- In January 2025, ASMPT Limited, a leading provider of surface mount technology equipment, announced the launch of its new SIPLACE CA2 system, designed to enhance the integration of chip assembly and SMT placement. This next-generation platform improves efficiency by allowing multiple production steps to be performed in a single machine, reducing operational costs and improving throughput for electronics manufacturers globally.
- In October 2024, Panasonic Corporation unveiled its latest generation of high-speed placement machines at the Productronica exhibition. The new equipment features enhanced AI-based optimization software, capable of predictive maintenance, real-time defect detection, and automated line balancing. These innovations aim to improve production yields and line efficiency in complex PCB assembly environments.
- In September 2024, Yamaha Motor Co., Ltd. introduced its state-of-the-art YRM20DL SMT machine at SEMICON Taiwan 2024. This dual-lane modular system is built for high-mix, high-volume production and leverages advanced motion control technology, reducing placement time and increasing precision, crucial for next-gen electronic device manufacturing.
- In September 2024, Nordson Corporation announced the commercial release of its ASYMTEK Select Coat® SL-1040 conformal coating system. With upgraded automation and inspection capabilities, this system supports manufacturers' push towards Industry 4.0, offering closed-loop process controls and smart analytics to minimize coating defects and maximize productivity in electronic assembly lines.
