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In April 2024, Applied Materials Inc. unveiled its latest Endura® CVD platform upgrade, designed to meet the complex film requirements of next-generation semiconductor nodes below 2nm. This new system enhances productivity, film quality, and integration flexibility, supporting chipmakers’ efforts to improve performance and energy efficiency in advanced logic and memory devices.
- In March 2024, Tokyo Electron Limited announced the expansion of its CVD equipment manufacturing facility in Japan to address rising global demand from leading foundries and integrated device manufacturers. The investment strengthens Tokyo Electron’s supply capabilities and supports the delivery of advanced thin-film technologies used in high-volume semiconductor production.
- In February 2024, Lam Research Corporation introduced a new plasma-enhanced CVD tool aimed at advanced packaging and 3D integration applications. The system provides improved film conformity and reduced thermal budget, helping customers overcome scaling challenges and enhance reliability in heterogeneous chip architectures.
- In January 2024, Veeco Instruments Inc. launched a next-generation MOCVD system tailored for high-efficiency power electronics and micro-LED production. The tool features enhanced automation, lower defect density, and superior process control, addressing growing demand for compound semiconductors in electric vehicles and consumer displays.
- In December 2023, ASM International opened a state-of-the-art research and development center in the Netherlands focused on atomic-layer CVD processes. The new facility accelerates innovation in nanoscale material deposition and supports collaboration with European chipmakers working on advanced nodes, quantum computing, and energy-efficient technologies.
