.1.2. BY LEAD PITCH

12.2.1.1.2.1 0.4 MM

12.2.1.1.2.2 0.5 MM

12.2.1.1.2.3 0.65 MM

12.2.1.1.2.4 0.8 MM

12.2.1.1.2.5 1.0 MM

12.2.1.1.3. BY LEAD COUNT RANGE

12.2.1.1.3.1 UPTO 32

12.2.1.1.3.2 32 TO 64

12.2.1.1.3.3 64 TO 128

12.2.1.1.3.4 128 & ABOVE

12.2.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)

12.2.1.2.1. BY BODY SIZE

12.2.1.2.1.1 UPTO 7 SQ. MM.

12.2.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.

12.2.1.2.1.3 14 SQ. MM. & ABOVE

12.2.1.2.2. BY LEAD PITCH

12.2.1.2.2.1 0.4 MM

12.2.1.2.2.2 0.5 MM

12.2.1.2.2.3 0.6 MM

12.2.1.2.2.4 0.8 MM

12.2.1.2.3. BY LEAD COUNT RANGE

12.2.1.2.3.1 UPTO 40

12.2.1.2.3.2 04 TO 100

12.2.1.2.3.3 100 TO 200

12.2.1.2.3.4 200 & ABOVE

12.2.1.3. METRIC QUAD FLAT PACK (MQFP)

12.2.1.3.1. BY BODY SIZE

12.2.1.3.1.1 UPTO 10 SQ.MM

12.2.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.

12.2.1.3.1.3 14 SQ.MM TO 28 SQ.MM

12.2.1.3.1.4 28 SQ. MM. & ABOVE

12.2.1.3.2. BY LEAD PITCH

12.2.1.3.2.1 0.5 MM

12.2.1.3.2.2 0.6 MM

12.2.1.3.2.3 0.8 MM

12.2.1.3.3. BY LEAD COUNT RANGE

12.2.1.3.3.1 UPTO 44

12.2.1.3.3.2 44 TO 120

12.2.1.3.3.3 120 TO 200

12.2.1.3.3.4 200 & ABOVE

12.2.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)

12.2.1.5. OTHERS

12.3 AUTOMOTIVE

12.3.1 BY TYPE

12.3.1.1. THIN QUAD FLAT PACK (TQFP)

12.3.1.1.1. BY BODY SIZE

12.3.1.1.1.1 UPTO 5 SQ. MM.

12.3.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.

12.3.1.1.1.3 15 SQ. MM. & ABOVE

12.3.1.1.2. BY LEAD PITCH

12.3.1.1.2.1 0.4 MM

12.3.1.1.2.2 0.5 MM

12.3.1.1.2.3 0.65 MM

12.3.1.1.2.4 0.8 MM

12.3.1.1.2.5 1.0 MM

12.3.1.1.3. BY LEAD COUNT RANGE

12.3.1.1.3.1 UPTO 32

12.3.1.1.3.2 32 TO 64

12.3.1.1.3.3 64 TO 128

12.3.1.1.3.4 128 & ABOVE

12.3.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)

12.3.1.2.1. BY BODY SIZE

12.3.1.2.1.1 UPTO 7 SQ. MM.

12.3.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.

12.3.1.2.1.3 14 SQ. MM. & ABOVE

12.3.1.2.2. BY LEAD PITCH

12.3.1.2.2.1 0.4 MM

12.3.1.2.2.2 0.5 MM

12.3.1.2.2.3 0.6 MM

12.3.1.2.2.4 0.8 MM

12.3.1.2.3. BY LEAD COUNT RANGE

12.3.1.2.3.1 UPTO 40

12.3.1.2.3.2 04 TO 100

12.3.1.2.3.3 100 TO 200

12.3.1.2.3.4 200 & ABOVE

12.3.1.3. METRIC QUAD FLAT PACK (MQFP)

12.3.1.3.1. BY BODY SIZE

12.3.1.3.1.1 UPTO 10 SQ.MM

12.3.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.

