Table of Content
1 INTRODUCTION
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 OVERVIEW OF GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET
1.4 CURRENCY AND PRICING
1.5 LIMITATION
1.6 MARKETS COVERED
2 MARKET SEGMENTATION
2.1 KEY TAKEAWAYS
2.2 ARRIVING AT THE GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET SIZE
2.3 VENDOR POSITIONING GRID
2.4 TECHNOLOGY LIFE LINE CURVE
2.5 MARKET GUIDE
2.6 COMPANY POSITIONING GRID
2.7 COMPANY MARKET SHARE ANALYSIS
2.8 MULTIVARIATE MODELLING
2.9 TOP TO BOTTOM ANALYSIS
2.1 STANDARDS OF MEASUREMENT
2.11 VENDOR SHARE ANALYSIS
2.12 IMPORT DATA
2.13 EXPORT DATA
2.14 DATA POINTS FROM KEY PRIMARY INTERVIEWS
2.15 DATA POINTS FROM KEY SECONDARY DATABASES
2.16 GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET : RESEARCH SNAPSHOT
2.17 ASSUMPTIONS
3 MARKET OVERVIEW
3.1 DRIVERS
3.2 RESTRAINTS
3.3 OPPORTUNITIES
3.4 CHALLENGES
4 EXECUTIVE SUMMARY
5 PREMIUM INSIGHTS
5.1 RAW MATERIAL COVERAGE
5.2 PRODUCTION CONSUMPTION ANALYSIS
5.3 TECHNOLOGICAL ADVANCEMENT BY MANUFACTURERS
5.4 PORTER’S FIVE FORCES
5.5 VENDOR SELECTION CRITERIA
5.6 PESTEL ANALYSIS
5.7 REGULATION COVERAGE
5.8 CONSUMER PREFERNCES & BEHAVIOUR
5.9 CONSUMER BUYING FACTORS
6 SUPPLY CHAIN ANALYSIS
6.1 OVERVIEW
6.2 LOGISTIC COST SCENARIO
6.3 IMPORTANCE OF LOGISTICS SERVICE PROVIDERS
7 CLIMATE CHANGE SCENARIO
7.1 ENVIRONMENTAL CONCERNS
7.2 INDUSTRY RESPONSE
7.3 GOVERNMENT’S ROLE
7.4 ANALYST RECOMMENDATIONS
8 GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET , BY PRODUCT TYPE
8.1 OVERVIEW
8.2 TESTING & MEASURING EQUIPMENT
8.3 PROCESS CONTROL EQUIPMENT
8.4 INDUSTRIAL CONTROLS
8.5 POWER ELECTRONICS
8.6 INDUSTRIAL AUTOMATION EQUIPMENT
8.7 OTHERS
9 PLASTIC GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET , BY MATERIAL
9.1 OVERVIEW
9.2 PLASTIC
9.2.1 POLYETHYLENE (PE)
9.2.2 POLYETHYLENE TEREPHTHALATE (PET)
9.2.3 POLYPROPYLENE (PP)
9.2.4 POLYSTYRENE (PS)
9.2.5 POLY VINYL CHLORIDE (PVC)
9.2.6 POLYETHYLENE TEREPHTHALATE (PETE)
9.2.7 ACRYLONITRILE-BUTADIENE-STRYRENE (ABS)
9.2.8 POLYCARBONATE
9.2.9 OTHERS
9.3 PAPER & PAPERBOARD
9.4 METALS
9.4.1 COPPER LEADFRAMES
9.4.2 COPPER TRACES
9.4.3 TUNGSTEN
9.4.4 OTHERS
9.5 CERAMICS
9.5.1 ALUMINUM OXIDE SUBTRATES MODIFIED WITH BAO
9.5.2 ALUMINUM OXIDE SUBTRATES MODIFIED WITH SIO2
9.5.3 ALUMINUM OXIDE SUBTRATES MODIFIED WITH CUO
9.5.4 SIN DIELECTRICS
9.5.5 OTHERS
9.6 POLYMERS
9.6.1 EPOXIES
9.6.2 FILLED EPOXIES
9.6.3 SILICA-FILLED ANHYDRIDE
9.6.4 RESIN
9.6.5 CONDUCTIVE ADHESIVES
9.6.6 POLYAMIDE DIELECTRIC
9.6.7 BENZOCLOBUTENE
9.6.8 SILICONES
9.6.9 PHOTOSENSITIVE POLYMERS
9.6.10 OTHERS
9.7 GLASSES
9.7.1 SILICON DIOXIDE
9.7.2 SILICATE GLASSES
9.7.3 BOROSILICATE GLASS SUBSTRATE
9.7.4 GLASS FIBERS
9.7.5 OTHERS
9.8 WOOD
9.9 FIBER
9.1 OTHERS
