Latest Developments in Global Packaging Foams Market

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Latest Developments in Global Packaging Foams Market

  • Chemical and Materials
  • May 2025
  • Global
  • 350 Pages
  • No of Tables: 60
  • No of Figures: 220

  • In March 2025, Sealed Air Corporation announced the launch of its new EcoPure foam packaging line, made with over 60% post-consumer recycled content. This new product is designed to meet increasing regulatory and consumer demands for sustainable packaging while maintaining the same high-performance protection standards. EcoPure is targeted toward electronics, appliances, and e-commerce packaging applications, aligning with Sealed Air’s sustainability roadmap to achieve 100% recyclable or reusable packaging by 2025.
  • In January 2025, BASF SE revealed the expansion of its Styroflex plant in Ludwigshafen, Germany, to meet growing global demand for flexible packaging foams. The expansion will increase production capacity by 30%, allowing BASF to serve customers more efficiently in key markets such as food packaging, medical insulation, and protective packaging. Styroflex is a key component in lightweight, flexible foams offering excellent mechanical properties and environmental compatibility.
  • In December 2024, Zotefoams plc introduced its latest high-performance closed-cell foam series, ZOTEK F HT, engineered specifically for high-temperature packaging applications. These foams are ideal for electronics and aerospace components requiring superior thermal insulation and chemical resistance. The product line is also fully recyclable and supports Zotefoams’ initiative toward circular economy packaging solutions.
  • In October 2024, Armacell LLC partnered with a major Asian electronics manufacturer to co-develop customized anti-static polyethylene foam packaging solutions. These foams are tailored for precision electronic components, providing advanced ESD protection and form-fitting designs to reduce damage during transit. The partnership aims to expand Armacell’s footprint in the Asia-Pacific region, where demand for electronics packaging continues to grow rapidly.