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Global Electrically Conductive Epoxy Adhesive Market – Industry Trends and Forecast to 2031

Chemical and Materials

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Global Electrically Conductive Epoxy Adhesive Market – Industry Trends and Forecast to 2031

  • Chemical and Materials
  • Upcoming Report
  • Feb 2024
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

Global Electrically Conductive Epoxy Adhesive Market – Industry Trends and Forecast to 2031

Market Size in USD Billion

CAGR :  % Diagram

Diagram Forecast Period 2023–2031
Diagram Market Size (Base Year) USD 774.40 Million
Diagram Market Size (Forecast Year) USD 1335.90 Million
Diagram CAGR %

Global Electrically Conductive Epoxy Adhesive Market, Type (Isotropic Conductive Epoxy Adhesives, Anisotropic Conductive Epoxy Adhesives), Application (Automotive, Consumer Electronics, Aerospace, Biosciences, Others), Filler Material (Silver Fillers, Carbon Fillers, Copper Fillers, Others) – Industry Trends and Forecast to 2031.

Electrically Conductive Epoxy Adhesive Market

Electrically Conductive Epoxy Adhesive Market Analysis and Size

The electrically conductive epoxy adhesive market is primarily driven by the increasing demand for miniaturized electronic components and the growing trend towards lightweight and compact electronic devices. This adhesive solution offers superior conductivity, enabling efficient bonding in electronic applications such as microelectronics, consumer electronics, and automotive electronics. The expanding use of electrically conductive epoxy adhesives in the manufacturing of advanced electronic devices, including smartphones, wearables, and automotive sensors, is a key factor propelling market growth.

Data Bridge Market Research analyses that the electrically conductive epoxy adhesive market which was USD 774.4 million in 2023, will reach USD 1,335.90 million by 2031, and is expected to undergo a CAGR of 7.1% during the forecast period. “ isotropic conductive epoxy adhesives” dominates the application segment of the electrically conductive epoxy adhesive market due to their unique properties and versatility. These adhesives offer uniform electrical conductivity in all directions, providing consistent performance across the entire bonded area. This isotropic conductivity is crucial in applications where reliable electrical connections are essential, such as in microelectronics, where precision and consistency are key. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.

Report Scope and Market Segmentation

Report Metric

Details

Forecast Period

2024 to 2031

Base Year

2023

Historic Years

2022 (Customizable to 2016-2021)

Quantitative Units

Revenue in USD Million, Volumes in Units, Pricing in USD

Segments Covered

Type (Isotropic Conductive Epoxy Adhesives, Anisotropic Conductive Epoxy Adhesives), Application (Automotive, Consumer Electronics, Aerospace, Biosciences, Others), Filler Material (Silver Fillers, Carbon Fillers, Copper Fillers, Others)

Countries Covered

U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, U.A.E., Saudi Arabia, Egypt, South Africa, Israel, Rest of Middle East and Africa

Market Players Covered

Master Bond Inc. (U.S.), Panacol-Elosol GmbH (Germany), Aremco Products Inc. (U.S.), DuPont (U.S.), SOLVAY (Belgium), Dow (U.S.), Henkel AG & Co. KgaA (Germany), 3M (U.S.), Bostik (France), Sika AG (Switzerland), H.B. Fuller (U.S.), BASF SE (Germany), DAP Global Inc.(U.S.), Owens Corning (U.S.), The Chemours Company (U.S.), Paroc Group (Finland),  Kingspan Group (Ireland), Knauf Insulation (U.S.), DAIKIN (Japan),  GAF (U.S.), SOLVAY (Belgium), Saint-Gobain (France), Franklin International (U.S.), Illinois Tool Works Inc. (U.S.), AVERY DENNISON CORPORATION (U.S.)

Market Opportunities

  • Growth in the deployment of advanced technologies
  • High cost of raw material
  • Rising research and development opportunities

Market Definition

Electrically conductive epoxy adhesive is a specialized type of adhesive formulation designed to provide both adhesion and electrical conductivity when bonding electronic components or materials. It consists of a resin matrix, typically epoxy, and conductive fillers such as metallic particles (e.g., silver, copper, nickel) or carbon-based materials. The conductive fillers facilitate the flow of electricity within the adhesive, creating a path for electrical conduction.

