Table of Content
1 INTRODUCTION
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 OVERVIEW OF GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET
1.4 CURRENCY AND PRICING
1.5 LIMITATION
1.6 MARKETS COVERED
2 MARKET SEGMENTATION
2.1 KEY TAKEAWAYS
2.2 ARRIVING AT THE GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET
2.2.1 VENDOR POSITIONING GRID
2.2.2 TECHNOLOGY LIFE LINE CURVE
2.2.3 MARKET GUIDE
2.2.4 COMPANY POSITIONING GRID
2.2.5 COMAPANY MARKET SHARE ANALYSIS
2.2.6 MULTIVARIATE MODELLING
2.2.7 TOP TO BOTTOM ANALYSIS
2.2.8 STANDARDS OF MEASUREMENT
2.2.9 VENDOR SHARE ANALYSIS
2.2.10 DATA POINTS FROM KEY PRIMARY INTERVIEWS
2.2.11 DATA POINTS FROM KEY SECONDARY DATABASES
2.3 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET: RESEARCH SNAPSHOT
2.4 ASSUMPTIONS
3 MARKET OVERVIEW
3.1 DRIVERS
3.2 RESTRAINTS
3.3 OPPORTUNITIES
3.4 CHALLENGES
4 EXECUTIVE SUMMARY
5 PREMIUM INSIGHT
5.1 PORTERS FIVE FORCES
5.2 REGULATORY STANDARDS
5.3 TECHNOLOGICAL TRENDS
5.4 CASE STUDY
5.5 VALUE CHAIN ANALYSIS
5.6 PRICING ANALYSIS
5.7 COMPANY COMPARITIVE ANALYSIS
6 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY TYPE
6.1 OVERVIEW
6.2 WAFER LEVEL CSP
6.2.1 BY TECHNOLOGY
6.2.1.1. FAN-IN
6.2.1.2. FAN-OUT
6.3 FLIP CHIP CSP
6.4 LEAD FRAME CSP
6.5 WIRE BOND CSP
6.6 BALL GRID ARRAY CSP
6.7 OTHERS
7 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY MATERIAL
7.1 OVERVIEW
7.2 PLASTIC
7.3 GLASS
7.4 METAL
7.5 OTHERS
8 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY CHIP SIZE
8.1 OVERVIEW
8.2 UPTO 5 MM
8.3 5 – 10MM
8.4 10 – 20 MM
8.5 ABOVE 20 MM
9 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY APPLICATION
9.1 OVERVIEW
9.2 MEMORY CARD
9.3 FLASH
9.4 CONTROLLER
9.5 RADIO COMMUNICATION
9.6 POWER MANAGEMENT IC
9.7 RADIO FREQUENCY
9.8 OPTOELECTRONIC DEVICE
9.9 CELLULAR PHONE
9.1 OTHERS
10 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY END USER
10.1 OVERVIEW
10.2 ELECTRONICS & SEMICONDUCTOR
10.2.1 BY TYPE
10.2.1.1. WAFER LEVEL CSP
10.2.1.2. FLIP CHIP CSP
10.2.1.3. LEAD FRAME CSP
10.2.1.4. WIRE BOND CSP
10.2.1.5. BALL GRID ARRAY CSP
10.2.1.6. OTHERS
10.2.2 BY APPLICATION
10.2.2.1. MEMORY CARD
10.2.2.2. FLASH
10.2.2.3. CONTROLLER
10.2.2.4. RADIO COMMUNICATION
10.2.2.5. POWER MANAGEMENT IC
10.2.2.6. RADIO FREQUENCY
10.2.2.7. OPTOELECTRONIC DEVICE
10.2.2.8. CELLULAR PHONE
10.2.2.9. OTHERS
10.3 AUTOMOTIVE
10.3.1 BY TYPE
10.3.1.1. WAFER LEVEL CSP
10.3.1.2. FLIP CHIP CSP
10.3.1.3. LEAD FRAME CSP
10.3.1.4. WIRE BOND CSP
10.3.1.5. BALL GRID ARRAY CSP
10.3.1.6. OTHERS
10.3.2 BY APPLICATION
10.3.2.1. MEMORY CARD
10.3.2.2. FLASH
10.3.2.3. CONTROLLER
10.3.2.4. RADIO COMMUNICATION
10.3.2.5. POWER MANAGEMENT IC
10.3.2.6. RADIO FREQUENCY
10.3.2.7. OPTOELECTRONIC DEVICE
10.3.2.8. CELLULAR PHONE
10.3.2.9. OTHERS
10.4 IT & TELECOM
10.4.1 BY TYPE
10.4.1.1. WAFER LEVEL CSP
10.4.1.2. FLIP CHIP CSP
10.4.1.3. LEAD FRAME CSP
10.4.1.4. WIRE BOND CSP
10.4.1.5. BALL GRID ARRAY CSP
10.4.1.6. OTHERS
10.4.2 BY APPLICATION
10.4.2.1. MEMORY CARD
10.4.2.2. FLASH
10.4.2.3. CONTROLLER
10.4.2.4. RADIO COMMUNICATION
10.4.2.5. POWER MANAGEMENT IC
10.4.2.6. RADIO FREQUENCY
10.4.2.7. OPTOELECTRONIC DEVICE
10.4.2.8. CELLULAR PHONE
10.4.2.9. OTHERS
10.5 AEROSPACE & DEFENCE
10.5.1 BY TYPE
10.5.1.1. WAFER LEVEL CSP
10.5.1.2. FLIP CHIP CSP
10.5.1.3. LEAD FRAME CSP
10.5.1.4. WIRE BOND CSP
10.5.1.5. BALL GRID ARRAY CSP
10.5.1.6. OTHERS
10.5.2 BY APPLICATION
10.5.2.1. MEMORY CARD
10.5.2.2. FLASH
10.5.2.3. CONTROLLER
10.5.2.4. RADIO COMMUNICATION
10.5.2.5. POWER MANAGEMENT IC
10.5.2.6. RADIO FREQUENCY
10.5.2.7. OPTOELECTRONIC DEVICE
10.5.2.8. CELLULAR PHONE
10.5.2.9. OTHERS
10.6 OTHERS
11 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY GEOGRAPHY
11.1 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)