10 PLASTIC GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET , BY PACKAGING TYPE
10.1 OVERVIEW
10.2 RIGID
10.2.1 CORRUGATED BOXES
10.2.1.1. SINGLE-PHASE CORRUGATED BOX
10.2.1.2. SINGLE WALL CORRUGATED BOX
10.2.1.3. DOUBLE-WALL CORRUGATED BOX
10.2.1.4. TRIPLE WALL CORRUGATED BOX
10.2.1.5. OTHERS
10.2.2 CONTAINERS & SHIPPERS
10.2.2.1. BINS
10.2.2.2. TOTES
10.2.2.2.1. NESTABLE
10.2.2.2.2. STACKABLE
10.2.2.2.3. STACK AND NEST
10.2.2.2.4. OTHERS
10.2.2.3. BULK CONTAINER
10.2.2.4. OTHERS
10.2.3 PROTECTIVE PACKAGING
10.2.3.1. TRAYS
10.2.3.2. CLAMSHELLS
10.2.3.3. UNITIZER
10.2.3.3.1. STRETCH FILM
10.2.3.3.2. SHRINK WRAP
10.2.3.3.3. STRAPPING
10.2.3.3.4. OTHERS
10.2.3.4. OTHERS
10.2.4 OTHERS
10.3 FLEXIBLE
10.3.1 BAGS & POUCHES
10.3.2 TAPES & LABELS
10.3.3 FILMS & OTHERS
11 PLASTIC GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET , BY TECHNOLOGY
11.1 OVERVIEW
11.2 SURFACE-MOUNT TECHNOLOGY (SMD)
11.3 CHIP SCALE PACKAGES (CSP)
11.4 THROUGH (THRU) HOLE MOUNTING
11.5 BOX-IN-BOX PACKAGING
11.6 OTHERS
12 PLASTIC GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET , BY APPLICATION
12.1 OVERVIEW
12.2 ELECTRONIC COMPONENTS
12.2.1 INTEGRATED CIRCUITS
12.2.2 MICROCONTROLLER
12.2.3 TRANSFORMER
12.2.4 BATTERY
12.2.5 FUSE
12.2.6 RELAYS
12.2.7 SWITCHES
12.2.8 MOTORS
12.2.9 CIRCUIT BREAKERS
12.2.10 CIRCUIT CARDS
12.2.11 RESISTORS
12.2.12 CAPACITORS
12.2.13 DIODES
12.2.14 TRANSISTORS
12.2.15 INDUCTORS
12.2.16 OTHERS
12.3 ELECTRONIC DEVICES
12.3.1 THYRISTORS
12.3.2 ELECTRONIC SWITCHING DEVICES
12.3.3 DIGITAL ELECTRONIC SYSTEMS
12.3.4 OPTOELECTRONIC SYSTEMS
12.3.5 THERMAL SYSTEMS
12.3.6 MOTION CONTROL
12.3.7 INDUSTRIAL ROBOTS
12.3.8 OPERATIONAL AMPLIFIERS
12.3.9 DIGITAL ELECTRONIC SYSTEMS
12.3.10 OTHERS
13 GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET, BY GEOGRAPHY
13.1 GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)
13.2 OVERVIEW
13.3 NORTH AMERICA
13.3.1 U.S.
13.3.2 CANADA
13.3.3 MEXICO
13.4 EUROPE
13.4.1 GERMANY
13.4.2 U.K.
13.4.3 ITALY
13.4.4 FRANCE
13.4.5 SPAIN
13.4.6 SWITZERLAND
13.4.7 RUSSIA
13.4.8 TURKEY
13.4.9 BELGIUM
13.4.10 NETHERLANDS
13.4.11 REST OF EUROPE
13.5 ASIA-PACIFIC
13.5.1 JAPAN
13.5.2 CHINA
13.5.3 SOUTH KOREA
13.5.4 INDIA
13.5.5 SINGAPORE
13.5.6 THAILAND
13.5.7 INDONESIA
13.5.8 MALAYSIA
13.5.9 PHILIPPINES
13.5.10 AUSTRALIA AND NEW ZEALAND
13.5.11 HONG KONG
13.5.12 TAIWAN
13.5.13 REST OF ASIA-PACIFIC
13.6 SOUTH AMERICA
13.6.1 BRAZIL
13.6.2 ARGENTINA
13.6.3 REST OF SOUTH AMERICA
13.7 MIDDLE EAST AND AFRICA
13.7.1 SOUTH AFRICA
13.7.2 EGYPT
13.7.3 SAUDI ARABIA
13.7.4 UNITED ARAB EMIRATES
13.7.5 ISRAEL
13.7.6 REST OF MIDDLE EAST AND AMERICA
14 GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET, COMPANY LANDSCAPE
14.1 COMPANY SHARE ANALYSIS: GLOBAL
14.2 COMPANY SHARE ANALYSIS: NORTH AMERICA
14.3 COMPANY SHARE ANALYSIS: EUROPE
