Latest Developments in Global Din Rail Power Supply Market

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Latest Developments in Global Din Rail Power Supply Market

  • ICT
  • Dec 2024
  • Global
  • 350 Pages
  • No of Tables: 819
  • No of Figures: 37

  • In October 2024, Siemens partnered with Alliander to enhance flexible grid management in the Netherlands, utilizing the Gridscale X platform to improve grid utilization by up to 30 percent. This collaboration addressed challenges related to the energy transition and helped manage increased customer demand for connections. As a result, Siemens strengthened its position as a key technology partner in the energy sector, contributing to a more sustainable and reliable grid for millions of customers
  • In February 2024, The Company revealed it had entered an agreement to acquire SEAM Group, enhancing its Electrification Service portfolio. This acquisition expanded ABB’s expertise in asset management and advisory services, addressing the rising demand for safer, smarter, and more sustainable operations across various industries
  • In October 2023, MEAN WELL has launched the DDRH-120/240 series, ultra-wide 250~1500Vdc DIN rail DC-DC converters. Featuring a fanless design, high isolation, and excellent EMC performance, these converters are ideal for renewable energy applications, including photovoltaics and energy storage systems
  • In June 2024, Schneider Electric launched the PowerLogic P7 digital power and control platform in South Africa, designed for complex and high-demand applications. The new platform replaced legacy protection relays, combining features from multiple product ranges into a single tool. This enhancement improved reliability and sustainability for advanced industrial applications, benefiting the company's energy management and automation solutions
  • In February 2024, Phoenix Contact's new extensions for ME-IO and ICS DIN rail connectors simplify the implementation of multi-module systems, enabling seamless communication across levels. These connectors facilitate data and signal transmission while optimizing PCB surface area for enhanced device development

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