Global Pressed Ceramic Packages Market – Industry Trends and Forecast to 2029

Global Pressed Ceramic Packages Market, By Type (Ceramic-metal sealing (CERTM), Glass-metal sealing (GTMS), Passivation glass, Transponder glass, Reed glass),  Application (Transistors, Sensors, Lasers, Photo diodes, Airbag ignitors, Oscillating crystals, MEMS switches, Others) – Industry Trends and Forecast to 2029

Market Analysis and Size

Ceramic materials have less physical limitations than other materials due to this reason it enhances the performance of the product. Ceramic feedthroughs and ceramic packages are designed for 25 and 50 ohm controlled impedance signals and it is possible up to 50 GHz. Ceramic packages exceed the design barriers of glass to metal seal packages because of better hermetic performance in critical environments when require a robust seal. The pressed ceramic packages are the configuration of hermetic ceramic packaging which are typically lower in cost than the other packages.

Data Bridge Market Research analyses that the pressed ceramic packages market was valued at USD 68575.00 million in 2021 and is expected to reach USD 105241.13 million by 2029, registering a CAGR of 5.50% during the forecast period of 2022 to 2029. In addition to the market insights such as market value, growth rate, market segments, geographical coverage, market players, and market scenario, the market report curated by the Data Bridge Market Research team includes in-depth expert analysis, import/export analysis, pricing analysis, production consumption analysis, patent analysis and technological advancements.     

Market Definition

Pressed ceramic packages are generally a three part construction which are lead, frame, base and lid. The base and lid are produced in the same way by pressing ceramic powder into the preferred shape and then firing. Glass is then screened onto the lid and fired base. The glass paste is then fired. During the package assembly, a separate lead frame is inserted into the base glass then formed by melting the lid glass over the lead frame and base combination. This seal technique is referred to as a frit seal, and hence this package is frequently called a glass frit seal package.

Report Scope and Market Segmentation

Pressed Ceramic Packages Market Dynamics

Drivers

• Usage in aerospace industry

Pressed ceramic is the configuration of hermetic ceramic. In aerospace industry extensively uses hermetically sealed headers & connectors and hermetically sealed terminals in several airplane systems. For example, a flight black box or data recorder uses hermetic connectors to ensure the integrity of the delicate electronics. Furthermore, fuel tanks and fuel systems use this hermetic connectors in their sensor systems to inform and prevent the seepage of fuel. Increasing demand for commercial aircraft are expect to increase the  hermetic packaging as well increase the demand of pressed ceramic packages market.

• Increase the demand in automotive sector

 Increase the demand for pressed ceramic packaging in automotive industry due to the rapid usage of electronic components in various automotive parts. The increasing demand for safety features, comfort, stability, and high performance is driving electrification in automobiles. The increasing use of ceramic equipment in several applications such as airbag assemblies, semiconductors, printed circuit boards, microchips, micro-electro-mechanical systems, autonomous cruise control, and automatic emergency braking systems will drive the global ceramic packaging market during the forecast period.

Opportunities

The substantial growth in the consumer electronics industry is one of the major factors which create the beneficial opportunities for the growth of the market. Factors such as increasing literacy rate, strong economic growth, and increasing purchasing power are growing the demand for smartphones which increase the demand of pressed ceramic packages. Furthermore, advancement in technology in wireless mobile telecommunication technology like 4G, IoT and 3G will also increase the adoption of other smart devices globally. As a result of these factors, the consumption of pressed ceramic packaging is expected to increase, thus boosting the valuable opportunities for the market growth in upcoming years.

Restraints/ Challenges

Pressed ceramic packages are harsh for environment and critical application which due to which imposed the toughest regulation for using pressed ceramic packages. Pressed ceramic packages used in Microelectronic components and these components used in aerospace, military, and medical devices. The standards forces companies to buy new leak test equipment because older equipment does not have the necessary sensitivity to test. Presses ceramic packages providers need to adhere these standards to upsurge their market share. These strict standards for pressed ceramic packages are anticipated to restrain the growth of the market.

This pressed ceramic packages market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the pressed ceramic packages market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.

COVID-19 Impact on Pressed Ceramic Packages Market

The outbreak of COVID-19 has affected many countries and it has also affected the capacities and financial conditions of pressed ceramic packages providers. This pandemic is adversely affecting the economies of countries and financial markets and the end-use industries for pressed ceramic packages products. This is anticipated to lead to an economic decline and is likely to negatively affect the demand for ceramic packaged electronic components. The overall long-term impact of COVID-19 on this market is expected to depend upon several factors like duration of the pandemic, the actions taken by several government authorities globally in response to the epidemic, and the strictness of the disease.

Global Pressed Ceramic Packages Market Scope

The pressed ceramic packages market is segmented on the basis of type and application. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Type

• Ceramic-metal sealing (CERTM)
• Glass-metal sealing (GTMS)
• Passivation glass
• Transponder glass
• Reed glass

 Application

• Transistors
• Sensors
• Lasers
• Photo diodes
• Airbag ignitors
• Oscillating crystals
• MEMS switches
• Others

Pressed Ceramic Packages Market Regional Analysis/Insights

The pressed ceramic packages market is analysed and market size insights and trends are provided by country, type and application as referenced above.

The countries covered in the pressed ceramic packages market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America

North America dominates the pressed ceramic packages market in terms of market share and revenue during the forecast period. This is due to the increasing demand for pressed ceramic packages in this region. North America region leads the pressed ceramic packages market due to growing energy needs, emerging economies, and growing defence spending in this region.

During the projected period, Asia-Pacific is anticipated to be the fastest developing region due to increasing the demand for sensitive electronic components in this region.

The country section of the report also provides individual market impacting factors and changes in market regulation that impact the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.   

Competitive Landscape and Pressed Ceramic Packages Market Share Analysis

The pressed ceramic packages market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to pressed ceramic packages market.

Some of the major players operating in the pressed ceramic packages market are:

• Teledyne Technologies (US)
• SCHOTT (Germany)
• Amkor Technology (US)
• KYOCERA Corporation (Japan)
• Materion Corporation (US)
• Egide (France)
• SGA Technologies (UK)
• Complete Hermetics (US)
• Special Hermetic Products Inc. (US)
• Coat-X SA (Switzerland)
• Hermetics Solutions Group (US)
• StratEdge (US)
• Mackin Technologies (US)
• Palomar Technologies (US)
• CeramTec Gmbh (Germany)
• Electronic Products Inc. (US)
• NGK Insulators Ltd. (Japan)
• Remtec Inc. (Canada)