- On April 2025, Qualcomm launched its new Snapdragon Automotive Connectivity Platform, designed to enhance in-vehicle embedded connectivity with 5G and Wi-Fi 6E support, targeting advanced infotainment and telematics systems in electric and autonomous vehicles.
- In February 2025, NXP introduced a new line of secure embedded connectivity chips optimized for Industrial IoT applications, focusing on enhanced cybersecurity features and energy efficiency for smart factories and automated manufacturing.
- In March 2025, STMicroelectronics unveiled its latest multi-protocol connectivity module supporting Bluetooth Low Energy (BLE), Zigbee, and Thread standards, aimed at smart home devices and wearable technology to enable seamless device communication.
- In January 2025, Intel announced a strategic partnership with automotive OEMs to integrate its embedded connectivity solutions into next-generation connected vehicles, emphasizing AI-driven data processing.
