- In April 2025, Parker Hannifin introduced its next-generation series of thermal interface materials (TIMs) developed for critical electronic cooling applications. The product range includes gels, pads, and greases, all engineered to deliver high thermal conductivity and long-term stability. These materials are specifically optimized for automotive electronics, telecom base stations, and industrial control systems, with a focus on improved manufacturability and performance under rigorous thermal cycling conditions. This launch strengthens Parker Hannifin’s position in delivering reliable TIM solutions for demanding industrial and electronic environments
- In October 2024, Carbice and Dow collaborated to unveil a new line of advanced thermal interface materials tailored for high-performance electronic devices. These materials are designed to enhance thermal efficiency and reliability across a variety of industries, including electronics, automotive, and telecommunications. This collaboration reflects both companies' commitment to innovation and addressing the growing need for reliable thermal management solutions in next-generation electronics
- In May 2024, Henkel responded to the rising market demand for thermal interface materials that deliver enhanced processability while meeting strict performance and cost criteria. Through an innovative formulation approach, Henkel developed the Bergquist Gap Filler TGF 4500CVO, a liquid, gap-filling TIM that significantly boosts dispensing speeds compared to traditional materials. This development reinforces Henkel’s competitive edge in providing efficient, high-performance TIMs for advanced electronics and automotive applications
- In March 2024, Dow expanded its portfolio of silicone-based thermal interface materials to support the evolving needs of advanced electronics. The new range of high-performance TIMs was designed to improve heat dissipation, reliability, and processing efficiency in electric vehicles, data centers, and 5G infrastructure applications. This strategic expansion underlines Dow’s focus on enabling miniaturization and supporting high-power density systems in critical industries
- In June 2022, Dow Corning Corporation launched its latest thermal interface material, the DOWSIL TC-4040, designed as a gap filler offering high thermal conductivity, easy dispensing, and excellent resistance to material slumping. This introduction enhanced Dow Corning’s product offering and competitiveness in the global TIM market by addressing key thermal management challenges in electronics
