Latest Developments in Global Electrostatic Chucks Market

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Latest Developments in Global Electrostatic Chucks Market

  • Semiconductors and Electronics
  • May 2025
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

  •  In June 2023, Applied Materials partnered with TSMC to enhance its electrostatic chuck offerings for 3nm chip production. The collaboration focused on integrating advanced ceramic-based ESCs with TSMC’s manufacturing processes, improving wafer handling precision.
  • In September 2023, Lam Research launched a new Johnsen-Rahbek type ESC series for semiconductor manufacturing. The series offers enhanced thermal management and durability, targeting advanced node chip production.
  • In January 2024, Kyocera introduced its next-generation ceramic-based ESC platform, designed for OLED and MicroLED display manufacturing. The platform features improved thermal conductivity and compliance with industry standards.
  • In April 2024, NGK Insulators unveiled a quartz-based ESC solution for SME-led display manufacturing. The solution supports high-precision wafer handling and cost-effective production for emerging display technologies.
  • In November 2024, Entegris announced a strategic partnership with a leading semiconductor fab in Taiwan to deploy advanced ESCs for 5G and AI chip production. The collaboration focused on enhancing process efficiency and yield.