Table of Content
1 INTRODUCTION
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 OVERVIEW OF GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET
1.4 CURRENCY AND PRICING
1.5 LIMITATION
1.6 MARKETS COVERED
2 MARKET SEGMENTATION
2.1 KEY TAKEAWAYS
2.2 ARRIVING AT THE GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET
2.2.1 VENDOR POSITIONING GRID
2.2.2 TECHNOLOGY LIFE LINE CURVE
2.2.3 MARKET GUIDE
2.2.4 COMPANY POSITIONING GRID
2.2.5 COMAPANY MARKET SHARE ANALYSIS
2.2.6 MULTIVARIATE MODELLING
2.2.7 TOP TO BOTTOM ANALYSIS
2.2.8 STANDARDS OF MEASUREMENT
2.2.9 VENDOR SHARE ANALYSIS
2.2.10 DATA POINTS FROM KEY PRIMARY INTERVIEWS
2.2.11 DATA POINTS FROM KEY SECONDARY DATABASES
2.3 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET: RESEARCH SNAPSHOT
2.4 ASSUMPTIONS
3 MARKET OVERVIEW
3.1 DRIVERS
3.2 RESTRAINTS
3.3 OPPORTUNITIES
3.4 CHALLENGES
4 EXECUTIVE SUMMARY
5 PREMIUM INSIGHT
5.1 PORTERS FIVE FORCES
5.2 REGULATORY STANDARDS
5.3 TECHNOLOGICAL TRENDS
5.4 PATENT ANALYSIS
5.5 CASE STUDY
5.6 VALUE CHAIN ANALYSIS
5.7 COMPANY COMPARITIVE ANALYSIS
5.8 PRICING ANALYSIS
6 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY TYPE
6.1 OVERVIEW
6.2 THIN QUAD FLAT PACK (TQFP)
6.2.1 BY BODY SIZE
6.2.1.1. UPTO 5 SQ. MM.
6.2.1.2. 5 SQ. MM. TO 15 SQ. MM.
6.2.1.3. 15 SQ. MM. & ABOVE
6.2.2 BY LEAD PITCH
6.2.2.1. 0.4 MM
6.2.2.2. 0.5 MM
6.2.2.3. 0.65 MM
6.2.2.4. 0.8 MM
6.2.2.5. 1.0 MM
6.2.3 BY LEAD COUNT RANGE
6.2.3.1. UPTO 32
6.2.3.2. 32 TO 64
6.2.3.3. 64 TO 128
6.2.3.4. 128 & ABOVE
6.3 LOW PROFILE QUAD FLAT PACK (LQFP)
6.3.1 BY BODY SIZE
6.3.1.1. UPTO 7 SQ. MM.
6.3.1.2. 7 SQ. MM. TO 14 SQ. MM.
6.3.1.3. 14 SQ. MM. & ABOVE
6.3.2 BY LEAD PITCH
6.3.2.1. 0.4 MM
6.3.2.2. 0.5 MM
6.3.2.3. 0.6 MM
6.3.2.4. 0.8 MM
6.3.3 BY LEAD COUNT RANGE
6.3.3.1. UPTO 40
6.3.3.2. 04 TO 100
6.3.3.3. 100 TO 200
6.3.3.4. 200 & ABOVE
6.4 METRIC QUAD FLAT PACK (MQFP)
6.4.1 BY BODY SIZE
6.4.1.1. UPTO 10 SQ.MM
6.4.1.2. 10 SQ. MM. TO 14 SQ. MM.
