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Global Surface Mount Technology Electronics Packaging Market – Industry Trends and Forecast to 2029

Semiconductors and Electronics

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Global Surface Mount Technology Electronics Packaging Market – Industry Trends and Forecast to 2029

  • Semiconductors and Electronics
  • Upcoming Report
  • Oct 2022
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

Global Surface Mount Technology Electronics Packaging Market, By Material (Plastic, Metal, Glass, Others), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Others) – Industry Trends and Forecast to 2029.

Surface Mount Technology Electronics Packaging Market

Surface Mount Technology Electronics Packaging Market Analysis and Size

Electrical components were traditionally installed using the through-hole technology construction method. However, as time passed, surface mount technology began to replace through-hole technology because it allowed for increased manufacturing automation, which improved quality and lowered costs. Surface mount technology is now used to manufacture most electronic hardware parts. Surface mount technology is rapidly replacing through-hole technology due to numerous advantages such as smaller components, higher component density, superior mechanical performance, and simple and faster-automated assembly.

Data Bridge Market Research analyses that the surface mount technology electronics packaging market which was growing at a value of 1.94 billion in 2021 and is expected to reach the value of USD 6.77 billion by 2029, at a CAGR of 16.90% during the forecast period of 2022-2029. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.

Surface Mount Technology Electronics Packaging Market Scope and Segmentation

Report Metric

Details

Forecast Period

2022 to 2029

Base Year

2021

Historic Years

2020 (Customizable to 2014 - 2019)

Quantitative Units

Revenue in USD billion, Volumes in Units, Pricing in USD

Segments Covered

Material (Plastic, Metal, Glass, Others), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Others)

Countries Covered

U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America

Market Players Covered

ASE Technology Holding Co., Ltd. (China), Amkor Technology (U.S.), JCET Global (China), Siliconware Precision Industries Co., Ltd. (China), Powertech Technology Inc. (China), TongFu Microelectronics Co.,Ltd. (China), Lingsen Precision Industries, LTD. (China), Sigurd Corporation (China), OSE CORP. (China), Tianshui Huatian Technology Co.,Ltd (China), UTAC. (Singapore), King Yuan ELECTRONICS CO., LTD. (China), ChipMOS TECHNOLOGIES INC. (China), Formosa Advanced Technologies Co., Ltd. (Taiwan)

Opportunities

  • Rising development of electronic packaging technologies
  • Increased government initiatives for the adoption of advanced technology
  • Widespread growth of semiconductor industries

Market Definition

Surface mounting (SMT) technology produces electronic circuits in which the components are installed or placed directly on the printed circuit board (PCB). A surface mount device is the result of this process (SMD). It has primarily replaced connecting parts with cable leads in the sector's circuit board through-hole technique design. Both technologies, such as massive transformers and heat-sinked power semiconductors, can be used on the same board for components that cannot be mounted on the surface.

Global Surface Mount Technology Electronics Packaging Market Dynamics

Drivers

  • Exponential growth in electronic industry

Exponential growth in the electronic industry, miniaturization of modern electronic components, increased use of flexible printed circuit boards, and the growing popularity of electric vehicles are some of the major factors driving the growth of surface mount technology. The electronics sector is one of the world’s largest and fastest-growing, contributing significantly to the global economy. Factors such as population growth, rising disposable income, and rapid urbanization have created such a high demand for electronic devices that it is impossible to meet it without the use of advanced mass manufacturing techniques. Surface mount technology is currently the most widely used method for assembling and manufacturing electronic components due to its effectiveness, higher efficiency, and lower cost.

  • Growing use of machine language is proliferating market growth

The growing use of AI and Internet of Things (IoT)-integrated industrial devices with high power requirements also increasing demand for surface mount technology electronics packaging. In line with this, rising environmental consciousness among the general public and the growing need to reduce electronic waste are positively impacting market growth. Other factors expected to drive market growth include widespread product adoption in the aerospace industry to improve the thermal performance of aircraft components and rising demand for semiconductor packaging in medical devices such as ultrasound devices, mobile X-ray systems, and patient monitors.

Opportunities

  • Adoption of advanced technology

Rising development of electronic packaging technologies, as well as increased government initiatives for the adoption of advanced technology and the growth of semiconductor industries, will create ample opportunities for the growth of the surface mount technology electronics packaging market during the forecast period.

Restraints

  • High cost

Lack of skilled professionals along with high cost of technology are acting as market restraints for surface mount technology electronics packaging in the above mentioned forecasted period.

