Global 3D IC Market – Industry Trends and Forecast to 2026

  • ICT
  • Upcoming Report
  • Jul 2019
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

Global 3D IC Market By Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power, Analog & Mixed Signal, RF, Photonics), End- User Industry (Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military & Aerospace, Smart Technologies, Medical Devices), Substrate (Silicon on Insulator, Bulk Silicon), Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa) – Industry Trends and Forecast to 2026

Market Analysis: Global 3D IC Market

Global 3D IC market is expected to register a healthy, CAGR of 38.65% in the forecast period of 2019-2026. Increasing adoption of high- end servers, computing and data centers and increasing demand for connected devices are the factor for the growth of this market.

Market Definition: Global 3D IC Market

3D IC or three dimensional integrated circuits is integrated circuits which consist of three dimensional arrays of interconnected devices and which is usually made of silicon wafers or dies. They are divided into three different type of level of interconnected such as local level, intermediat​​​​​​​e and global. They are widely used in applications such as LED, power, logic, imaging and optoelectronics, memory etc. 3D IC are widely used in industries like telecommunication, smart technologies, military and aerospace etc. Increasing usage of smartphones and gaming devices is the major factor fuelling the growth of this market.

Market Drivers:

  • Increasing demand for smartphone and gaming devices is driving the market
  • Rising miniaturization of electrical devices will also act as driver for this market
  • Increasing demand for memory device will also propel the market
  • Rising demand for 3D IC from various end users can also contribute as a factor for the growth of this market

Market Restraints:

  • Increasing level of integration in thermal issues will also hamper the market
  • High cost of 3D IC will also restrain the market growth

Segmentation: Global 3D IC Market ​​​​​​​

By Packaging Technology

  • 3D Wafer-Level Chip-Scale Packaging
  • 3D TSV
  • 2.5D

By Application

  • Logic
  • Imaging & Optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Power
  • Analog & Mixed Signal
  • RF
  • Photonics

By End- User Industry

  • Consumer Electronics
  • Telecommunication
  • Industrial Sector
  • Automotive
  • Military & Aerospace
  • Smart Technologies
  • Medical Technologies

By Substrate

  • Silicon on Insulator
  • Bulk Silicon

By Geography

  • North America

    • U.S.
    • Canada
    • Mexico

  • South America

    • Brazil
    • Argentina
    • Rest of South America

  • Europe

    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Turkey
    • Belgium
    • Netherlands
    • Switzerland
    • Rest of Europe

  • Asia-Pacific

    • Japan
    • China
    • South Korea
    • India
    • Australia
    • Singapore
    • Malaysia
    • Indonesia
    • Thailand
    • Philippines
    • Rest of Asia-Pacific

  • Middle East and Africa

    • South Africa
    • Egypt
    • Saudi Arabia
    • United Arab Emirates
    • Israel
    • Rest of Middle East and Africa

Key Developments in the Market:

  • In June 2017, Mentor announced the launch of their new advanced IC package design, the Xpedition High-Density Advanced Packaging (HDAP) flow. It will provide 2.5D/3D simulation models and design rule checking so that they have ability to identify accurate error before tape out. This technology ensures data synchronization for confident design sign-off and verification.
  • In August 2015, Tessera Technologies, Inc. announced that they have acquired Ziptronix, Inc. which will help the company to expand their packaging capabilities. This acquisition will help them to add low- temperature wafer bonding technology platform providing better 3D IC and 2.5D solutions to the semiconductor industry. The new technologies will create better opportunities so that the company can provide better solutions to its customers

Competitive Analysis: Global 3D IC Market ​​​​​​​

Global 3D IC market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of 3D IC market for global, Europe, North America, Asia-Pacific and South America.

Major Market Competitors/Players

Few of the major competitors currently working in the global 3D IC market are Taiwan Semiconductor Manufacturing Company Limited, ASE Technology Holding Co., Ltd, Amkor Technology, United Microelectronics Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd, Cadence Design Systems, Inc, EV Group (EVG), Xilinx Inc., Mentor, a Siemens Business, ANSYS, Inc., SÜSS MICROTEC SE., MonolithIC 3D Inc., Siliconware Precision Industries Co., Ltd., Certus Semiconductor, LLC., Camtek, NHanced Semiconductors, TEZZARON,  KLA Corporation, Powertech Technology Inc., and others

Research Methodology: Global 3D IC Market ​​​​​​​

Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analysed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please request an analyst call or can drop down your enquiry.

The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market, and primary (industry expert) validation. Apart from this, other data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Company Market Share Analysis, Standards of Measurement, Top to Bottom Analysis and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.

Key Insights in the report:

  • Complete and distinct analysis of the market drivers and restraints
  • Key market players involved in this industry
  • Detailed analysis of the market segmentation
  • Competitive analysis of the key players involved


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