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Global Memory Packaging Market – Industry Trends and Forecast to 2030

ICT

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Global Memory Packaging Market – Industry Trends and Forecast to 2030

  • ICT
  • Upcoming Report
  • Mar 2023
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

Global Memory Packaging Market – Industry Trends and Forecast to 2030

Market Size in USD Billion

CAGR :  % Diagram

Diagram Forecast Period 2022–2030
Diagram Market Size (Base Year) USD 26.48 Billion
Diagram Market Size (Forecast Year) USD 41.88 Billion
Diagram CAGR %

Major Markets Players

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Global Memory Packaging Market, By Platform (Flip-chip, Lead Frame, Wafer Level Chip Scale Packaging, Through-silicon Via (TSV), Wire-bond), Application (NAND Flash Packaging, NOR Flash Packaging, DRAM Packaging), End User (IT and Telecommunication, Consumer Electronics, Embedded Systems, Automotive, Other) – Industry Trends and Forecast to 2030.

Global Memory Packaging Market

Memory Packaging Market Analysis and Size

Memory devices employ extensive packaging technology from lead-frame, wire-bond, and flip-chip, to through-silicon via (TSV). Also, it has been witnessed that there are many variations of memory device packaging, and this is all depending upon the specific product requirements such as performance, density, cost, and many others. Furthermore, the growing penetration of smartphones and increasing demand for improved capabilities will likely influence market growth positively. For instance, watching movies on mobile devices and accommodating high-definition (HD) displays, mobile LP-DDR4 devices are being employed, which enhances the demand for memory packaging.

Data Bridge Market Research analyses that the memory packaging market is expected to reach USD 41.88 billion by 2030, which was USD 26.48 billion in 2022, at a CAGR of 5.90% during the forecast period. In addition to the market insights such as market value, growth rate, market segments, geographical coverage, market players, and market scenario, the market report curated by the Data Bridge Market Research team includes in-depth expert analysis, import/export analysis, pricing analysis, production consumption analysis, and pestle analysis.

Memory Packaging Market Scope and Segmentation

Report Metric

Details

Forecast Period

2023 to 2030

Base Year

2022

Historic Years

2021 (Customizable to 2015 - 2020)

Quantitative Units

Revenue in USD Billion, Volumes in Units, Pricing in USD

Segments Covered

Platform (Flip-chip, Lead Frame, Wafer Level Chip Scale Packaging, Through-silicon Via (TSV), Wire-bond), Application (NAND Flash Packaging, NOR Flash Packaging, DRAM Packaging), End User (IT and Telecommunication, Consumer Electronics, Embedded Systems, Automotive, Other)

Countries Covered

U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America

Market Players Covered

HANA Micron Inc. (South Korea), Formosa Advanced Technologies Co., Ltd. (Taiwan), ASE (Taiwan), Amkor Technology (U.S.), Powertech Technology Inc. (U.S.), ChipMOS TECHNOLOGIES INC. (Taiwan), Teledyne Technologies (U.S.), SCHOTT (Germany), KYOCERA Corporation (Japan), Materion Corporation (U.S.), Egide (France), SGA Technologies (U.K.), Complete Hermetics (U.S.), Special Hermetic Products Inc. (U.S.), Hermetics Solutions Group (U.S.), StratEdge (U.S.),  Mackin Technologies (U.S.), Palomar Technologies (U.S.), CeramTec Gmbh (Germany)

Market Opportunities

  • Rising demand for memory from the mobile sector
  • Increasing market capacity by major manufacturers

Market Definition

Memory is made from small semiconductor chips, which are then packaged in a less fragile way to allow them to be integrated into the computer system. The chip packages are mainly integrated into larger packages. Memory-integrated circuits are integrated as per necessities to make the components function properly. Computer memory is then available in numerous physical packaging.

Global Memory Packaging Market

Drivers

  • Rising demand for memory packaging  in the automotive sector

The growing demand for memory packaging in the automotive sector is expected to propel market growth in the forecast period. Automotive highly uses low-density (low-MB) memory and might observe a growth in the acceptance of DRAM memory which is led by the increasing trend of autonomous driving and in-vehicle infotainment. Asa result of all these factors boost the demand the memory packaging in the automotive sector and enhance the market growth rate.

  • Growth and expansion of the consumer electronics industry

The swift growth in the consumer electronics industry is expected to propel the growth of the memory packaging market during the forecast period. They are used in various electronic devices, such as laptops, netbooks, smartphones, PCs, music players, and tablets. Mobile-connected devices such as tablets and smartphones have compelled growth in the consumer electronics industry. Hence, increasing demand for consumer electronics eventually boosts the demand for memory and enhances the growth of memory packaging.