6.4.1.3. 14 SQ.MM TO 28 SQ.MM
6.4.1.4. 28 SQ. MM. & ABOVE
6.4.2 BY LEAD PITCH
6.4.2.1. 0.5 MM
6.4.2.2. 0.6 MM
6.4.2.3. 0.8 MM
6.4.3 BY LEAD COUNT RANGE
6.4.3.1. UPTO 44
6.4.3.2. 44 TO 120
6.4.3.3. 120 TO 200
6.4.3.4. 200 & ABOVE
6.5 BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
6.6 OTHERS
7 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY SUBSTRATES
7.1 OVERVIEW
7.2 PLASTIC
7.3 CERAMIC
7.4 METAL
8 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY PACKAGE TYPE
8.1 OVERVIEW
8.2 QFP32
8.3 QFP64
8.4 QFP100
8.5 QFP144
8.6 QFP208
8.7 OTHERS
9 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY TECHNOLOGY
9.1 OVERVIEW
9.2 SURFACE MOUNT TECHNOLOGY
9.3 THROUGH-HOLE TECHNOLOGY
10 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY SALES CHANNEL
10.1 OVERVIEW
10.2 OEM
10.3 AFTERMARKET
11 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY DISTRIBUTION CHANNEL
11.1 OVERVIEW
11.2 DIRECT SALES
11.3 INDIRECT SALES
12 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY APPLICATION
12.1 OVERVIEW
12.2 CONSUMER ELECTRONICS
12.2.1 BY TYPE
12.2.1.1. THIN QUAD FLAT PACK (TQFP)
12.2.1.1.1. BY BODY SIZE
12.2.1.1.1.1 UPTO 5 SQ. MM.
12.2.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.2.1.1.1.3 15 SQ. MM. & ABOVE
12.2.1.1.2. BY LEAD PITCH
12.2.1.1.2.1 0.4 MM
12.2.1.1.2.2 0.5 MM
12.2.1.1.2.3 0.65 MM
12.2.1.1.2.4 0.8 MM
12.2.1.1.2.5 1.0 MM
12.2.1.1.3. BY LEAD COUNT RANGE
12.2.1.1.3.1 UPTO 32
12.2.1.1.3.2 32 TO 64
12.2.1.1.3.3 64 TO 128
12.2.1.1.3.4 128 & ABOVE
12.2.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.2.1.2.1. BY BODY SIZE
12.2.1.2.1.1 UPTO 7 SQ. MM.
12.2.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.2.1.2.1.3 14 SQ. MM. & ABOVE
12.2.1.2.2. BY LEAD PITCH
12.2.1.2.2.1 0.4 MM
12.2.1.2.2.2 0.5 MM
12.2.1.2.2.3 0.6 MM
12.2.1.2.2.4 0.8 MM
12.2.1.2.3. BY LEAD COUNT RANGE
12.2.1.2.3.1 UPTO 40
12.2.1.2.3.2 04 TO 100
12.2.1.2.3.3 100 TO 200
12.2.1.2.3.4 200 & ABOVE
12.2.1.3. METRIC QUAD FLAT PACK (MQFP)
12.2.1.3.1. BY BODY SIZE
12.2.1.3.1.1 UPTO 10 SQ.MM
12.2.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.2.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.2.1.3.1.4 28 SQ. MM. & ABOVE
12.2.1.3.2. BY LEAD PITCH
12.2.1.3.2.1 0.5 MM
12.2.1.3.2.2 0.6 MM
12.2.1.3.2.3 0.8 MM
12.2.1.3.3. BY LEAD COUNT RANGE
12.2.1.3.3.1 UPTO 44
12.2.1.3.3.2 44 TO 120
12.2.1.3.3.3 120 TO 200
12.2.1.3.3.4 200 & ABOVE
12.2.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.2.1.5. OTHERS
12.3 AUTOMOTIVE
12.3.1 BY TYPE
12.3.1.1. THIN QUAD FLAT PACK (TQFP)
12.3.1.1.1. BY BODY SIZE
12.3.1.1.1.1 UPTO 5 SQ. MM.
12.3.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.3.1.1.1.3 15 SQ. MM. & ABOVE