12.3.1.3.1.3 14 SQ.MM TO 28 SQ.MM

12.3.1.3.1.4 28 SQ. MM. & ABOVE

12.3.1.3.2. BY LEAD PITCH

12.3.1.3.2.1 0.5 MM

12.3.1.3.2.2 0.6 MM

12.3.1.3.2.3 0.8 MM

12.3.1.3.3. BY LEAD COUNT RANGE

12.3.1.3.3.1 UPTO 44

12.3.1.3.3.2 44 TO 120

12.3.1.3.3.3 120 TO 200

12.3.1.3.3.4 200 & ABOVE

12.3.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)

12.3.1.5. OTHERS

12.4 INDUSTRIAL

12.4.1 BY TYPE

12.4.1.1. THIN QUAD FLAT PACK (TQFP)

12.4.1.1.1. BY BODY SIZE

12.4.1.1.1.1 UPTO 5 SQ. MM.

12.4.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.

12.4.1.1.1.3 15 SQ. MM. & ABOVE

12.4.1.1.2. BY LEAD PITCH

12.4.1.1.2.1 0.4 MM

12.4.1.1.2.2 0.5 MM

12.4.1.1.2.3 0.65 MM

12.4.1.1.2.4 0.8 MM

12.4.1.1.2.5 1.0 MM

12.4.1.1.3. BY LEAD COUNT RANGE

12.4.1.1.3.1 UPTO 32

12.4.1.1.3.2 32 TO 64

12.4.1.1.3.3 64 TO 128

12.4.1.1.3.4 128 & ABOVE

12.4.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)

12.4.1.2.1. BY BODY SIZE

12.4.1.2.1.1 UPTO 7 SQ. MM.

12.4.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.

12.4.1.2.1.3 14 SQ. MM. & ABOVE

12.4.1.2.2. BY LEAD PITCH

12.4.1.2.2.1 0.4 MM

12.4.1.2.2.2 0.5 MM

12.4.1.2.2.3 0.6 MM

12.4.1.2.2.4 0.8 MM

12.4.1.2.3. BY LEAD COUNT RANGE

12.4.1.2.3.1 UPTO 40

12.4.1.2.3.2 04 TO 100

12.4.1.2.3.3 100 TO 200

12.4.1.2.3.4 200 & ABOVE

12.4.1.3. METRIC QUAD FLAT PACK (MQFP)

12.4.1.3.1. BY BODY SIZE

12.4.1.3.1.1 UPTO 10 SQ.MM

12.4.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.

12.4.1.3.1.3 14 SQ.MM TO 28 SQ.MM

12.4.1.3.1.4 28 SQ. MM. & ABOVE

12.4.1.3.2. BY LEAD PITCH

12.4.1.3.2.1 0.5 MM

12.4.1.3.2.2 0.6 MM

12.4.1.3.2.3 0.8 MM

12.4.1.3.3. BY LEAD COUNT RANGE

12.4.1.3.3.1 UPTO 44

12.4.1.3.3.2 44 TO 120

12.4.1.3.3.3 120 TO 200

12.4.1.3.3.4 200 & ABOVE

12.4.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)

12.4.1.5. OTHERS

12.5 MILITARY & DEFENSE

12.5.1 BY TYPE

12.5.1.1. THIN QUAD FLAT PACK (TQFP)

12.5.1.1.1. BY BODY SIZE

12.5.1.1.1.1 UPTO 5 SQ. MM.

12.5.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.

12.5.1.1.1.3 15 SQ. MM. & ABOVE

12.5.1.1.2. BY LEAD PITCH

12.5.1.1.2.1 0.4 MM

12.5.1.1.2.2 0.5 MM

12.5.1.1.2.3 0.65 MM

12.5.1.1.2.4 0.8 MM

12.5.1.1.2.5 1.0 MM

12.5.1.1.3. BY LEAD COUNT RANGE

12.5.1.1.3.1 UPTO 32

12.5.1.1.3.2 32 TO 64

12.5.1.1.3.3 64 TO 128

12.5.1.1.3.4 128 & ABOVE

12.5.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)

12.5.1.2.1. BY BODY SIZE

12.5.1.2.1.1 UPTO 7 SQ. MM.

12.5.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.

12.5.1.2.1.3 14 SQ. MM. & ABOVE

12.5.1.2.2. BY LEAD PITCH

12.5.1.2.2.1 0.4 MM

12.5.1.2.2.2 0.5 MM

12.5.1.2.2.3 0.6 MM

12.5.1.2.2.4 0.8 MM

12.5.1.2.3. BY LEAD COUNT RANGE

12.5.1.2.3.1 UPTO 40

12.5.1.2.3.2 04 TO 100

12.5.1.2.3.3 100 TO 200

12.5.1.2.3.4 200 & ABOVE

12.5.1.3. METRIC QUAD FLAT PACK (MQFP)

12.5.1.3.1. BY BODY SIZE

12.5.1.3.1.1 UPTO 10 SQ.MM

12.5.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.