Opportunities

  • Rising demand for memory from the mobile sector

The demand for memory is increasing from all sectors, but the mobile market is witnessing particularly strong growth. For instance, the capacity for DRAM memory per smartphone will increase more than 3 times to reach about 6GB by 2022. DRAM cost per smartphone represents more than 10 percent of the bill of materials and is likely to increase further. The capacity of NAND per smartphone will rise more than 5 times to reach more than 150GB by 2022. As a result of all these factors, the demand for memory from the mobile sector eventually enhances the demand for memory packaging and creates immense opportunities for market growth.

  • Increasing market capacity by major manufacturers

Manufacturers operating in the memory packaging market are expanding their manufacturing facilities. For instance, SK Hynix Inc. is increasing its semiconductor packaging capacity in South Korea. SK Hynix goals to choose a U.S. site for its advanced chip packaging plant. This will help the United States to compete as China pours money into the burgeoning sector. Such developments are expected to help generate ample opportunity for the existing market players during the forecast period.

 Restraints

  • Various challenges associated with memory packaging

The increasing demand for higher memory densities and bandwidth, multiple functionalities, and lower power consumption creates new challenges for market growth. These challenges are encountered by packaging technologies to fulfill the demand for high reliability while maintaining low costs, manufacturability, and yield requirements. This hampers the market growth.

  • High cost associated with memory devices

Memory devices based on semiconductors are gaining huge popularity during the forecast period. However, creating a factory from scratch that manufactures memory devices is very expensive. These devices have numerous expensive components, such as wafers, transistors, MOSFET, and cooling systems, increasing the overall cost of memory devices. This eventually obstructs market growth.

This memory packaging market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the memory packaging market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.

Global Memory Packaging Market Scope

The memory packaging market is segmented on the basis of platform, application, and end user. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Platform

  • Flip-chip
  • Lead Frame
  • Wafer Level Chip Scale Packaging
  • Through-silicon Via (TSV)
  •  Wire-bond

 Application

  • NAND Flash Packaging
  • NOR Flash Packaging
  • DRAM Packaging

 End User

  • IT and Telecommunication
  • Consumer Electronics
  • Embedded Systems
  • Automotive
  • Other

Memory Packaging Market Regional Analysis/Insights

The memory packaging market is analyzed and market size insights and trends are provided by country, platform, application, and end user as referenced above.

The countries covered in the memory packaging market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.

Asia-Pacific dominates the memory packaging market owing to the growing demand for memory packaging from consumer electronics, automotive, and other end-user industries in this region. Furthermore, a large consumer base in low-income and middle-income level populations will further boost the market growth in this region.

The country section of the report also provides individual market impacting factors and changes in market regulation that impact the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of Global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.   

Competitive Landscape and Memory Packaging Market Share Analysis

The memory packaging market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, Global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to memory packaging market.

Some of the major players operating in the memory packaging market are:

  • HANA Micron Inc. (South Korea)
  • Formosa Advanced Technologies Co., Ltd. (Taiwan)
  • ASE (Taiwan), Amkor Technology (U.S.)
  • Powertech Technology Inc. (U.S.)
  • ChipMOS TECHNOLOGIES INC. (Taiwan)
  • Teledyne Technolgies (U.S.)
  • SCHOTT (Germany)
  • KYOCERA Corporation (Japan)
  • Materion Corporation (U.S.)
  • Egide (France)
  • SGA Technologies (U.K.)
  • Complete Hermetics (U.S.)
  • Special Hermetic Products Inc. (U.S.)
  • Hermetics Solutions Group (U.S.)
  • StratEdge (U.S.)
  • Mackin Technologies (U.S.)
  • Palomar Technologies (U.S.)
  • CeramTec Gmbh (Germany),


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Research Methodology:

Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.

The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.

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The Memory Packaging Market is projected to grow at a CAGR of 5.90% during the forecast period by 2030.
The future market value of the Memory Packaging Market is expected to reach USD 41.88 billion by 2030.
The major players in the Memory Packaging Market are HANA Micron Inc. (South Korea), Formosa Advanced Technologies Co., Ltd. (Taiwan), ASE (Taiwan), Amkor Technology (U.S.), Powertech Technology Inc. (U.S.), ChipMOS TECHNOLOGIES INC. (Taiwan), etc.
The countries covered in the Memory Packaging Market are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, etc.
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