12.3.1.1.2. BY LEAD PITCH
12.3.1.1.2.1 0.4 MM
12.3.1.1.2.2 0.5 MM
12.3.1.1.2.3 0.65 MM
12.3.1.1.2.4 0.8 MM
12.3.1.1.2.5 1.0 MM
12.3.1.1.3. BY LEAD COUNT RANGE
12.3.1.1.3.1 UPTO 32
12.3.1.1.3.2 32 TO 64
12.3.1.1.3.3 64 TO 128
12.3.1.1.3.4 128 & ABOVE
12.3.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.3.1.2.1. BY BODY SIZE
12.3.1.2.1.1 UPTO 7 SQ. MM.
12.3.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.3.1.2.1.3 14 SQ. MM. & ABOVE
12.3.1.2.2. BY LEAD PITCH
12.3.1.2.2.1 0.4 MM
12.3.1.2.2.2 0.5 MM
12.3.1.2.2.3 0.6 MM
12.3.1.2.2.4 0.8 MM
12.3.1.2.3. BY LEAD COUNT RANGE
12.3.1.2.3.1 UPTO 40
12.3.1.2.3.2 04 TO 100
12.3.1.2.3.3 100 TO 200
12.3.1.2.3.4 200 & ABOVE
12.3.1.3. METRIC QUAD FLAT PACK (MQFP)
12.3.1.3.1. BY BODY SIZE
12.3.1.3.1.1 UPTO 10 SQ.MM
12.3.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.3.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.3.1.3.1.4 28 SQ. MM. & ABOVE
12.3.1.3.2. BY LEAD PITCH
12.3.1.3.2.1 0.5 MM
12.3.1.3.2.2 0.6 MM
12.3.1.3.2.3 0.8 MM
12.3.1.3.3. BY LEAD COUNT RANGE
12.3.1.3.3.1 UPTO 44
12.3.1.3.3.2 44 TO 120
12.3.1.3.3.3 120 TO 200
12.3.1.3.3.4 200 & ABOVE
12.3.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.3.1.5. OTHERS
12.4 INDUSTRIAL
12.4.1 BY TYPE
12.4.1.1. THIN QUAD FLAT PACK (TQFP)
12.4.1.1.1. BY BODY SIZE
12.4.1.1.1.1 UPTO 5 SQ. MM.
12.4.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.4.1.1.1.3 15 SQ. MM. & ABOVE
12.4.1.1.2. BY LEAD PITCH
12.4.1.1.2.1 0.4 MM
12.4.1.1.2.2 0.5 MM
12.4.1.1.2.3 0.65 MM
12.4.1.1.2.4 0.8 MM
12.4.1.1.2.5 1.0 MM
12.4.1.1.3. BY LEAD COUNT RANGE
12.4.1.1.3.1 UPTO 32
12.4.1.1.3.2 32 TO 64
12.4.1.1.3.3 64 TO 128
12.4.1.1.3.4 128 & ABOVE
12.4.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.4.1.2.1. BY BODY SIZE
12.4.1.2.1.1 UPTO 7 SQ. MM.
12.4.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.4.1.2.1.3 14 SQ. MM. & ABOVE
12.4.1.2.2. BY LEAD PITCH
12.4.1.2.2.1 0.4 MM
12.4.1.2.2.2 0.5 MM
12.4.1.2.2.3 0.6 MM
12.4.1.2.2.4 0.8 MM
12.4.1.2.3. BY LEAD COUNT RANGE
12.4.1.2.3.1 UPTO 40
12.4.1.2.3.2 04 TO 100
12.4.1.2.3.3 100 TO 200
12.4.1.2.3.4 200 & ABOVE
12.4.1.3. METRIC QUAD FLAT PACK (MQFP)
12.4.1.3.1. BY BODY SIZE
12.4.1.3.1.1 UPTO 10 SQ.MM
12.4.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.4.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.4.1.3.1.4 28 SQ. MM. & ABOVE
12.4.1.3.2. BY LEAD PITCH
12.4.1.3.2.1 0.5 MM
12.4.1.3.2.2 0.6 MM
12.4.1.3.2.3 0.8 MM
12.4.1.3.3. BY LEAD COUNT RANGE
12.4.1.3.3.1 UPTO 44
12.4.1.3.3.2 44 TO 120
12.4.1.3.3.3 120 TO 200
12.4.1.3.3.4 200 & ABOVE
12.4.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.4.1.5. OTHERS
12.5 MILITARY & DEFENSE
12.5.1 BY TYPE
12.5.1.1. THIN QUAD FLAT PACK (TQFP)
12.5.1.1.1. BY BODY SIZE
12.5.1.1.1.1 UPTO 5 SQ. MM.
12.5.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.5.1.1.1.3 15 SQ. MM. & ABOVE