11.1.1 NORTH AMERICA
11.1.1.1. U.S.
11.1.1.2. CANADA
11.1.1.3. MEXICO
11.1.2 EUROPE
11.1.2.1. GERMANY
11.1.2.2. FRANCE
11.1.2.3. U.K.
11.1.2.4. ITALY
11.1.2.5. SPAIN
11.1.2.6. RUSSIA
11.1.2.7. TURKEY
11.1.2.8. BELGIUM
11.1.2.9. NETHERLANDS
11.1.2.10. NORWAY
11.1.2.11. FINLAND
11.1.2.12. SWITZERLAND
11.1.2.13. DENMARK
11.1.2.14. SWEDEN
11.1.2.15. POLAND
11.1.2.16. REST OF EUROPE
11.1.3 ASIA PACIFIC
11.1.3.1. JAPAN
11.1.3.2. CHINA
11.1.3.3. SOUTH KOREA
11.1.3.4. INDIA
11.1.3.5. AUSTRALIA
11.1.3.6. NEW ZEALAND
11.1.3.7. SINGAPORE
11.1.3.8. THAILAND
11.1.3.9. MALAYSIA
11.1.3.10. INDONESIA
11.1.3.11. PHILIPPINES
11.1.3.12. TAIWAN
11.1.3.13. VIETNAM
11.1.3.14. REST OF ASIA PACIFIC
11.1.4 SOUTH AMERICA
11.1.4.1. BRAZIL
11.1.4.2. ARGENTINA
11.1.4.3. REST OF SOUTH AMERICA
11.1.5 MIDDLE EAST AND AFRICA
11.1.5.1. SOUTH AFRICA
11.1.5.2. EGYPT
11.1.5.3. SAUDI ARABIA
11.1.5.4. U.A.E
11.1.5.5. OMAN
11.1.5.6. BAHRAIN
11.1.5.7. ISRAEL
11.1.5.8. KUWAIT
11.1.5.9. QATAR
11.1.5.10. REST OF MIDDLE EAST AND AFRICA
11.2 KEY PRIMARY INSIGHTS: BY MAJOR COUNTRIES
12 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, COMPANY LANDSCAPE
12.1 COMPANY SHARE ANALYSIS: GLOBAL
12.2 COMPANY SHARE ANALYSIS: NORTH AMERICA
12.3 COMPANY SHARE ANALYSIS: EUROPE
12.4 COMPANY SHARE ANALYSIS: ASIA PACIFIC
12.5 MERGERS & ACQUISITIONS
12.6 NEW PRODUCT DEVELOPMENT AND APPROVALS
12.7 EXPANSIONS
12.8 REGULATORY CHANGES
12.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS
13 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, SWOT & DBMR ANALYSIS
14 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, COMPANY PROFILE
14.1 QUALCOMM TECHNOLOGIES, INC.
14.1.1 COMPANY SNAPSHOT
14.1.2 REVENUE ANALYSIS
14.1.3 PRODUCT PORTFOLIO
14.1.4 RECENT DEVELOPMENT
14.2 AMKOR TECHNOLOGY
14.2.1 COMPANY SNAPSHOT
14.2.2 REVENUE ANALYSIS
14.2.3 PRODUCT PORTFOLIO
14.2.4 RECENT DEVELOPMENT
14.3 SAMSUNG ELECTRO-MECHANICS
14.3.1 COMPANY SNAPSHOT
14.3.2 REVENUE ANALYSIS
14.3.3 PRODUCT PORTFOLIO
14.3.4 RECENT DEVELOPMENT
14.4 DECA TECHNOLOGIES
14.4.1 COMPANY SNAPSHOT
14.4.2 REVENUE ANALYSIS
14.4.3 PRODUCT PORTFOLIO
14.4.4 RECENT DEVELOPMENT
14.5 FRAUNHOFER ISIT
14.5.1 COMPANY SNAPSHOT
14.5.2 REVENUE ANALYSIS
14.5.3 PRODUCT PORTFOLIO
14.5.4 RECENT DEVELOPMENT
14.6 FUJITSU
14.6.1 COMPANY SNAPSHOT
14.6.2 REVENUE ANALYSIS