14.4 COMPANY SHARE ANALYSIS: ASIA-PACIFIC
14.5 MERGERS & ACQUISITIONS
14.6 NEW PRODUCT DEVELOPMENT & APPROVALS
14.7 EXPANSIONS
14.8 REGULATORY CHANGES
14.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS
15 GLOBAL INDUSTRIAL ELECTRONICS PACKAGING MARKET , COMPANY PROFILE
15.1 DS SMITH
15.1.1 COMPANY SNAPSHOT
15.1.2 REVENUE ANALYSIS
15.1.3 PRODUCT PORTFOLIO
15.1.4 RECENT UPDATES
15.2 SMURFIT KAPPA
15.2.1 COMPANY SNAPSHOT
15.2.2 REVENUE ANALYSIS
15.2.3 PRODUCT PORTFOLIO
15.2.4 RECENT UPDATES
15.3 SEALED AIR
15.3.1 COMPANY SNAPSHOT
15.3.2 REVENUE ANALYSIS
15.3.3 PRODUCT PORTFOLIO
15.3.4 RECENT UPDATES
15.4 AMETEK.INC.
15.4.1 COMPANY SNAPSHOT
15.4.2 REVENUE ANALYSIS
15.4.3 PRODUCT PORTFOLIO
15.4.4 RECENT UPDATES
15.5 DORDAN MANUFACTURING COMPANY
15.5.1 COMPANY SNAPSHOT
15.5.2 REVENUE ANALYSIS
15.5.3 PRODUCT PORTFOLIO
15.5.4 RECENT UPDATES
15.6 DUPONT
15.6.1 COMPANY SNAPSHOT
15.6.2 REVENUE ANALYSIS
15.6.3 PRODUCT PORTFOLIO
15.6.4 RECENT UPDATES
15.7 GY PACKAGING
15.7.1 COMPANY SNAPSHOT
15.7.2 REVENUE ANALYSIS
15.7.3 PRODUCT PORTFOLIO
15.7.4 RECENT UPDATES
15.8 KIVA CONTAINER
15.8.1 COMPANY SNAPSHOT
15.8.2 REVENUE ANALYSIS
15.8.3 PRODUCT PORTFOLIO
15.8.4 RECENT UPDATES
15.9 PRIMEX DESIGN & FABRICATION
15.9.1 COMPANY SNAPSHOT
15.9.2 REVENUE ANALYSIS
15.9.3 PRODUCT PORTFOLIO
15.9.4 RECENT UPDATES
15.1 QUALITY FOAM PACKAGING, INC.
15.10.1 COMPANY SNAPSHOT
15.10.2 REVENUE ANALYSIS
15.10.3 PRODUCT PORTFOLIO
15.10.4 RECENT UPDATES
15.11 UFP TECHNOLOGIES
15.11.1 COMPANY SNAPSHOT
15.11.2 REVENUE ANALYSIS
15.11.3 PRODUCT PORTFOLIO
15.11.4 RECENT UPDATES
15.12 ACHILLES USA
15.12.1 COMPANY SNAPSHOT
15.12.2 REVENUE ANALYSIS
15.12.3 PRODUCT PORTFOLIO
15.12.4 RECENT UPDATES
15.13 DESCO INDUSTRIES INC
15.13.1 COMPANY SNAPSHOT
15.13.2 REVENUE ANALYSIS
15.13.3 PRODUCT PORTFOLIO
15.13.4 RECENT UPDATES
15.14 ORLANDO PRODUCTS INC.
15.14.1 COMPANY SNAPSHOT
15.14.2 REVENUE ANALYSIS
15.14.3 PRODUCT PORTFOLIO
15.14.4 RECENT UPDATES
15.15 DELPHON
15.15.1 COMPANY SNAPSHOT
15.15.2 REVENUE ANALYSIS
15.15.3 PRODUCT PORTFOLIO
15.15.4 RECENT UPDATES
15.16 PROTECTIVE PACKAGING CORPORATION
15.16.1 COMPANY SNAPSHOT
15.16.2 REVENUE ANALYSIS
15.16.3 PRODUCT PORTFOLIO
15.16.4 RECENT UPDATES
15.17 DOU YEE ENTERPRISES
15.17.1 COMPANY SNAPSHOT
15.17.2 REVENUE ANALYSIS
15.17.3 PRODUCT PORTFOLIO
15.17.4 RECENT UPDATES
15.18 GWP GROUP
15.18.1 COMPANY SNAPSHOT
15.18.2 REVENUE ANALYSIS
15.18.3 PRODUCT PORTFOLIO
15.18.4 RECENT UPDATES
15.19 ENGINEERED MATERIALS, INC
15.19.1 COMPANY SNAPSHOT
15.19.2 REVENUE ANALYSIS
15.19.3 PRODUCT PORTFOLIO
15.19.4 RECENT UPDATES
15.2 CREOPACK
15.20.1 COMPANY SNAPSHOT
15.20.2 REVENUE ANALYSIS
15.20.3 PRODUCT PORTFOLIO
15.20.4 RECENT UPDATES
16 RELATED REPORTS
17 QUESTIONNAIRE
18 ABOUT DATA BRIDGE MARKET RESEARCH
