“Growing adoption of miniaturized and high-performance electronic devices”
The Ball Grid Array (BGA) packaging market is witnessing key trends such as the growing adoption of miniaturized and high-performance electronic devices, particularly in consumer electronics and telecommunications. Demand for advanced interconnection technologies such as flip chip BGA is rising due to their superior electrical performance and thermal management. Increasing applications in automotive electronics, such as advanced driver assistance systems (ADAS), are further driving innovation in BGA packaging.
