- In February 2024, Kioxia recently announced that it is now sampling the industry’s first Universal Flash Storage (UFS) 4.0 embedded flash memory device designed for automotive applications. At the core of these UFS 4.0 devices is Kioxia's BiCS 3D Flash memory technology. BiCS Flash moves away from the traditional planar structures to a more advanced 3D stacking process
- In February 2024, Micron Technology announced at MWC 2024 that they’re rolling out improved versions of their Universal Flash Storage (UFS) 4.0 for mobile devices. The new UFS 4.0 is smaller at 9×13 mm and holds up to 1 terabyte (TB) of data. It promises faster speeds, making flagship smartphones more responsive
- In January 2025, JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announced the publication of JESD220G, Universal Flash Storage 4.1. In addition, an update to the complementary JESD223F UFS Host Controller Interface (UFSHCI) version 4.1 standard was also published. Developed for mobile applications and computing systems requiring high performance with low power consumption, UFS 4.1 offers faster data access and improved performance over the earlier version of the standard while maintaining hardware compatibility with UFS 4.0. Both standards are available for download from the JEDEC website
- In July 2023, Renesas released the R-Car S4 Starter Kit, compatible with automotive portal systems, car servers, communication modules, and more. Renesas also offers a software development kit for the S4 system-on-chip (SoC). High computing performance and communication features are provided by the SoC, as well as safe vehicle control features. A new starter kit from the company provides a lower-cost alternative to the existing R-Car S4 Reference Board, which includes an evaluation board and a software evaluation kit
- In July 2023, Samsung Electronics Co., the biggest memory chipmaker in the world, started mass-producing a new flash memory chip for in-vehicle entertainment systems. With its low power consumption, Universal Flash Storage (UFS) 3.1 is the industry's most energy-efficient automotive chip. Samsung intends to surpass Micron Technology Inc. by 2025 with the latest vehicle chip. There will be three capacities of flash memory - 128, 256, and 512 gigabytes (GB), to meet the needs of a wide range of customers