12.5.1.3.1.3 14 SQ.MM TO 28 SQ.MM

12.5.1.3.1.4 28 SQ. MM. & ABOVE

12.5.1.3.2. BY LEAD PITCH

12.5.1.3.2.1 0.5 MM

12.5.1.3.2.2 0.6 MM

12.5.1.3.2.3 0.8 MM

12.5.1.3.3. BY LEAD COUNT RANGE

12.5.1.3.3.1 UPTO 44

12.5.1.3.3.2 44 TO 120

12.5.1.3.3.3 120 TO 200

12.5.1.3.3.4 200 & ABOVE

12.5.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)

12.5.1.5. OTHERS

12.6 MEDICAL DEVICES

12.6.1 BY TYPE

12.6.1.1. THIN QUAD FLAT PACK (TQFP)

12.6.1.1.1. BY BODY SIZE

12.6.1.1.1.1 UPTO 5 SQ. MM.

12.6.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.

12.6.1.1.1.3 15 SQ. MM. & ABOVE

12.6.1.1.2. BY LEAD PITCH

12.6.1.1.2.1 0.4 MM

12.6.1.1.2.2 0.5 MM

12.6.1.1.2.3 0.65 MM

12.6.1.1.2.4 0.8 MM

12.6.1.1.2.5 1.0 MM

12.6.1.1.3. BY LEAD COUNT RANGE

12.6.1.1.3.1 UPTO 32

12.6.1.1.3.2 32 TO 64

12.6.1.1.3.3 64 TO 128

12.6.1.1.3.4 128 & ABOVE

12.6.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)

12.6.1.2.1. BY BODY SIZE

12.6.1.2.1.1 UPTO 7 SQ. MM.

12.6.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.

12.6.1.2.1.3 14 SQ. MM. & ABOVE

12.6.1.2.2. BY LEAD PITCH

12.6.1.2.2.1 0.4 MM

12.6.1.2.2.2 0.5 MM

12.6.1.2.2.3 0.6 MM

12.6.1.2.2.4 0.8 MM

12.6.1.2.3. BY LEAD COUNT RANGE

12.6.1.2.3.1 UPTO 40

12.6.1.2.3.2 04 TO 100

12.6.1.2.3.3 100 TO 200

12.6.1.2.3.4 200 & ABOVE

12.6.1.3. METRIC QUAD FLAT PACK (MQFP)

12.6.1.3.1. BY BODY SIZE

12.6.1.3.1.1 UPTO 10 SQ.MM

12.6.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.

12.6.1.3.1.3 14 SQ.MM TO 28 SQ.MM

12.6.1.3.1.4 28 SQ. MM. & ABOVE

12.6.1.3.2. BY LEAD PITCH

12.6.1.3.2.1 0.5 MM

12.6.1.3.2.2 0.6 MM

12.6.1.3.2.3 0.8 MM

12.6.1.3.3. BY LEAD COUNT RANGE

12.6.1.3.3.1 UPTO 44

12.6.1.3.3.2 44 TO 120

12.6.1.3.3.3 120 TO 200

12.6.1.3.3.4 200 & ABOVE

12.6.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)

12.6.1.5. OTHERS

12.7 COMMUNICATION

12.7.1 BY TYPE

12.7.1.1. THIN QUAD FLAT PACK (TQFP)

12.7.1.1.1. BY BODY SIZE

12.7.1.1.1.1 UPTO 5 SQ. MM.

12.7.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.

12.7.1.1.1.3 15 SQ. MM. & ABOVE

12.7.1.1.2. BY LEAD PITCH

12.7.1.1.2.1 0.4 MM

12.7.1.1.2.2 0.5 MM

12.7.1.1.2.3 0.65 MM

12.7.1.1.2.4 0.8 MM

12.7.1.1.2.5 1.0 MM

12.7.1.1.3. BY LEAD COUNT RANGE

12.7.1.1.3.1 UPTO 32

12.7.1.1.3.2 32 TO 64

12.7.1.1.3.3 64 TO 128

12.7.1.1.3.4 128 & ABOVE

12.7.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)

12.7.1.2.1. BY BODY SIZE

12.7.1.2.1.1 UPTO 7 SQ. MM.

12.7.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.

