Global System in Package (SIP) Market, By Packaging Technology (2D IC Packaging Technology, 2.5D IC Packaging Technology, 3D IC Packaging Technology), Package Type (Ball Grid Array (BGA), Surface Mount Package, Pin Grid Array (PGA), Flat Package (FP), Small Outline Package), Packaging Method (Wire Bond and Die Attach, Flip Chip, Fan-Out Wafer Level Packaging (FOWLP)), Device (Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), RF Front-End, RF Power Amplifier, Baseband Processor, Application Processor, Others), Application (Consumer Electronics, Industrial, Automotive and Transportation, Aerospace and Defence, Healthcare, Emerging, Others) – Industry Trends and Forecast to 2029.
Global System in Package (SIP) Market Analysis and Size
Die technologies for system-in-package (SiP) are basically a packaging technique for incorporating numerous electronic sub components on a single substrate with other passive components. One of the key advantages of system-in-package (SiP) die technologies is that they are not only an IC package containing numerous dies, but they also feature active systems or subsystems.
- Data Bridge Market Research analyses that the system in package (SIP) market was valued at USD 23.51 billion in 2021 and is expected to reach USD 49.84 billion by 2029, registering a CAGR of 9.85% during the forecast period of 2022 to 2029. The market report curated by the Data Bridge Market Research team includes in-depth expert analysis, import/export analysis, pricing analysis, production consumption analysis, and pestle analysis.
Global System in Package (SIP) Market Definition
System in package (SIP) is a packaging method that allows numerous die to be included in a single module. It's a combination of multiple integrated circuits in a small package, lowering the cost of developing and assembling a printed circuit board even more (PCB). SiP dies can be stacked vertically or tiled horizontally with typical off-chip wire bonds or solder bumps. Because of its increased efficiency and durability, SiP is widely used in various industries, including consumer electronics, automotive, and telecommunications.
Report Scope and Market Segmentation
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Report Metric
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Details
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Forecast Period
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2022 to 2029
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Base Year
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2021
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Forecast Period
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2022 - 2029
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Historic Years
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2020 (Customizable to 2019 - 2014)
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Quantitative Units
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Revenue in USD Billion, Volumes in Units, Pricing in USD
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Segments Covered
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Packaging Technology (2D IC Packaging Technology, 2.5D IC Packaging Technology, 3D IC Packaging Technology), Package Type (Ball Grid Array (BGA), Surface Mount Package, Pin Grid Array (PGA), Flat Package (FP), Small Outline Package), Packaging Method (Wire Bond and Die Attach, Flip Chip, Fan-Out Wafer Level Packaging (FOWLP)), Device (Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), RF Front-End, RF Power Amplifier, Baseband Processor, Application Processor, Others), Application (Consumer Electronics, Industrial, Automotive and Transportation, Aerospace and Defence, Healthcare, Emerging, Others)
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Countries Covered
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U.S., Canada, Mexico, Germany, France, U.K., Italy, Spain, Switzerland, Netherlands, Russia, Turkey, Belgium, Rest of Europe, Japan, China, South Korea, India, Australia & New Zealand, Singapore, Thailand, Malaysia, Indonesia, Philippines, Rest of Asia-Pacific, South Africa, Israel, U.A.E., Saudi Arabia, Egypt, Rest of Middle East and Africa, Brazil, Argentina and Rest of South America
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Market Players Covered
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SAMSUNG (South Korea), Amkor Technology (US), ASE Group (Taiwan), ChipMOS TECHNOLOGIES INC. (Taiwan), JCET Group Co., Ltd. (China), Texas Instruments Incorporated. (US), Unisem (Malaysia), UTAC (Singapore), Renesas Electronics Corporation (Japan), Intel Corporation (US), FUJITSU (Japan), TOSHIBA ELECTRONICS EUROPE GMBH (Germany), Amkor Technology (US), SPIL (Taiwan), Powertech Technology (Taiwan)
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Market Opportunities
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System in Package (SIP) Market Dynamics
This section deals with understanding the market drivers, advantages, opportunities, restraints and challenges. All of this is discussed in detail as below:
Drivers
- Rise in the demand for miniaturization of electronic devices
The market is predicted to develop due to an increase in the demand for miniaturization of electronic devices. The demand for reliable and small electronic equipment has grown as a result of rapid R&D and technical advancements. As a result, the need for smaller electrical devices is increasing.
Furthermore, increasing disposable income and growing popularity of the internet of things (IoT) will drive market value growth. Other significant factors influencing the market's growth rate include the increase in the adoption of SiP technology in graphic cards and real-world gaming processors.
Opportunities
- Rise in the use of RF components in developing advanced 5G infrastructure
Rise in the use of RF components in developing advanced 5G infrastructure will enhance the market growth. Wireless networks might suffer considerable congestion in the next five years due to the availability of equipment that supports high bandwidth. This would accelerate the transition to 5G from present 3G and 4G LTE technology. The aggregate data rates supported by 5G technology are predicted to be much quicker than the currently available 3G and 4G data rates.
Moreover, rise in strategic collaborations and emerging new markets will act as market drivers and further boost beneficial opportunities for the market's growth rate. The surging technological advancement will boost new market opportunities for the market's growth rate.
Restraints/ Challenges Global System in Package (SIP) Market
- Supply chain management for the SiP market
On the other hand, supply chain management for the SiP market using a "one size fits all" approach is expected to bring significant hurdles to the global market for system-in-package (SiP) die technology. The market demand is set in stone and is constrained by well-defined supply constraints.
