- In March 2025, TSMC launched a new FD-SOI wafer technology aimed at improving the performance and energy efficiency of advanced financial surveillance systems. The company aims to meet growing demand in the Asia-Pacific region for scalable, high-performance semiconductor solutions in sectors like finance and telecommunications.
- In February 2025, Samsung introduced a new line of Silicon on Insulator (SOI) wafers tailored for optical communication applications in Asia-Pacific. These wafers are designed to enhance data transmission speeds and efficiency, supporting the region's rapidly expanding 5G infrastructure and digital finance ecosystems.