12.7.1.2.1.3 14 SQ. MM. & ABOVE

12.7.1.2.2. BY LEAD PITCH

12.7.1.2.2.1 0.4 MM

12.7.1.2.2.2 0.5 MM

12.7.1.2.2.3 0.6 MM

12.7.1.2.2.4 0.8 MM

12.7.1.2.3. BY LEAD COUNT RANGE

12.7.1.2.3.1 UPTO 40

12.7.1.2.3.2 04 TO 100

12.7.1.2.3.3 100 TO 200

12.7.1.2.3.4 200 & ABOVE

12.7.1.3. METRIC QUAD FLAT PACK (MQFP)

12.7.1.3.1. BY BODY SIZE

12.7.1.3.1.1 UPTO 10 SQ.MM

12.7.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.

12.7.1.3.1.3 14 SQ.MM TO 28 SQ.MM

12.7.1.3.1.4 28 SQ. MM. & ABOVE

12.7.1.3.2. BY LEAD PITCH

12.7.1.3.2.1 0.5 MM

12.7.1.3.2.2 0.6 MM

12.7.1.3.2.3 0.8 MM

12.7.1.3.3. BY LEAD COUNT RANGE

12.7.1.3.3.1 UPTO 44

12.7.1.3.3.2 44 TO 120

12.7.1.3.3.3 120 TO 200

12.7.1.3.3.4 200 & ABOVE

12.7.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)

12.7.1.5. OTHERS

12.8 OTHERS

13 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY GEOGRAPHY

GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)

