Global Die Bonder Equipment Market, By Type (Manual Die Bonders, Semiautomatic Die Bonders, Fully Automatic Die Bonders), Bonding Technique (Epoxy, Eutectic, Soft Solder, Others), Supply Chain Participant (Osat Companies, IDM Firms), Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace and Defence), Device (Optoelectronics, MEMS and MOEMs, Power Devices), Country (U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, U.A.E, Saudi Arabia, Egypt, South Africa, Israel, Rest of Middle East and Africa)- Industry Trends and Forecast to 2029.
Market Analysis and Insights of Die Bonder Equipment Market
Die bonder equipment market is expected to gain market growth in the forecast period of 2022 to 2029. Data Bridge Market Research analyses the die bonder equipment market to exhibit a CAGR of 3.6% for the forecast period of 2022 to 2029.
A die bonder is basically a system that aids in the placement of a semiconductor device, and die bonder equipment is a type of assemble equipment and semiconductor packaging used to fabricate semiconductor devices. The primary function of a die bonder is to remove the die from the wafer and attach it to a substrate. It is widely used across the various applications such as the consumer electronics, automotive, industrial, telecommunications, healthcare, aerospace and defence.
The rising adoption of hybrid laptops, high definition television, and rising urbanization will emerge as the major factor driving market growth. The various growth determinants such as the Introduction of stacked die technology in internet of things enabled devices, surging demand of 3D semiconductor assembly and packaging and increasing demand of semiconductor integrated circuits estimated to boost the overall growth of the market for the forecast period of 2022 to 2029. In addition to this, the factors such as the growing demand for miniature electronic components and the increasing adoption of stacked die technology in IOT devices will further aggravate the market value for the forecast period of 2022 to 2029. On the other hand, the high cost of ownership, act as a restraint for the market.
In addition to this, the increasing demand of polymer adhesive water bonding equipment and high cost of ownership are estimated to create new opportunities for growing the market within the forecast period. On the flip side, the mechanical unbalance of moving parts result as a challenge for the market for the forecast period of 2022 to 2029.
This die bonder equipment market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on die bonder equipment market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Global Die Bonder Equipment Market Scope and Market Size
The die bonder equipment market is segmented on the basis of type, bonding technique, supply chain participant, application and device. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
- Die bonder equipment market on the basis of type has been segmented as manual die bonders, semiautomatic die bonders and fully automatic die bonders.
- Based on bonding technique, die bonder equipment market has been segmented into epoxy, eutectic, soft solder and others.
- On the basis of supply chain participant, die bonder equipment market has been segmented into Osat companies and IDM firms.
- On the basis of application, die bonder equipment market has been segmented into consumer electronics, automotive, industrial, telecommunications, healthcare, aerospace and defence.
- Die bonder equipment has also been segmented on the basis of device into optoelectronics, MEMS and MOEMs and power devices.
Die Bonder Equipment Market Country Level Analysis
The die bonder equipment market is segmented on the basis of type, bonding technique, supply chain participant, application and device.
The countries covered in the die bonder equipment market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
North America region dominates the die bonder equipment market due to the surging demand of semiconductor ICs within the region for the forecast period of 2022 to 2029. The Asia-Pacific region is projected to undergo substantial during the forecast period due to the rising demand of tablets and smartphones and the prevalence of a large number of manufacturers within the region.
The country section of the die bonder equipment market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Die Bonder Equipment Market Share Analysis
The die bonder equipment market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to die bonder equipment market.
Some of the major players operating in the die bonder equipment market report are Besi, ASM Pacific Technology., Kulicke & Soffa Industries, Inc., Mycronic, Palomar Technologies, West·Bond, Inc., MicroAssembly Technologies, Ltd., Finetech GmbH & Co. KG, TRESKY GmbH, SET Corporation SA, Hybond Inc., SHIBUYA CORPORATION, Paroteq GmbH, Tresky GmbH, diasautomation, SHINKAWA Electric Co., Ltd.., FOUR TECHNOS, FASFORD TECHNOLOGY CO.,LTD., and UniTemp GmbH, among others.
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