- In February 2025, Microsoft released version 5.0.12 of its open-source Confidential Consortium Framework (CCF). CCF is designed to build secure, high-performance blockchain applications for enterprises, focusing on confidential multi-party computation and data availability. This update enhances throughput and latency, making it more suitable for real-world industrial applications. By supporting Linux and cross-platform environments, CCF enables manufacturers to develop scalable and secure blockchain solutions tailored to their needs.
- In March 2025, Huawei launched HarmonyOS NEXT 5.0.1, a major update to its proprietary operating system. This version introduces a microkernel architecture and improved support for distributed applications, making it ideal for IoT and smart manufacturing environments. HarmonyOS NEXT aims to provide a seamless and secure platform for connected devices in industrial settings, enhancing interoperability and efficiency.
- In November 2024, Huawei announced plans to begin mass production of its Ascend 910C AI chip in early 2025. Manufactured by Semiconductor Manufacturing International Corp (SMIC), this chip is designed to accelerate AI and blockchain applications in manufacturing. The Ascend 910C aims to enhance data processing capabilities, supporting real-time analytics and decision-making in industrial operations.
- In June 2024, Huawei unveiled PanGu AI Model 5.0, an advanced large language model designed for various industries, including manufacturing. This model offers enhanced capabilities in natural language processing and machine learning, facilitating smarter automation and decision-making in industrial settings. PanGu AI Model 5.0 aims to support manufacturers in optimizing operations and driving innovation.
