- In February 2024, Cadence Design Systems completed the acquisition of AWR Corporation, a renowned provider of RF and microwave electronic design automation (EDA) software. This strategic move bolsters Cadence’s position in the wireless communications sector—especially in 5G, aerospace, automotive, and defense—by integrating AWR’s advanced simulation and design tools into its existing portfolio. The acquisition enhances Cadence’s ability to deliver end-to-end RF and microwave solutions, streamlining workflows across chip, package, and board-level design
- In January 2024, Siemens expanded its Mentor Graphics suite—now operating under the Siemens EDA brand—by integrating advanced features tailored for automotive chip development, particularly for autonomous vehicle systems. The enhancements focused on optimizing power efficiency, performance, and reliability in integrated circuit (IC) designs, addressing the stringent requirements of advanced driver assistance systems (ADAS) and next-generation mobility platforms. This move aligns with Siemens’ broader strategy to deliver end-to-end electronic design automation (EDA) solutions that support the growing complexity of automotive electronics
- In December 2023, ANSYS unveiled a suite of integrated electronic design automation (EDA) tools tailored for the development of 5G-enabled devices. These tools were designed to enhance simulation accuracy, power integrity analysis, and thermal reliability—key factors in optimizing performance and energy efficiency for next-generation telecommunications systems. The launch emphasized ANSYS’s commitment to supporting the increasingly complex demands of RF, microwave, and high-speed digital design, particularly in the context of multi-chiplet and 3DIC architectures used in 5G infrastructure
- In March 2023, Synopsys deepened its collaboration with Microsoft to advance cloud-based electronic design automation (EDA) through deployment on Microsoft Azure. This partnership introduced a scalable, pay-as-you-go model that enables chip designers to access Synopsys’ full-stack, AI-driven EDA tools with greater flexibility and efficiency. The integration supports rapid scaling of compute resources, automated provisioning, and seamless access to design and verification technologies—empowering teams to accelerate development cycles and reduce time-to-market for complex semiconductor designs
- In June 2022, Cadence Design Systems expanded its collaboration with Samsung Foundry to advance 3D-IC (three-dimensional integrated circuit) design through the Cadence Integrity™ 3D-IC platform. This enhanced partnership enables customers to optimize power, performance, and area (PPA) for each die in stacked chip configurations. The platform supports advanced die-on-die stacking, TSV (through-silicon via) placement, and unified design planning, implementation, and signoff. By addressing routing and placement challenges in 3D architectures, the collaboration empowers designers to build high-performance, space-efficient systems for applications such as AI, mobile, and hyperscale computing
