Latest Developments in Global Thermoelectric Assemblies Market

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Latest Developments in Global Thermoelectric Assemblies Market

  • Semiconductors and Electronics
  • Jul 2021
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

  • In April 2025,  Laird Thermal Systems introduced a new generation of compact liquid-to-air thermoelectric assemblies designed for cooling laser systems, diagnostics, and telecom applications, featuring enhanced thermal performance with lower power consumption.
  • In March 2025, Phononic launched a fully integrated solid-state refrigeration platform for medical-grade point-of-care devices, offering wireless monitoring and quiet, vibration-free operation.
  • In February 2025, Ferrotec Corporation announced the expansion of its production capacity in China for high-efficiency thermoelectric modules, aiming to meet growing demand from EV battery manufacturers and lab instrumentation providers.
  • In January 2025, II-VI Incorporated (now Coherent Corp.) unveiled new bismuth telluride-based nano-structured modules with increased ZT value for high-performance cooling in defense optics and infrared systems.
  • In December 2024, TE Technology, Inc. released an upgraded series of ultra-compact thermoelectric air conditioners optimized for embedded electronics, ATM systems, and outdoor communication cabinets.