12.5.1.1.2. BY LEAD PITCH
12.5.1.1.2.1 0.4 MM
12.5.1.1.2.2 0.5 MM
12.5.1.1.2.3 0.65 MM
12.5.1.1.2.4 0.8 MM
12.5.1.1.2.5 1.0 MM
12.5.1.1.3. BY LEAD COUNT RANGE
12.5.1.1.3.1 UPTO 32
12.5.1.1.3.2 32 TO 64
12.5.1.1.3.3 64 TO 128
12.5.1.1.3.4 128 & ABOVE
12.5.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.5.1.2.1. BY BODY SIZE
12.5.1.2.1.1 UPTO 7 SQ. MM.
12.5.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.5.1.2.1.3 14 SQ. MM. & ABOVE
12.5.1.2.2. BY LEAD PITCH
12.5.1.2.2.1 0.4 MM
12.5.1.2.2.2 0.5 MM
12.5.1.2.2.3 0.6 MM
12.5.1.2.2.4 0.8 MM
12.5.1.2.3. BY LEAD COUNT RANGE
12.5.1.2.3.1 UPTO 40
12.5.1.2.3.2 04 TO 100
12.5.1.2.3.3 100 TO 200
12.5.1.2.3.4 200 & ABOVE
12.5.1.3. METRIC QUAD FLAT PACK (MQFP)
12.5.1.3.1. BY BODY SIZE
12.5.1.3.1.1 UPTO 10 SQ.MM
12.5.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.5.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.5.1.3.1.4 28 SQ. MM. & ABOVE
12.5.1.3.2. BY LEAD PITCH
12.5.1.3.2.1 0.5 MM
12.5.1.3.2.2 0.6 MM
12.5.1.3.2.3 0.8 MM
12.5.1.3.3. BY LEAD COUNT RANGE
12.5.1.3.3.1 UPTO 44
12.5.1.3.3.2 44 TO 120
12.5.1.3.3.3 120 TO 200
12.5.1.3.3.4 200 & ABOVE
12.5.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.5.1.5. OTHERS
12.6 MEDICAL DEVICES
12.6.1 BY TYPE
12.6.1.1. THIN QUAD FLAT PACK (TQFP)
12.6.1.1.1. BY BODY SIZE
12.6.1.1.1.1 UPTO 5 SQ. MM.
12.6.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.6.1.1.1.3 15 SQ. MM. & ABOVE
12.6.1.1.2. BY LEAD PITCH
12.6.1.1.2.1 0.4 MM
12.6.1.1.2.2 0.5 MM
12.6.1.1.2.3 0.65 MM
12.6.1.1.2.4 0.8 MM
12.6.1.1.2.5 1.0 MM
12.6.1.1.3. BY LEAD COUNT RANGE
12.6.1.1.3.1 UPTO 32
12.6.1.1.3.2 32 TO 64
12.6.1.1.3.3 64 TO 128
12.6.1.1.3.4 128 & ABOVE
12.6.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.6.1.2.1. BY BODY SIZE
12.6.1.2.1.1 UPTO 7 SQ. MM.
12.6.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.6.1.2.1.3 14 SQ. MM. & ABOVE
12.6.1.2.2. BY LEAD PITCH
12.6.1.2.2.1 0.4 MM
12.6.1.2.2.2 0.5 MM
12.6.1.2.2.3 0.6 MM
12.6.1.2.2.4 0.8 MM
12.6.1.2.3. BY LEAD COUNT RANGE
12.6.1.2.3.1 UPTO 40
12.6.1.2.3.2 04 TO 100
12.6.1.2.3.3 100 TO 200
12.6.1.2.3.4 200 & ABOVE
12.6.1.3. METRIC QUAD FLAT PACK (MQFP)
12.6.1.3.1. BY BODY SIZE
12.6.1.3.1.1 UPTO 10 SQ.MM
12.6.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.6.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.6.1.3.1.4 28 SQ. MM. & ABOVE
12.6.1.3.2. BY LEAD PITCH
12.6.1.3.2.1 0.5 MM
12.6.1.3.2.2 0.6 MM
12.6.1.3.2.3 0.8 MM
12.6.1.3.3. BY LEAD COUNT RANGE
12.6.1.3.3.1 UPTO 44
12.6.1.3.3.2 44 TO 120
12.6.1.3.3.3 120 TO 200
12.6.1.3.3.4 200 & ABOVE
12.6.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.6.1.5. OTHERS
12.7 COMMUNICATION
12.7.1 BY TYPE
12.7.1.1. THIN QUAD FLAT PACK (TQFP)
12.7.1.1.1. BY BODY SIZE
12.7.1.1.1.1 UPTO 5 SQ. MM.
12.7.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.7.1.1.1.3 15 SQ. MM. & ABOVE
