Europe Wi-Fi Chipset Market, By Devices (Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others), Band (Single Band, Dual Band, Tri Band), Fabrication Technology (FinFET, FDSOI CMOS, Silicon On Insulator (SOI) and Sige), Wi-Fi Standard (802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others), Die Size (28nm, 20nm, 14nm, 10nm and others), MIMO Configuration (MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO, SU-MIMO, 3x3 MU-MIMO, 2x2 MU-MIMO, 1x1 MU-MIMO), End User (Consumer, Automotive and Transportation, Healthcare, Education, BFSI, Travel and Hospitality, Others), Country (Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe)- Industry Trends and Forecast to 2028.
Wi-Fi chipset market is expected to gain market growth in the forecast period of 2021 to 2028. Data Bridge Market Research analyses the Wi-Fi chipset market to exhibit a CAGR of 8.0% for the forecast
Wi-Fi chipset is basically an integrated circuit of wireless signals that are generally installed in laptops, routers and cellular phones. They are used to connect all the devices and allow the users to access networked services over wireless connection.
The increasing adoption of IoT, rising globalization and growing number of public Wi-Fi hotspots across the globe will emerge as the major factor driving market growth. In addition to this, the surging number of small scale industries aiming to adopt high speed network connectivity along with growing penetration of consumer electronic gadgets like smartphones, laptops and others will further aggravate the market value. However, lack of knowledge and technological expertise and large scale technological limitations in the underdeveloped economies will hammer down the growth rate for the market.
In addition to this, rising technological advancements and growing expenditure to undertake research and development proficiencies generate new opportunities for growing the market within the forecast period. The rising security concerns due to growing cases of data leaks will dampen the growth rate that further result as a challenge for the market.
This Wi-Fi chipset market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on Wi-Fi chipset market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Europe Wi-Fi Chipset Market Scope and Market Size
The Wi-Fi chipset market is segmented on the basis of device, band, fabrication technology, WI-FI Standard, die size, MIMO configuration and end user. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
- On the basis of device, the market is segmented into tablet, connected home devices, smartphones, PCs, access point equipment and others.
- On the basis of band, the market is segmented into single band, dual band and tri band.
- On the basis of fabrication technology, the market is segmented into FinFET, FDSOI CMOS, silicon on insulator (SOI) and sige.
- On the basis of WI-FI standard, the market is segmented into 802.11AY, 802.11AD, 802.11AX, 802.11AC, WAVE 1, 802.11AC, WAVE 2, 802.11B, 802.11G and 802.11N.
- On the basis of die size, the market is segmented into 28nm, 20nm, 14nm, 10nm and others.
- On the basis of MIMO configuration, the market is segmented into SU-MIMO, MU-MIMO, 1X1 MU-MIMO, 2X2 MU-MIMO, 3X3 MU-MIMO, 4X4 MU-MIMO, and 8X8 MU-MIMO.
- On the basis of end user, the market is segmented into consumer, automotive and transportation, healthcare, education, BFSI, travel and hospitality and others.
Wi-Fi Chipset Market Country Level Analysis
The Wi-Fi chipset market is analyzed and market size, volume information is provided by device, band, fabrication technology, WI-FI Standard, die size, MIMO configuration and end user as referenced above.
The countries covered in the Wi-Fi chipset market report are Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey and rest of Europe in Europe.
The country section of the Wi-Fi chipset market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of Europe brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Wi-Fi Chipset Market Share Analysis
The Wi-Fi chipset market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, Europe presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to Wi-Fi chipset market.
The major players covered in the Wi-Fi chipset market report are Intel Corporation, Qualcomm Technologies. Inc, Sony Semiconductor Israel Ltd, ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD, Broadcom, Hitachi Vantara Corporation, Cisco Systems, Inc., Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics, MediaTek Inc., Cypress Semiconductor Corporation, PERASO TECHNOLOGIES INC., PERASO TECHNOLOGIES INC, Semiconductor Components Industries, LLC, Cypress Semiconductor Corporation and Texas Instruments Incorporated among others. DBMR analysts understand competitive strengths and provide competitive analysis for each competitor separately.