Global Chip Scale Package (CSP) LED Market By Application (BLU, General Lighting, Automotive Lighting, Flash Lighting, Others), Power Range (Low & Mid-Power, High-Power), End-User (Industrial, Residential, Commercial), Geography (North America, Europe, Asia-Pacific, South America, Middle East and Africa) – Industry Trends and Forecast to 2026
Market Analysis: Global Chip Scale Package (CSP) LED Market
Global chip scale package (CSP) LED market is expected to rise to an estimated value of USD 2909.43 million by 2026, registering a healthy CAGR in the forecast period of 2019-2026. This rise in market value can be attributed to the various benefits associated with the product such as wide beam angle, high density in packages along with small form factor.
Market Definition: Global Chip Scale Package (CSP) LED Market
Chip scale package (CSP) light emitting diode (LED) is a type of integrated circuit structure providing illumination by equipping the circuit package with an LED light. These packages are less than 20% of the size of an LED chip and are revolutionary technologies helping reduce the requirement of additional components for manufacturing of these packages.
- Lower cost as compared to other forms of LED packages due to their reduced cost of packaging; this factor is expected to drive the growth of the market
- Reduce resistance against thermal energy along with consistent current spread in these products also acts as a market driver
- Increasing areas of application with growing industries worldwide is another factor boosting the market growth
- Increasing prevalence of market players present across the various geographical regions of the world helping expand the market share will also drive the market growth in the forecast period
- Concerns regarding high pressure on LED foundries; this factor is expected to hinder the growth of the market
- Lack of applications in economical options resulting in application for premium product range will also restrict the market growth
- Large levels of wastage of thermal energy; this factor is expected acts as a market restraint
Segmentation: Global Chip Scale Package (CSP) LED Market
- Backlighting Unit (BLU)
- General Lighting
- Automotive Lighting
- Flash Lighting
By Power Range
- Low & Mid-Power
- North America
- Rest of Europe
- South Korea
- Rest of Asia-Pacific
- South America
- Rest of South America
- Middle East and Africa
- Saudi Arabia
- South Africa
- Rest of Middle East and Africa
Key Developments in the Market:
- In March 2018, OSRAM GmbH announced that their subsidiary OSRAM Opto Semiconductors GmbH displayed the prototype of “Oslon Pure 1010” during the “Light+Building” exhibiting held in Frankfurt, Germany. The prototype was sized at 1mm * 1mm and has been designed for use in spotlights used in retail lighting. The scalability of this CSP LED package has been produced for flexibility of individual lighting options
- In January 2018, LG INNOTEK announced that they had successfully developed an advanced flip chip LED package capable of operating on a high efficiency and high luminous flux and performance characteristics even after undergoing the soldering process generally involving temperatures of up to 3000C. The package has been developed by enhancing the structure of the package internally having a specialised production process and innovating the mounting technology
Global chip scale package (CSP) LED market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of chip scale package (CSP) LED market for Global, Europe, North America, Asia-Pacific, South America and Middle East & Africa.
Major Market Competitors/Players
Few of the major competitors currently working in the global chip scale package (CSP) LED market are Lumileds Holding B.V.; OSRAM GmbH; SAMSUNG; Semiconductor Co., Ltd.; LG INNOTEK; NICHIA CORPORATION; Cree, Inc.; Genesis Photonics Inc.; SEMILEDS CORPORATION; Lumens Co., Ltd.; Lextar Electronics Corporation; Shenzhen MTC; Unistars; Plessey; ShenZhen Dpower Opto-electronic Co.,Ltd; Hongli Zhihui Group Co.,LTD.; Bridgelux, Inc.; ProLight Opto Technology Corporation; EVERLIGHT among others.
Research Methodology: Global Chip Scale Package (CSP) LED Market
Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analysed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please request an analyst call or can drop down your enquiry.
The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market, and primary (industry expert) validation. Apart from this, other data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Company Market Share Analysis, Standards of Measurement, Top to Bottom Analysis and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.
Key Insights in the report:
- Complete and distinct analysis of the market drivers and restraints
- Key market players involved in this industry
- Detailed analysis of the market segmentation
- Competitive analysis of the key players involved