However, high cost associated with system in package (SIP) will hinder the system in package (SIP) market growth rate. Along with this, the less customization and increasing level of integration leads to thermal issues and hence impede the market growth. The negative impact of COVID-19 outbreak on supply chain will act as market restraint and further challenge the market growth rate.
This system in package (SIP) market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the system in package (SIP) market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
COVID-19 Impact on System in Package (SIP) Market
Over the last 18 months, almost every industry on the planet has suffered a setback. This can be ascribed to severe disruptions in their respective manufacturing and supply-chain operations, resulting from multiple precautionary lockdowns and other limitations imposed by governments all over the world. The global system in package (SiP) technology market is no exception. Furthermore, consumer preferences has decreased as people are now much more concentrated on removing non-essential expenses from their budgets as the wider economic situation of most people has been adversely impacted by this outbreak. Over the forecast period, the aforementioned factors are likely to have a negative impact on the global system in package (SiP) technology market's revenue trajectory.
Global System in Package (SIP) Market Scope
The system in package (SIP) market is segmented on the basis of packaging technology, package type, packaging method, application and device. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.
Packaging Technology
- 2D IC Packaging Technology
- 2.5D IC Packaging Technology
- 3D IC Packaging Technology
System in package (SIP) market on the basis of packaging technology has been segmented as 2D IC packaging technology, 2.5D IC packaging technology, and 3D IC packaging technology.
Package Type
- Ball Grid Array (BGA)
- Surface Mount Package
- Pin Grid Array (PGA)
- Flat Package (FP)
- Small Outline Package
Based on package type, system in package (SIP) market has been segmented into ball grid array (BGA), surface mount package, pin grid array (PGA), flat package (FP), and small outline package. Ball grid array (BGA) has been further segmented into plastic ball grid array (PBGA), super ball grid array (SBGA), fine pitch ball grid array (FBGA), flip chip ball grid array (FCBGA), and others. Surface mount package has been further segmented into land grid array (LGA), ceramic column grid array (CCGA), others. Pin grid array (PGA) has been further segmented into flip chip pin grid array (PGA), ceramic pin grid array (CPGA), and others. Flat package (FP) has been further segmented into quad flat no-leads (QFN), ultra thin quad flat no-leads (UTQFN), and others. Small outline package has been further segmented into thin small outline package (TSOP), thin shrink small outline package (TSSOP), and others.
Packaging Method
- Wire Bond and Die Attach
- Flip Chip
- Fan-Out Wafer Level Packaging (FOWLP)
On the basis of packaging method, system in package (SIP) market has been segmented into wire bond and die attach, flip chip, and fan-out wafer level packaging (FOWLP).
Application
- Consumer Electronics
- Industrial
- Automotive and Transportation
- Aerospace and Defence
- Healthcare
- Emerging
- Others
On the basis of application, system in package (SIP) market has been segmented into consumer electronics, industrial, automotive and transportation, aerospace and defence, healthcare, emerging and others. Consumer electronics has been segmented as communications.
Device
- Power Management Integrated Circuit (PMIC)
- Microelectromechanical Systems (MEMS)
- RF Front-End
- RF Power Amplifier
- Baseband Processor
- Application Processor
- Others
System in package (SIP) has also been segmented on the basis of device into power management integrated circuit (PMIC), microelectromechanical systems (MEMS), RF front-end, RF power amplifier, baseband processor, application processor, and others.
System in Package (SIP) Market Regional Analysis/Insights
The system in package (SIP) market is analysed and market size insights and trends are provided by country, packaging technology, package type, packaging method, application and device as referenced above.
The countries covered in the system in package (SIP) market report are U.S., Canada, Mexico, Germany, France, U.K., Italy, Spain, Switzerland, Netherlands, Russia, Turkey, Belgium, Rest of Europe, Japan, China, South Korea, India, Australia & New Zealand, Singapore, Thailand, Malaysia, Indonesia, Philippines, Rest of Asia-Pacific, South Africa, Israel, U.A.E., Saudi Arabia, Egypt, Rest of Middle East and Africa, Brazil, Argentina and Rest of South America.
Asia-Pacific dominates the package (SIP) market system in terms of market share and market revenue and will continue to flourish its dominance during the forecast period. This is due to the rising technology applications from the consumer electronics sector and the growing prevalence of various companies in this region.
The country section of the report also provides individual market impacting factors and changes in market regulation that impact the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and System in Package (SIP) Market Share Analysis
The system in package (SIP) market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to system in package (SIP) market.
Some of the major players operating in the system in package (SIP) market are:
- SAMSUNG (South Korea)
- Amkor Technology (US)
- ASE Group (Taiwan)
- ChipMOS TECHNOLOGIES INC. (Taiwan)
- JCET Group Co., Ltd. (China)
- Texas Instruments Incorporated. (US)
- Unisem (Malaysia)
- UTAC (Singapore)
- Renesas Electronics Corporation (Japan)
- Intel Corporation (US)
- FUJITSU (Japan)
- TOSHIBA ELECTRONICS EUROPE GMBH (Germany)
- Amkor Technology (US)
- SPIL (Taiwan)
- Powertech Technology (Taiwan)
Research Methodology : Global System in Package (SIP) Market
Data collection and base year analysis is done using data collection modules with large sample sizes. The stage includes the obtainment of market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analyzed and estimated using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.
The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market, and primary (industry expert) validation. Apart from this, data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis.
To know more about the research methodology, drop in an inquiry to speak to our industry experts
https://www.databridgemarketresearch.com/speak-to-analyst/?dbmr=global-system-in-package-sip-market
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