Latest Developments in Asia Pacific Thin Film Encapsulation Market

back-icon

Back to Report

Request for TOC Request for TOC Speak to Analyst Speak to Analyst Free Sample Report Free Sample Report Inquire Before Buying Inquire Before Buy Now Buy Now

Latest Developments in Asia Pacific Thin Film Encapsulation Market

  • Semiconductors and Electronics
  • Oct 2021
  • Asia-Pacific
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

  • In December 2024, Applied Materials, Inc. launched its PrecisionBarrier ALD system, designed for high-performance OLED displays in consumer electronics, offering enhanced barrier properties and compatibility with AI-driven manufacturing systems in the China
  • In November 2024, Kateeva, Inc. introduced its FlexiJet inkjet printing platform, a cost-effective TFE solution for flexible OLED displays and photovoltaics, targeting large-scale production in China, India
  • In October 2024, Universal Display Corporation partnered with a leading solar manufacturer to deploy its TFE solutions for thin-film photovoltaics, improving efficiency and durability in solar panels.
  • In September 2024, 3M Company unveiled its UltraShield TFE system, designed for automotive OLED lighting applications, offering up to 25% better moisture resistance and compliance with industry standards in Asia Pacific.
  • In August 2024, Veeco Instruments Inc. announced its NanoCoat ALD series, targeting aerospace and healthcare applications , with features like ultra-thin barrier layers and real-time process optimization.