“Increasing Use in Semiconductor Manufacturing Processes”
- There is an increasing use of pyrolytic boron nitride in semiconductor manufacturing processes due to its exceptional thermal stability and non-reactive nature
- For instance, it is used in chemical vapor deposition equipment and wafer carriers by major chip manufacturers such as Intel and TSMC to ensure clean, stable, and high-precision fabrication environments
- Pyrolytic boron nitride is becoming a preferred material in the production of semiconductors that require ultra-clean processing conditions
- For instance, in processes such as etching and ion implantation, the material's resistance to chemical attack helps prevent contamination, ensuring the high yield and quality of microchips
- Its high purity and consistent performance make it ideal for use in insulation and shielding components within semiconductor tools
- For instance, equipment manufacturers are integrating pyrolytic boron nitride into chamber liners and shields to extend equipment life and maintain product integrity
- The move toward smaller, more advanced nodes in semiconductor technology is pushing the need for materials that can tolerate high thermal loads without degrading
- For instance, pyrolytic boron nitride is used in 3 nanometer and 5 nanometer chip fabrication lines to manage heat and reduce the risk of defects
- As the demand for high-performance computing and mobile devices increases, semiconductor fabs are investing in materials such as pyrolytic boron nitride that can support high-volume, high-precision manufacturing
