- In March 2025, Lam Research introduced its latest dielectric etcher system featuring AI-driven process optimization and real-time in-situ monitoring. This next-generation tool enables enhanced precision and repeatability for advanced semiconductor manufacturing nodes. The launch targets increasing demand for ultra-fine etching capabilities in 3D IC and memory devices, helping chipmakers improve yield and reduce cycle times.
- In February 2025, Applied Materials announced a strategic partnership with Tokyo Electron to co-develop dielectric etching technologies focused on improving etch selectivity and uniformity for next-generation logic chips. The collaboration combines Applied Materials’ plasma etching expertise with Tokyo Electron’s process integration know-how, aimed at addressing the challenges of scaling down semiconductor features below 3 nm.
- In January 2025, ASML completed the acquisition of PlasmaTech Innovations, a startup specializing in high-precision plasma dielectric etching equipment. The acquisition enhances ASML’s capabilities in offering comprehensive process solutions combining lithography and etching, particularly for 3D IC manufacturing. This strategic move supports ASML’s vision of providing end-to-end chip fabrication technology.
- In December 2024, Lam Research announced a joint development agreement with Samsung Electronics to optimize dielectric etching processes for the next generation of 3D NAND flash memory. The collaboration focuses on improving etch depth control and aspect ratio management to support higher memory density and reliability. This partnership reflects the growing market demand for advanced memory technologies and precision etching solutions.
- In April 2025, Tokyo Electron (TEL) launched a new high-throughput dielectric etching system designed specifically for 3D IC fabrication. The product integrates advanced plasma control and endpoint detection technologies to enhance etching precision while boosting wafer throughput. This launch addresses the semiconductor industry's push towards complex 3D device architectures and faster production cycles, positioning TEL as a leader in etching solutions.
