“Integration of AI and IoT”
The integration of Artificial Intelligence (AI) and the Internet of Things (IoT) across various industries is significantly boosting the demand for advanced semiconductor solutions. As AI applications, such as machine learning and data processing, and IoT devices require high computational power, 3D ICs are emerging as an ideal solution. These circuits offer enhanced processing capabilities, which are crucial for handling complex AI algorithms and large data volumes. In addition, 3D ICs provide better energy efficiency, reducing power consumption and heat generation compared to traditional semiconductor technologies. This makes them highly suitable for next-generation applications in fields such as autonomous vehicles, smart cities, healthcare, and industrial automation, where performance and power efficiency are critical.
