- In July 2024, Amkor expanded its SiP assembly and testing capabilities by inaugurating a new facility in Bac Ninh, Vietnam. This move aims to cater to the growing demand for innovative SiP solutions in the electronics and semiconductor sectors.
- In August 2022 Amkor expanded its SiP assembly and testing capabilities by inaugurating a new facility in Bac Ninh, Vietnam. This move aims to cater to the growing demand for innovative SiP solutions in the electronics and semiconductor sectors.
- In April 2024, Toshiba launched 80V N-channel power MOSFETs utilizing advanced manufacturing techniques. These components, housed in surface-mount packages, are designed for industrial equipment in data centers and telecom base stations.
- In February 2025, Qualcomm's Snapdragon SiP was featured in ASUS's ZenFone Max Shot and Max Plus (M2) smartphones in Brazil. This integration marked a significant step in delivering compact and efficient mobile solutions.
- In January 2025, JCET ramped up production at its Incheon, South Korea facility by introducing a new 12-inch wafer bumping line. This enhancement aimed to bolster their SiP manufacturing capabilities.