14.6.3 PRODUCT PORTFOLIO
14.6.4 RECENT DEVELOPMENT
14.7 CHINA WAFER LEVEL CSP CO., LTD
14.7.1 COMPANY SNAPSHOT
14.7.2 REVENUE ANALYSIS
14.7.3 PRODUCT PORTFOLIO
14.7.4 RECENT DEVELOPMENT
14.8 MICROSS
14.8.1 COMPANY SNAPSHOT
14.8.2 REVENUE ANALYSIS
14.8.3 PRODUCT PORTFOLIO
14.8.4 RECENT DEVELOPMENT
14.9 MADPCB
14.9.1 COMPANY SNAPSHOT
14.9.2 REVENUE ANALYSIS
14.9.3 PRODUCT PORTFOLIO
14.9.4 RECENT DEVELOPMENT
14.1 ASE
14.10.1 COMPANY SNAPSHOT
14.10.2 REVENUE ANALYSIS
14.10.3 PRODUCT PORTFOLIO
14.10.4 RECENT DEVELOPMENT
14.11 JCET GROUP
14.11.1 COMPANY SNAPSHOT
14.11.2 REVENUE ANALYSIS
14.11.3 PRODUCT PORTFOLIO
14.11.4 RECENT DEVELOPMENT
14.12 SILICONWARE PRECISION INDUSTRIES CO., LTD
14.12.1 COMPANY SNAPSHOT
14.12.2 REVENUE ANALYSIS
14.12.3 PRODUCT PORTFOLIO
14.12.4 RECENT DEVELOPMENT
14.13 POWERTECH TECHNOLOGY INC.
14.13.1 COMPANY SNAPSHOT
14.13.2 REVENUE ANALYSIS
14.13.3 PRODUCT PORTFOLIO
14.13.4 RECENT DEVELOPMENT
14.14 UNISEM
14.14.1 COMPANY SNAPSHOT
14.14.2 REVENUE ANALYSIS
14.14.3 PRODUCT PORTFOLIO
14.14.4 RECENT DEVELOPMENT
14.15 UTAC
14.15.1 COMPANY SNAPSHOT
14.15.2 REVENUE ANALYSIS
14.15.3 PRODUCT PORTFOLIO
14.15.4 RECENT DEVELOPMENT
14.16 KING YUAN ELECTRONICS CO., LTD.
14.16.1 COMPANY SNAPSHOT
14.16.2 REVENUE ANALYSIS
14.16.3 PRODUCT PORTFOLIO
14.16.4 RECENT DEVELOPMENT
14.17 CHIPMOS TECHNOLOGIES INC.
14.17.1 COMPANY SNAPSHOT
14.17.2 REVENUE ANALYSIS
14.17.3 PRODUCT PORTFOLIO
14.17.4 RECENT DEVELOPMENT
14.18 ECI TECHNOLOGY
14.18.1 COMPANY SNAPSHOT
14.18.2 REVENUE ANALYSIS
14.18.3 PRODUCT PORTFOLIO
14.18.4 RECENT DEVELOPMENT
14.19 ANALOG DEVICES, INC.
14.19.1 COMPANY SNAPSHOT
14.19.2 REVENUE ANALYSIS
14.19.3 PRODUCT PORTFOLIO
14.19.4 RECENT DEVELOPMENT
14.2 KLA CORPORATION.
14.20.1 COMPANY SNAPSHOT
14.20.2 REVENUE ANALYSIS
14.20.3 PRODUCT PORTFOLIO
14.20.4 RECENT DEVELOPMENT
14.21 BREWER SCIENCE, INC
14.21.1 COMPANY SNAPSHOT
14.21.2 REVENUE ANALYSIS
14.21.3 PRODUCT PORTFOLIO
14.21.4 RECENT DEVELOPMENT
14.22 CHIPBOND TECHNOLOGY CORPORATION
14.22.1 COMPANY SNAPSHOT
14.22.2 REVENUE ANALYSIS
14.22.3 PRODUCT PORTFOLIO
14.22.4 RECENT DEVELOPMENT
NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDY AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST
15 CONCLUSION
16 QUESTIONNAIRE
17 RELATED REPORTS
18 ABOUT DATA BRIDGE MARKET RESEARCH
