- Traditional LEDs generally undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a yielding a packaged LED, ceramic substrate or LED package.
- Chip-scale package (CSP) LEDs have some separate steps of having manufactured chips going through a packaging line which are eliminated because at the die-level itself the chips are cingulated and coated with phosphor.
- Asia-pacific dominates the chip-scale package (CSP) LEDs market due to rising presence of key market players, rising demand for CSP LED by the automotive industry for replacement of headlights and increasing adoption in general lighting applications in this region.
- North America is expected to be the fastest growing region in the Chip-Scale Package (CSP) LEDs Market during the forecast period due to increasing demand for energy-efficient lighting solutions and advancements in LED technology across industries like automotive, consumer electronics, and general lighting.
- High-Power segment is expected to dominate the market with a market share of 52.89% due to its superior brightness and thermal performance. These LEDs are ideal for demanding applications like automotive lighting and outdoor displays where high intensity is required.
