The Global Ball Grid Array (BGA) Packaging Market is growing steadily as the demand for miniaturized and high-performance electronic devices increases. The market is driven by the expanding consumer electronics sector, where BGAs are preferred for their superior performance in compact designs. The automotive industry’s adoption of BGAs for advanced driver-assistance systems (ADAS) and electric vehicles (EVs) is also contributing to market growth. The telecommunications industry, especially with the roll-out of 5G networks, has further increased the need for reliable and high-density packaging solutions.