13.1 NORTH AMERICA

13.1.1 U.S.

13.1.2 CANADA

13.1.3 MEXICO

13.2 EUROPE

13.2.1 GERMANY

13.2.2 FRANCE

13.2.3 U.K.

13.2.4 ITALY

13.2.5 SPAIN

13.2.6 RUSSIA

13.2.7 TURKEY

13.2.8 BELGIUM

13.2.9 NETHERLANDS

13.2.10 NORWAY

13.2.11 FINLAND

13.2.12 SWITZERLAND

13.2.13 DENMARK

13.2.14 SWEDEN

13.2.15 POLAND

13.2.16 REST OF EUROPE

13.3 ASIA PACIFIC

13.3.1 JAPAN

13.3.2 CHINA

13.3.3 SOUTH KOREA

13.3.4 INDIA

13.3.5 AUSTRALIA

13.3.6 NEW ZEALAND

13.3.7 SINGAPORE

13.3.8 THAILAND

13.3.9 MALAYSIA

13.3.10 INDONESIA

13.3.11 PHILIPPINES

13.3.12 TAIWAN

13.3.13 VIETNAM

13.3.14 REST OF ASIA PACIFIC

13.4 SOUTH AMERICA

13.4.1 BRAZIL

13.4.2 ARGENTINA

13.4.3 REST OF SOUTH AMERICA

13.5 MIDDLE EAST AND AFRICA

13.5.1 SOUTH AFRICA

13.5.2 EGYPT

13.5.3 SAUDI ARABIA

13.5.4 U.A.E

13.5.5 OMAN

13.5.6 BAHRAIN

13.5.7 ISRAEL

13.5.8 KUWAIT

13.5.9 QATAR

13.5.10 REST OF MIDDLE EAST AND AFRICA

13.6 KEY PRIMARY INSIGHTS: BY MAJOR COUNTRIES

14 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET,COMPANY LANDSCAPE

14.1 COMPANY SHARE ANALYSIS: GLOBAL

14.2 COMPANY SHARE ANALYSIS: NORTH AMERICA

14.3 COMPANY SHARE ANALYSIS: EUROPE

14.4 COMPANY SHARE ANALYSIS: ASIA PACIFIC

14.5 MERGERS & ACQUISITIONS

14.6 NEW PRODUCT DEVELOPMENT AND APPROVALS

14.7 EXPANSIONS

14.8 REGULATORY CHANGES

14.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS

15 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, SWOT & DBMR ANALYSIS

16 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, COMPANY PROFILE

16.1 JHDPCB. SHENZHEN JIANHONGDA ELECTRONIC TECHNICAL CO.,LTD

16.1.1 COMPANY SNAPSHOT

16.1.2 REVENUE ANALYSIS

16.1.3 GEOGRAPHIC PRESENCE

16.1.4 PRODUCT PORTFOLIO

16.1.5 RECENT DEVELOPMENT

16.2 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

16.2.1 COMPANY SNAPSHOT

16.2.2 REVENUE ANALYSIS

16.2.3 GEOGRAPHIC PRESENCE

16.2.4 PRODUCT PORTFOLIO

16.2.5 RECENT DEVELOPMENT

16.3 ARIES ELECTRONICS

16.3.1 COMPANY SNAPSHOT

16.3.2 REVENUE ANALYSIS

16.3.3 GEOGRAPHIC PRESENCE

16.3.4 PRODUCT PORTFOLIO

16.3.5 RECENT DEVELOPMENT

16.4 SFA SEMICON CO., LTD.

16.4.1 COMPANY SNAPSHOT

16.4.2 REVENUE ANALYSIS

16.4.3 GEOGRAPHIC PRESENCE

16.4.4 PRODUCT PORTFOLIO

16.4.5 RECENT DEVELOPMENT

16.5 YAMAICHI.

16.5.1 COMPANY SNAPSHOT

16.5.2 REVENUE ANALYSIS

16.5.3 GEOGRAPHIC PRESENCE

16.5.4 PRODUCT PORTFOLIO

16.5.5 RECENT DEVELOPMENT

16.6 AMKOR TECHNOLOGY

16.6.1 COMPANY SNAPSHOT

16.6.2 REVENUE ANALYSIS

16.6.3 GEOGRAPHIC PRESENCE

16.6.4 PRODUCT PORTFOLIO

16.6.5 RECENT DEVELOPMENT

16.7 TEXAS INSTRUMENTS INCORPORATED

16.7.1 COMPANY SNAPSHOT

16.7.2 REVENUE ANALYSIS

16.7.3 GEOGRAPHIC PRESENCE

16.7.4 PRODUCT PORTFOLIO

16.7.5 RECENT DEVELOPMENT

16.8 NXP SEMICONDUCTORS

16.8.1 COMPANY SNAPSHOT

16.8.2 REVENUE ANALYSIS

16.8.3 GEOGRAPHIC PRESENCE

16.8.4 PRODUCT PORTFOLIO

16.8.5 RECENT DEVELOPMENT

16.9 ANALOG DEVICES, INC

16.9.1 COMPANY SNAPSHOT

16.9.2 REVENUE ANALYSIS

16.9.3 GEOGRAPHIC PRESENCE

16.9.4 PRODUCT PORTFOLIO

16.9.5 RECENT DEVELOPMENT

16.1 KYOCERA CORPORATION

16.10.1 COMPANY SNAPSHOT

16.10.2 REVENUE ANALYSIS

16.10.3 GEOGRAPHIC PRESENCE

16.10.4 PRODUCT PORTFOLIO

16.10.5 RECENT DEVELOPMENT

16.11 CHIZHOU HISEMI ELECTRONIC TECHNOLOGY CO., LTD

16.11.1 COMPANY SNAPSHOT

16.11.2 REVENUE ANALYSIS

16.11.3 GEOGRAPHIC PRESENCE

16.11.4 PRODUCT PORTFOLIO

16.11.5 RECENT DEVELOPMENT

16.12 OSE CORP

16.12.1 COMPANY SNAPSHOT

16.12.2 REVENUE ANALYSIS

16.12.3 GEOGRAPHIC PRESENCE

16.12.4 PRODUCT PORTFOLIO

16.12.5 RECENT DEVELOPMENT

16.13 JIANGXI WAN NIAN XIN MICRO-ELECTRONICS CO. LTD

16.13.1 COMPANY SNAPSHOT

16.13.2 REVENUE ANALYSIS

16.13.3 GEOGRAPHIC PRESENCE

16.13.4 PRODUCT PORTFOLIO

16.13.5 RECENT DEVELOPMENT

16.14 ENPLAS CORPORATION

16.14.1 COMPANY SNAPSHOT

16.14.2 REVENUE ANALYSIS

16.14.3 GEOGRAPHIC PRESENCE

16.14.4 PRODUCT PORTFOLIO

16.14.5 RECENT DEVELOPMENT

16.15 SENSATA TECHNOLOGIES

16.15.1 COMPANY SNAPSHOT

16.15.2 REVENUE ANALYSIS

16.15.3 GEOGRAPHIC PRESENCE

16.15.4 PRODUCT PORTFOLIO

16.15.5 RECENT DEVELOPMENT

NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDY AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST

17 CONCLUSION

18 QUESTIONNAIRE

19 RELATED REPORTS

20 ABOUT DATA BRIDGE MARKET RESEARCH