This surface mount technology electronics packaging market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the surface mount technology electronics packaging market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.

Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays

Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.

Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.

COVID-19 Impact on Surface Mount Technology Electronics Packaging Market

The COVID-19 outbreak has severely impacted the global and national economies. Many end-user industries, including electronics manufacturing, have been impacted. Work on the factory floor is a large part of manufacturing, where people are in close contact as they collaborate to increase productivity. There are component shortages in the market for building circuit boards. The ability to keep a healthy stock of components on hand has been dramatically reduced as many component manufacturers have shut down or are operating at minimum capacity. Many PCB components required for SMT assembly line operation are shipped as cargo on regular commercial airlines. As a result of international travel restrictions, flights have been canceled, reducing shipping availability and driving up prices.

Expected Impact of Economic Slowdown on the Pricing and Availability of Products

When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.

Recent Development

  • In June 2022 Advanced Semiconductor Engineering, Inc. (ASE) will introduce VI PackTM, an advanced packaging platform designed to enable vertically integrated package solutions,. VI PackTM is the next generation of ASE's 3D heterogeneous integration architecture, which extends design rules while achieving ultra-high density and performance.
  • In June 2022 Tera View will release the EOTPR 4500, a purpose-built integrated circuit package inspection machine. The EOTPR 4500 auto prober technology was developed to meet the demands of modern IC packaging technology, accepting substrate sizes up to 150mmx150mm while maintaining probe tip placement precision of +/- 0.5m.

Global Surface Mount Technology Electronics Packaging Market Scope

The surface mount technology electronics packaging market is segmented on the basis of material and end user. The growth amongst these segments will help you analyse meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Material

  • Plastic
  • Metal
  • Glass
  • Others

End use

Surface Mount Technology Electronics Packaging Market Regional Analysis/Insights

The surface mount technology electronics packaging market is analysed and market size insights and trends are provided by country, material and end user as referenced above.

The countries covered in the surface mount technology electronics packaging market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.

Asia-Pacific dominates the advanced packaging market during the forecast period. It is due to the presence of major market players in this region, as well as the rapid growth in demand for semiconductors across various industry verticals such as automotive, consumer electronics, aerospace, defence, and many others, as well as the government's heavy investment in building semiconductor manufacturing plants, particularly in developing countries.

North America is expected to grow at the highest rate over the forecast period, owing to the development of several advanced packaging technologies such as copper hybrid bonding and wafer level packaging (WPL) and the increasing demand for IoT-connected devices such as wearables.

The country section of the report also provides individual market impacting factors and changes in market regulation that impact the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of Global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.   

Competitive Landscape and Surface Mount Technology Electronics Packaging Market Share Analysis

The surface mount technology electronics packaging market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, Global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to surface mount technology electronics packaging market.

Some of the major players operating in the surface mount technology electronics packaging market are:

  • ASE Technology Holding Co., Ltd. (China)
  • Amkor Technology (U.S.)
  • JCET Global (China)
  • Siliconware Precision Industries Co., Ltd. (China)
  • Powertech Technology Inc. (China)
  • TongFu Microelectronics Co.,Ltd. (China)
  • Lingsen Precision Industries, LTD. (China)
  • Sigurd Corporation (China)
  • OSE CORP. (China)
  • Tianshui Huatian Technology Co.,Ltd (China)
  • UTAC (Singapore)
  • King Yuan ELECTRONICS CO., LTD. (China)
  • ChipMOS TECHNOLOGIES INC. (China)
  • Formosa Advanced Technologies Co., Ltd. (Taiwan)


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FREQUENTLY ASK QUESTIONS

The current market value is USD 1.94 billion in 2021.
The market is expected to grow at a rate of market is 16.90% during the forecast period of 2022 to 2029.
The Surface Mount Technology Electronics Packaging Market is segmented by Material (Plastic, Metal, Glass, Others), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Others).
The top players in the market are ASE Technology Holding Co., Ltd. (China), Amkor Technology (U.S.), JCET Global (China), Siliconware Precision Industries Co., Ltd. (China), Powertech Technology Inc. (China), TongFu Microelectronics Co.,Ltd. (China), Lingsen Precision Industries, LTD. (China), Sigurd Corporation (China), OSE CORP. (China), Tianshui Huatian Technology Co.,Ltd (China), UTAC. (Singapore), King Yuan ELECTRONICS CO., LTD. (China), ChipMOS TECHNOLOGIES INC. (China), Formosa Advanced Technologies Co., Ltd. (Taiwan)
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