Global Electrically Conductive Epoxy Adhesive Market Dynamics

Drivers

  • Growing electronics industry

The expanding electronics industry, driven by demand for smaller and more powerful electronic devices, is a significant driver for the electrically conductive epoxy adhesive market. The electrically conductive epoxy adhesive market is experiencing significant growth, largely driven by the expanding electronics industry. With a relentless push towards miniaturization, flexible electronics, and the increasing complexity of electronic devices, the demand for advanced bonding solutions has surged. Electrically conductive epoxy adhesives are playing a pivotal role in meeting these demands by providing reliable electrical connections, thermal conductivity, and mechanical strength.

  •  Increased demand for wearable devices

The rising popularity of wearable devices, which often require compact and lightweight electronic components, boosts the demand for electrically conductive epoxy adhesives. The electrically conductive epoxy adhesive market is witnessing a notable surge in demand, propelled by the increased popularity and adoption of wearable devices. As consumers embrace wearable technology, such as smartwatches, fitness trackers, and medical devices, the need for reliable and efficient bonding solutions becomes paramount. Electrically conductive epoxy adhesives play a crucial role in these devices by ensuring the secure assembly and connectivity of miniaturized electronic components.

Opportunities

  • Emerging technologies

Opportunities arise from the integration of electrically conductive epoxy adhesives in emerging technologies such as flexible electronics, Internet of Things (IoT) devices, and 5G infrastructure. The electrically conductive epoxy adhesive market is undergoing a transformative phase driven by the integration of various emerging technologies. Nanotechnology plays a pivotal role, with nanoparticles like silver and carbon nanotubes enhancing the electrical, mechanical, and thermal properties of adhesives. The advent of flexible electronics has spurred the development of adhesives capable of accommodating bendable displays and wearable devices, ensuring both electrical conductivity and flexibility.

  • Increasing complexity of automotive electronics

The increasing complexity of automotive electronics, including sensors and control systems, presents a growth opportunity for electrically conductive epoxy adhesives in the automotive sector. the electrically conductive epoxy adhesive market is intricately linked to the increasing complexity of automotive electronics. As the automotive industry continues to embrace technological innovations, the demand for high-performance adhesives that can address the unique challenges of bonding and connectivity within intricate electronic systems is expected to grow, positioning electrically conductive epoxy adhesives as crucial components in the automotive manufacturing landscape.

Restraints/Challenges

  • Stringent environmental regulations

Adherence to environmental regulations and the need for eco-friendly formulations pose challenges for manufacturers in the development and use of conductive epoxy adhesives. stringent environmental regulations are reshaping the electrically conductive epoxy adhesive market by driving innovation towards formulations that are low in VOCs, compliant with hazardous substance restrictions, and aligned with broader sustainability goals. Adhesive manufacturers are navigating this regulatory landscape to offer products that not only meet high-performance standards but also contribute to a more environmentally responsible and sustainable future.

  •  Limited thermal stability

Some electrically conductive epoxy adhesives may have limitations in terms of thermal stability, restricting their use in applications that involve high temperatures or extreme temperature variations. Adhering to manufacturer guidelines and working with experienced HVAC professionals can provide valuable insights and ensure proper maintenance practices are followed. Also, the lack of favorable reimbursement scenarios and technology penetration in the developing economies, heavy custom duty imposed on medical devices, and lack of suitable infrastructure in low- and middle-income countries are projected to challenge the market in the forecast period of 2023-2030.

This electrically conductive epoxy adhesive market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, the impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the electrically conductive epoxy adhesive market contact Data Bridge Market Research for an Analyst Brief, our team will help you make an informed market decision to achieve market growth.

Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays

Data Bridge Market Research offers a high-level analysis of the market. It delivers information by considering the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions. Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.

Expected Impact of Economic Slowdown on the Pricing and Availability of Products

When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.

Recent Developments

  • In November 2022, A new generation of VORATRON™ MA 8200S high-bonding adhesives has been introduced by Dow (NYSE: DOW) at the 5th China International Import Expo (CIIE 2022). The New VORATRON™ MA 8200S high-bonding adhesives significantly enhance the safety, durability, sustainability, integrated assembly and overall performance of electric vehicles battery packs
  • In November 2022, Henkel continues to lead in consumer electronic material solutions and today announced its latest innovation, an electrically conductive adhesive (ECA) that cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs)

Global Electrically Conductive Epoxy Adhesive Market Scope

The electrically conductive epoxy adhesive market is segmented on the basis of type, application and filler material. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Type

  • Isotropic Conductive Epoxy Adhesives
  • Anisotropic Conductive Epoxy Adhesives

Application

  • Automotive
  • Consumer Electronics
  • Aerospace
  • Biosciences
  • Others

Filler Material

  • Silver Fillers
  • Carbon Fillers
  • Copper Fillers
  • Others

Global Electrically Conductive Epoxy Adhesive Market Regional Analysis/Insights

The electrically conductive epoxy adhesive market is analysed and market size insights and trends are provided by country, type, application and filler material as referenced above.

