- In June 2024, Soitec extended its partnership with UMC to develop the first 3D IC solution for RF-SOI technology, aiming to reduce die size by 45% and facilitate the integration of RF components to meet the bandwidth demand of 5G networks.
- In September 2023, Tower Semiconductor and Intel announced a strategic agreement to utilize Intel's 300mm manufacturing facility in New Mexico. Tower Semiconductor will invest up to $300 million in equipment, focusing on advanced analog processing and employing 65nm RF-SOI technology to improve power management and wireless connectivity.
- In June 2022, STMicroelectronics and GlobalFoundries signed an agreement to develop the FD-SOI ecosystem with a new 300mm manufacturing facility in Canada. This facility aims to support technologies used in industrial, communication, IoT, and automotive infrastructure applications.
- In November 2021, Soitec acquired NOVASiC, a provider of polishing and wafers on silicon carbide (SiC) services. This acquisition strengthens Soitec's position in the industrial and automotive markets and expands its SOI portfolio with silicon carbide technologies.
- In April 2024, Samsung signed a preliminary agreement with the U.S. Department of Commerce to receive up to $6.4 billion in funding under the CHIPS and Science Act. The investment includes plans to enhance SOI wafer production capabilities in central Texas, contributing to the domestic semiconductor supply chain.