12.7.1.1.2. BY LEAD PITCH
12.7.1.1.2.1 0.4 MM
12.7.1.1.2.2 0.5 MM
12.7.1.1.2.3 0.65 MM
12.7.1.1.2.4 0.8 MM
12.7.1.1.2.5 1.0 MM
12.7.1.1.3. BY LEAD COUNT RANGE
12.7.1.1.3.1 UPTO 32
12.7.1.1.3.2 32 TO 64
12.7.1.1.3.3 64 TO 128
12.7.1.1.3.4 128 & ABOVE
12.7.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.7.1.2.1. BY BODY SIZE
12.7.1.2.1.1 UPTO 7 SQ. MM.
12.7.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.7.1.2.1.3 14 SQ. MM. & ABOVE
12.7.1.2.2. BY LEAD PITCH
12.7.1.2.2.1 0.4 MM
12.7.1.2.2.2 0.5 MM
12.7.1.2.2.3 0.6 MM
12.7.1.2.2.4 0.8 MM
12.7.1.2.3. BY LEAD COUNT RANGE
12.7.1.2.3.1 UPTO 40
12.7.1.2.3.2 04 TO 100
12.7.1.2.3.3 100 TO 200
12.7.1.2.3.4 200 & ABOVE
12.7.1.3. METRIC QUAD FLAT PACK (MQFP)
12.7.1.3.1. BY BODY SIZE
12.7.1.3.1.1 UPTO 10 SQ.MM
12.7.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.7.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.7.1.3.1.4 28 SQ. MM. & ABOVE
12.7.1.3.2. BY LEAD PITCH
12.7.1.3.2.1 0.5 MM
12.7.1.3.2.2 0.6 MM
12.7.1.3.2.3 0.8 MM
12.7.1.3.3. BY LEAD COUNT RANGE
12.7.1.3.3.1 UPTO 44
12.7.1.3.3.2 44 TO 120
12.7.1.3.3.3 120 TO 200
12.7.1.3.3.4 200 & ABOVE
12.7.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.7.1.5. OTHERS
12.8 OTHERS
13 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY GEOGRAPHY
GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)
