- In September 2022, Alliance Memory introduced expanded versions of its CMOS DDR4 SDRAMs. These updated chips are more compact, consume less power, and offer enhanced speed, improving overall performance. This innovation aligns with the growing demand for more efficient and high-performance memory solutions
- In August 2022, SABIC introduced a new compound, LNP Konduit 8TF36E, based on Liquid Crystal Polymer (LCP), offering exceptional thermal conductivity and electrical insulation properties. This compound was designed to meet the rigorous demands of burn-in test sockets (BiTS) used to stress-test DDR memory integrated circuits. It is particularly suited for fixed structural components in BiTS assemblies, such as latches and adaptors
- In December 2021, Intel Corporation finalized the sale of its NAND and SSD businesses to South Korea’s SK Hynix for USD 7.6 billion, a deal initially announced in October 2020. Despite the sale, Intel will continue producing NAND wafers and retain intellectual property rights for certain products until March 2025. At that time, the remaining assets will be fully transferred to SK Hynix
- In December 2022, Samsung unveiled a groundbreaking supercomputer featuring AMD data center GPUs integrated with its processing-in-memory (PIM) ICs. This innovative setup enhances performance and energy efficiency for training large AI models. The supercomputer is equipped with 96 AMD Instinct MI100 GPUs, each containing a PIM chip, a new memory technology that minimizes the data movement required between the CPU and DRAM
