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Global Board-to-Board Connectors Market – Industry Trends and Forecast to 2031

Semiconductors and Electronics

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Global Board-to-Board Connectors Market – Industry Trends and Forecast to 2031

  • Semiconductors and Electronics
  • Upcoming Report
  • Feb 2024
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

Global Board-to-Board Connectors Market – Industry Trends and Forecast to 2031

Market Size in USD Billion

CAGR :  % Diagram

Diagram Forecast Period 2023–2031
Diagram Market Size (Base Year) USD 190.46 Million
Diagram Market Size (Forecast Year) USD 241.27 Million
Diagram CAGR %

Global Board-to-Board Connectors Market, By Type (Pin Header, and Socket), Component (Less than 1mm, 1mm to 2mm, Greater than 2 mm), End-User  (Automotive, Consumer Electronics, Healthcare, IT & Telecommunication, Transportation, Others) - Industry Trends and Forecast to 2031.

Board-to-Board Connectors Market

Board-to-Board Connectors Market Analysis and Size

Premium PCB connectors, suitable for various scenarios, offer superior quality at competitive prices. The GCT Board-to-Board range comprises over 160 standard parts with pitches spanning from 0.8mm to 5.08mm, providing selectable pin lengths and insulator heights to meet diverse requirements.

Data Bridge Market Research analyzes that the global board-to-board connectors market, which was USD 190.46 million in 2023, would rocket up to USD 241.27 million by 2031 and is expected to undergo a CAGR of 3.00% during the forecast period.  “Pin Header” dominates the type segment of the market due to its versatility, reliability, and cost-effectiveness. Pin headers offer a wide range of pitch options and can accommodate various PCB layouts, making them a preferred choice for many electronic applications.

In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.

Report Scope and Market Segmentation

Report Metric

Details

Forecast Period

2024 to 2031

Base Year

2023

Historic Years

2022 (Customizable to 2016-2021)

Quantitative Units

Revenue in USD Million, Volumes in Units, Pricing in USD

Segments Covered

Type (Pin Header, and Socket), Component (Less than 1mm, 1mm to 2mm, Greater than 2 mm), End-User  (Automotive, Consumer Electronics, Healthcare, IT & Telecommunication, Transportation, Others)

Countries Covered

U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E., South Africa, Egypt, Israel, Rest of the Middle East and Africa

Market Players Covered

TE Connectivity (U.S.), Molex, LLC (U.S.), Amphenol ICC (Singapore), ERNI Deutschland GmbH (Germany), 3M (U.S.), CSCONN Precise Electronics Co., Ltd (Taiwan), Harwin (U.K.), FUJITSU (Japan), KYOCERA Corporation (Japan), OMRON Corporation (Japan), Panasonic Electric Works Europe AG (Germany), Foxconn (Taiwan), JAE (Japan), JST (Japan), Advanced Interconnect (U.S.), AirBorn, Inc (U.S.), Samtec (U.S.), HARTING Technology Group (Germany), YAMAICHI (Japan), Hirose (Japan )

Market Opportunities

  • 5G deployment
  • Surge in IoT (Internet of Things) Applications

Market Definition

Board-to-board connectors helps in manufacturing, distribution, and utilization of connectors designed for interconnecting electronic circuit boards. These connectors play a pivotal role in facilitating seamless communication and data transfer between various components within electronic devices. The market encompasses a range of connector types, catering to diverse applications in sectors such as telecommunications, automotive, consumer electronics, and industrial equipment. It involves the supply chain from manufacturers to end-users, encompassing design, production, and integration services. Market dynamics are influenced by technological advancements, industry applications, and global demand for compact, high-performance electronics.

Global Board-to-Board Connectors Market Dynamics

Drivers

  • Technological Advancements

Ongoing technological advancements in various industries, such as automotive and telecommunications, are propelling the demand for sophisticated board-to-board connectors. These connectors play a crucial role in enhancing the efficiency and functionality of modern electronic systems.

  • Growing Demand for Compact and High-Performance Electronics

The increasing need for smaller and more powerful electronic devices is a key driver for the Global Board-to-Board Connectors Market. This demand fuels innovation and fosters the development of compact, high-performance connectors..

Restraints

  • Supply Chain Disruptions

The market is impacted by global supply chain disruptions, presenting a restraint. Factors such as geopolitical tensions and the ongoing pandemic contribute to uncertainties in the supply chain, affecting the timely availability of components.

Opportunities

  • 5G Deployment

The global shift towards 5G technology creates an opportunity for board-to-board connectors. The expansion of 5G networks necessitates advanced connectors to support the increased data speeds and connectivity demands.

  • Surge in IoT (Internet of Things) Applications

The increasing adoption of IoT across industries provides a significant growth opportunity for the board-to-board connectors market. As IoT devices proliferate, there is a rising demand for reliable and efficient connectors to ensure seamless connectivity.

Challenges

  • Regulatory Compliance and Standards

Meeting and adhering to evolving regulatory standards pose a challenge in the board-to-board connectors market. Manufacturers must navigate and comply with diverse regulations, impacting product development and market entry strategies.