13.1 NORTH AMERICA
13.1.1 U.S.
13.1.2 CANADA
13.1.3 MEXICO
13.2 EUROPE
13.2.1 GERMANY
13.2.2 FRANCE
13.2.3 U.K.
13.2.4 ITALY
13.2.5 SPAIN
13.2.6 RUSSIA
13.2.7 TURKEY
13.2.8 BELGIUM
13.2.9 NETHERLANDS
13.2.10 NORWAY
13.2.11 FINLAND
13.2.12 SWITZERLAND
13.2.13 DENMARK
13.2.14 SWEDEN
13.2.15 POLAND
13.2.16 REST OF EUROPE
13.3 ASIA PACIFIC
13.3.1 JAPAN
13.3.2 CHINA
13.3.3 SOUTH KOREA
13.3.4 INDIA
13.3.5 AUSTRALIA
13.3.6 NEW ZEALAND
13.3.7 SINGAPORE
13.3.8 THAILAND
13.3.9 MALAYSIA
13.3.10 INDONESIA
13.3.11 PHILIPPINES
13.3.12 TAIWAN
13.3.13 VIETNAM
13.3.14 REST OF ASIA PACIFIC
13.4 SOUTH AMERICA
13.4.1 BRAZIL
13.4.2 ARGENTINA
13.4.3 REST OF SOUTH AMERICA
13.5 MIDDLE EAST AND AFRICA
13.5.1 SOUTH AFRICA
13.5.2 EGYPT
13.5.3 SAUDI ARABIA
13.5.4 U.A.E
13.5.5 OMAN
13.5.6 BAHRAIN
13.5.7 ISRAEL
13.5.8 KUWAIT
13.5.9 QATAR
13.5.10 REST OF MIDDLE EAST AND AFRICA
13.6 KEY PRIMARY INSIGHTS: BY MAJOR COUNTRIES
14 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET,COMPANY LANDSCAPE
14.1 COMPANY SHARE ANALYSIS: GLOBAL
14.2 COMPANY SHARE ANALYSIS: NORTH AMERICA
14.3 COMPANY SHARE ANALYSIS: EUROPE
14.4 COMPANY SHARE ANALYSIS: ASIA PACIFIC
14.5 MERGERS & ACQUISITIONS
14.6 NEW PRODUCT DEVELOPMENT AND APPROVALS
14.7 EXPANSIONS
14.8 REGULATORY CHANGES
14.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS
15 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, SWOT & DBMR ANALYSIS
16 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, COMPANY PROFILE
16.1 JHDPCB. SHENZHEN JIANHONGDA ELECTRONIC TECHNICAL CO.,LTD
16.1.1 COMPANY SNAPSHOT
16.1.2 REVENUE ANALYSIS
16.1.3 GEOGRAPHIC PRESENCE
16.1.4 PRODUCT PORTFOLIO
16.1.5 RECENT DEVELOPMENT
16.2 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
16.2.1 COMPANY SNAPSHOT
16.2.2 REVENUE ANALYSIS
16.2.3 GEOGRAPHIC PRESENCE
16.2.4 PRODUCT PORTFOLIO
16.2.5 RECENT DEVELOPMENT
16.3 ARIES ELECTRONICS
16.3.1 COMPANY SNAPSHOT
16.3.2 REVENUE ANALYSIS
16.3.3 GEOGRAPHIC PRESENCE
16.3.4 PRODUCT PORTFOLIO
16.3.5 RECENT DEVELOPMENT
16.4 SFA SEMICON CO., LTD.
16.4.1 COMPANY SNAPSHOT
16.4.2 REVENUE ANALYSIS
16.4.3 GEOGRAPHIC PRESENCE
16.4.4 PRODUCT PORTFOLIO
16.4.5 RECENT DEVELOPMENT
16.5 YAMAICHI.
16.5.1 COMPANY SNAPSHOT
16.5.2 REVENUE ANALYSIS
16.5.3 GEOGRAPHIC PRESENCE
16.5.4 PRODUCT PORTFOLIO
16.5.5 RECENT DEVELOPMENT
16.6 AMKOR TECHNOLOGY
16.6.1 COMPANY SNAPSHOT
16.6.2 REVENUE ANALYSIS
16.6.3 GEOGRAPHIC PRESENCE
16.6.4 PRODUCT PORTFOLIO
16.6.5 RECENT DEVELOPMENT
16.7 TEXAS INSTRUMENTS INCORPORATED
16.7.1 COMPANY SNAPSHOT
16.7.2 REVENUE ANALYSIS
16.7.3 GEOGRAPHIC PRESENCE
16.7.4 PRODUCT PORTFOLIO
16.7.5 RECENT DEVELOPMENT
16.8 NXP SEMICONDUCTORS
16.8.1 COMPANY SNAPSHOT
16.8.2 REVENUE ANALYSIS
16.8.3 GEOGRAPHIC PRESENCE
16.8.4 PRODUCT PORTFOLIO
16.8.5 RECENT DEVELOPMENT
16.9 ANALOG DEVICES, INC
16.9.1 COMPANY SNAPSHOT
16.9.2 REVENUE ANALYSIS
16.9.3 GEOGRAPHIC PRESENCE
16.9.4 PRODUCT PORTFOLIO
16.9.5 RECENT DEVELOPMENT
16.1 KYOCERA CORPORATION
16.10.1 COMPANY SNAPSHOT
16.10.2 REVENUE ANALYSIS
16.10.3 GEOGRAPHIC PRESENCE
16.10.4 PRODUCT PORTFOLIO
16.10.5 RECENT DEVELOPMENT
16.11 CHIZHOU HISEMI ELECTRONIC TECHNOLOGY CO., LTD
16.11.1 COMPANY SNAPSHOT
16.11.2 REVENUE ANALYSIS
16.11.3 GEOGRAPHIC PRESENCE
16.11.4 PRODUCT PORTFOLIO
16.11.5 RECENT DEVELOPMENT
16.12 OSE CORP
16.12.1 COMPANY SNAPSHOT
16.12.2 REVENUE ANALYSIS
16.12.3 GEOGRAPHIC PRESENCE
16.12.4 PRODUCT PORTFOLIO
16.12.5 RECENT DEVELOPMENT
16.13 JIANGXI WAN NIAN XIN MICRO-ELECTRONICS CO. LTD
16.13.1 COMPANY SNAPSHOT
16.13.2 REVENUE ANALYSIS
16.13.3 GEOGRAPHIC PRESENCE
16.13.4 PRODUCT PORTFOLIO
16.13.5 RECENT DEVELOPMENT
16.14 ENPLAS CORPORATION
16.14.1 COMPANY SNAPSHOT
16.14.2 REVENUE ANALYSIS
16.14.3 GEOGRAPHIC PRESENCE
16.14.4 PRODUCT PORTFOLIO
16.14.5 RECENT DEVELOPMENT
16.15 SENSATA TECHNOLOGIES
16.15.1 COMPANY SNAPSHOT
16.15.2 REVENUE ANALYSIS
16.15.3 GEOGRAPHIC PRESENCE
16.15.4 PRODUCT PORTFOLIO
16.15.5 RECENT DEVELOPMENT
NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDY AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST
17 CONCLUSION
18 QUESTIONNAIRE
19 RELATED REPORTS
20 ABOUT DATA BRIDGE MARKET RESEARCH
