Latest Developments in Global Wafer Cleaning Equipment Market

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Latest Developments in Global Wafer Cleaning Equipment Market

  • Semiconductors and Electronics
  • May 2025
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

  • In December 2022, SCREEN Semiconductor Solutions, a subsidiary of SCREEN Holdings, introduced the SU-3400 single-wafer cleaning system. This system boasts a throughput of up to 1,200 wafers per hour, setting a new industry standard for single-wafer cleaning efficiency. It features a compact six-tier tower design, reducing the system's footprint by 30% compared to previous models. Additionally, the SU-3400 incorporates advanced cleaning technologies that minimize chemical usage and energy consumption, aligning with environmental sustainability goals
  • In December 2022, Tokyo Electron unveiled the CELLESTA MS2, a surface preparation system designed for wafer cleaning. This system integrates dual-fluid spray technology and brushes to clean both sides of a wafer simultaneously, enhancing productivity by more than 50% compared to previous models. It also eliminates the need for pure water and gases traditionally used to protect the non-washing side of the wafer, thereby reducing utility consumption. Furthermore, TEL's proprietary wafer retention technology enables effective cleaning of the wafer's edge and bevel, ensuring high levels of particle control essential for advanced semiconductor manufacturing.
  • In November 2024, SCREEN Semiconductor Solutions has introduced the SS-3200 model tailored for 200mm wafers. This system boasts a throughput of up to 500 wafers per hour, significantly enhancing cleaning efficiency for power devices. It also reduces environmental impact by minimizing the use of de-ionized water per wafer. The SS-3200's design facilitates easy maintenance and is equipped with an optional hot plate, making it ideal for drying MEMS and other three-dimensional structures.
  • In November 2024, Veeco Instruments has secured over $50 million in orders for its WaferStorm® system, catering to advanced packaging needs driven by AI applications. These orders, placed by leading foundries and OSATs, are scheduled for delivery into the first half of 2025. The WaferStorm® system's proprietary ImmJET™ solvent technology offers superior process performance, flexibility, and production capability, making it a critical component for high-performance computing and high-bandwidth memory applications.