This board-to-board connectors market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, the impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the board-to-board connectors market contact the Data Bridge Market Research for an Analyst Brief, our team will help you make an informed market decision to achieve market growth.

Recent Developments

  • In December 2021, D-2970 Dynamic Series PCB Connectors are compact 5mm-pitch wire-to-board PCB connectors with field-installable, time-saving push-in clamp terminations. Featered in the product sportlight which was the part of video series
  • In May 2020, Panasonic Corporation announced begning of sample shipmen of a Board to FPC Connector for 5G millimeter-wave antenna module to meet the growing demand of5G millimeter-wave spectrum (28 GHz band)

Global Board-to-Board Connectors Market Scope

The board-to-board connectors market is segmented on the basis of type, component and end-user. The growth amongst these segments will help you analyze meager growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Type

  • Pin Header
  • Socket

Component

  • Less than 1mm,
  • 1mm to 2mm,
  • Greater than 2 mm

End-User

  • Automotive
  • Consumer Electronics
  • Healthcare
  • IT & Telecommunication
  • Transportation
  • Others

Global Board-to-Board Connectors Market Region Analysis/Insights

The board-to-board connectors market is analyzed and market size insights and trends are provided by type, component and end-user as referenced above.

The countries covered in the market report are U.S., Canada, Mexico, Brazil, Argentina, rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, rest of Asia-Pacific, Saudi Arabia, U.A.E., South Africa, Egypt, Israel, and rest of the Middle East and Africa.

Asia-Pacific is expected to dominate the board-to-board connectors market due to a number of factors. The region is a major electronics manufacturing hub, thus creating a strong demand for connectors. In addition, the presence of major industry participants, cost-effective manufacturing processes, and a highly skilled labor force have contributed to the region's market leadership position. Furthermore, the region's expanding consumer electronics and automotive sectors are driving the demand for sophisticated board-to-board connectors.

North America is the fastest growing region due to a surge in demand for advanced electronic devices and expanding applications in industries such as telecommunications and automotive. The region benefits from a robust technological infrastructure, driving innovation and adoption of high-performance connectors.

The region section of the report also provides individual market-impacting factors and changes in regulation in the market domestically that impact the current and future trends of the market. Data points like downstream and upstream value chain analysis, technical trends, and Porter’s five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and the challenges faced due to large or scarce competition from local and domestic brands, the impact of domestic tariffs, and trade routes are considered while providing forecast analysis of the region data.   

Competitive Landscape and Global Board-to-Board Connectors Market Share Analysis

The board-to-board connectors market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, regional presence, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to the board-to-board connectors market.

Some of the major players operating in the board-to-board connectors market are:

  •  TE Connectivity (U.S.)
  • Molex, LLC (U.S.)
  • Amphenol ICC (Singapore)
  • ERNI Deutschland GmbH (Germany)
  • CSCONN Precise Electronics Co., Ltd (Taiwan)
  • Harwin (U.K.)
  • FUJITSU (Japan)
  • KYOCERA Corporation (Japan)
  • OMRON Corporation (Japan)
  • Panasonic Electric Works Europe AG (Germany)
  • Foxconn (Taiwan)
  • JAE (Japan)
  • JST (Japan)
  • Advanced Interconnect (U.S.)
  • AirBorn, Inc (U.S.)
  • Samtec (U.S.)
  • HARTING Technology Group (Germany)
  • YAMAICHI (Japan)
  • Hirose (Japan)


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Research Methodology:

Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.

The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.

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Customization Available:

Data Bridge Market Research is a leader in advanced formative research. We take pride in servicing our existing and new customers with data and analysis that match and suits their goal. The report can be customized to include price trend analysis of target brands understanding the market for additional countries (ask for the list of countries), clinical trial results data, literature review, refurbished market and product base analysis. Market analysis of target competitors can be analyzed from technology-based analysis to market portfolio strategies. We can add as many competitors that you require data about in the format and data style you are looking for. Our team of analysts can also provide you data in crude raw excel files pivot tables (Fact book) or can assist you in creating presentations from the data sets available in the report.

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FREQUENTLY ASK QUESTIONS

The board-to-board connectors market size will be worth USD 241.27 million by 2031.
The growth rate of the board-to-board connectors market is 3.00% by 2031.
Technological advancements & growing demand for compact and high-performance electronics are the growth drivers of the are the growth drivers of the board-to-board connectors market.
Type, component, and end-user are the factors on which the board-to-board connectors market research is based.
Major companies in the board-to-board connectors market are TE Connectivity (U.S.), Molex, LLC (U.S.), Amphenol ICC (Singapore), ERNI Deutschland GmbH (Germany), 3M (U.S.), CSCONN Precise Electronics Co., Ltd (Taiwan), Harwin (U.K.), FUJITSU (Japan), KYOCERA Corporation (Japan), OMRON Corporation (Japan), Panasonic Electric Works Europe AG (Germany), Foxconn (Taiwan), JAE (Japan), JST (Japan), Advanced Interconnect (U.S.), AirBorn, Inc (U.S.), Samtec (U.S.), HARTING Technology Group (Germany), YAMAICHI (Japan), Hirose (Japan ).
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