- In March 2025, NXP Semiconductors unveiled its S32K5 series of automotive microcontrollers (MCUs), marking a significant advancement in automotive electronics. These MCUs incorporate 16nm FinFET technology and embedded magnetic RAM (MRAM), facilitating faster over-the-air updates and enhanced software-defined vehicle (SDV) capabilities. The S32K5 series is designed to support zonal architectures and electrification systems, addressing the growing demand for intelligent and connected vehicle features. Sampling for select customers is scheduled to begin in the third quarter of 2025.
- In January 2025, ZF Friedrichshafen AG announced an investment of €36.8 million in a new logistics center and upgraded production machinery at its headquarters in Friedrichshafen, Germany. The facility, covering 32,000 square feet, aims to enhance efficiency, reduce lead times, and lower operational costs. The upgraded production machinery is expected to become operational in 2025, supporting ZF's growing industrial division business, including marine transmissions and aftermarket components.
- In February 2025, At CES Valeo showcased its advancements in autonomous driving technologies, including the LiDAR SCALA™ 2 system, enabling Level 3 autonomous driving capabilities. The company also introduced the vOS middleware, supporting software-defined vehicle functions and over-the-air updates. Additionally, Valeo presented its innovative front fascias featuring 224 RGB LEDs, offering enhanced design identity and information display on production vehicles.
- In March 2025, Continental AG unveiled its "Emotional Cockpit," integrating a 1.30-meter-long E Ink Prism display spanning the dashboard, allowing for customizable visuals and interactions. The company also introduced a window projection system, transforming side windows into exterior displays, enabling vehicles to communicate with their environment by showcasing information such as charging status or personalized content.
