- In January 2024, Ficosa Group collaborated with Indie Semiconductor, a provider of automotive semiconductor solutions, to develop and market automotive camera systems that utilize neural network-based artificial intelligence (AI) processing. This partnership aims to combine Ficosa's expertise in high-volume vision solutions with Indie Semiconductor's proven vision processing technology, enhancing the capabilities of automotive camera systems for improved safety and performance in vehicles
- In September 2024, Denso Corporation announced plans to construct a new facility by expanding the existing Zenmyo Plant located in Nishio City, Aichi Prefecture. The total investment for this project is approximately 69 Million yen. The new plant will focus on manufacturing large-scale integrated electronic control units (ECUs) essential for electrification and advanced driver assistance systems (ADAS)
- In May 2023, TE Connectivity Corporation introduced the ANT-5GW-FPC series of cellular adhesive flexible printed circuit antennas, developed in collaboration with Linx Technologies. These antennas feature an independent dipole internal/embedded design, providing a versatile solution for various applications. The flexible nature and adhesive backing of the antennas facilitate easy installation within RF-transparent enclosures, allowing for effective environmental sealing that protects the antenna from potential damage
- In May 2020, Airgain, Inc. launched their new product, high-power user equipment (HPUE) antenna-modem platform for the First Responder Network Authority (FirstNet) network using a module from Assure Wireless. This platform will enable superior performance for 4G and 5G communications. This will enhance the company’s product portfolio