The countries covered in the market report are the U.S., Canada, Mexico, Germany, U.K., France, Italy, Spain, Russia, Poland, Switzerland, Netherlands, Hungary, Austria, Norway, Ireland, Turkey, Lithuania, rest of Europe, China, Japan, India, Australia, South Korea, Singapore, Thailand, Malaysia, Indonesia, Philippines, Vietnam, rest of Asia-Pacific, Brazil, Argentina, Peru, rest of South America, South Africa, Saudi Arabia, U.A.E., Israel, Kuwait, Egypt, and rest of Middle East & Africa.

Asia-Pacific is expected to dominate the market due to the presence of an optimum number of electronics companies and increasing progressions in the hardware business in this region.

North America is expected to witness significant growth due to the rapid industrial development such as electronics and automotive industry in the region.

The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impact the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends, and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, the impact of domestic tariffs, and trade routes are considered while providing forecast analysis of the country data.   

Competitive Landscape and Electrically Conductive Epoxy Adhesive Market Share Analysis

The electrically conductive epoxy adhesive market competitive landscape provides details by competitors. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width, and breadth, application dominance. The above data points provided are only related to the companies' focus related to the electrically conductive epoxy adhesive market.

Some of the major players operating in the electrically conductive epoxy adhesive market are:

  • Master Bond Inc. (U.S.)
  • Panacol-Elosol GmbH (Germany)
  • Aremco Products Inc. (U.S.)
  • DuPont (U.S.)
  • SOLVAY (Belgium)
  • Dow (U.S.)
  • Henkel AG & Co. KgaA (Germany)
  • 3M (U.S.)
  • Bostik (France)
  • Sika AG (Switzerland)
  • H.B. Fuller (U.S.)
  • BASF SE (Germany)
  • DAP Global Inc.(U.S.)
  • Owens Corning (U.S.)
  • The Chemours Company (U.S.)
  • Paroc Group (Finland)
  • Kingspan Group (Ireland)
  • Knauf Insulation (U.S.)
  • DAIKIN (Japan)
  • GAF (U.S.)
  • SOLVAY (Belgium)
  • Saint-Gobain (France)
  • Franklin International (U.S.)
  • Illinois Tool Works Inc. (U.S.)
  • AVERY DENNISON CORPORATION (U.S.)


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Research Methodology:

Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.

The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.

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Data Bridge Market Research is a leader in advanced formative research. We take pride in servicing our existing and new customers with data and analysis that match and suits their goal. The report can be customized to include price trend analysis of target brands understanding the market for additional countries (ask for the list of countries), clinical trial results data, literature review, refurbished market and product base analysis. Market analysis of target competitors can be analyzed from technology-based analysis to market portfolio strategies. We can add as many competitors that you require data about in the format and data style you are looking for. Our team of analysts can also provide you data in crude raw excel files pivot tables (Fact book) or can assist you in creating presentations from the data sets available in the report.

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FREQUENTLY ASK QUESTIONS

The Electrically Conductive Epoxy Adhesive Market size will be worth USD 1,335.90 million by 2031.
The Electrically Conductive Epoxy Adhesive Market growth rate is 7.1% during the forecast period.
The Growing electronics industry and Increased demand for wearable devices are the growth drivers of the Electrically Conductive Epoxy Adhesive Market.
The type, application, and filler material are the factors on which the Electrically Conductive Epoxy Adhesive Market research is based.
The major companies in the Electrically Conductive Epoxy Adhesive Market are Master Bond Inc. (U.S.), Panacol-Elosol GmbH (Germany), Aremco Products Inc. (U.S.), DuPont (U.S.), SOLVAY (Belgium), Dow (U.S.), Henkel AG & Co. KgaA (Germany), 3M (U.S.), Bostik (France), Sika AG (Switzerland), H.B. Fuller (U.S.), BASF SE (Germany), DAP Global Inc.(U.S.), Owens Corning (U.S.), The Chemours Company (U.S.), Paroc Group (Finland), Kingspan Group (Ireland), Knauf Insulation (U.S.), DAIKIN (Japan), GAF (U.S.), SOLVAY (Belgium), Saint-Gobain (France), Franklin International (U.S.), Illinois Tool Works Inc. (U.S.), AVERY DENNISON CORPORATION (U.S.).
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