- In July 2023, Cadence Design Systems, Inc. announced a collaboration with Intel Foundry Services (IFS) to certify its digital and custom/analog flows for the Intel 16 FinFET process technology. This partnership also delivered process design kits (PDKs) to support the development of low-power, high-performance computing applications, enhancing the adoption of Intel’s 16nm FinFET node for diverse industries including aerospace and government
- In May 2023, NXP Semiconductors partnered with TSMC to launch the industry’s first automotive-embedded MRAM (Magnetoresistive Random-Access Memory) using 16nm FinFET technology. This innovative MRAM offers faster code updates (20MB in under three seconds) and up to 10x greater endurance compared to traditional flash memory, targeting automotive mission-critical applications
- In April 2023, Samsung Electronics Co., Ltd. introduced its advanced 3nm FinFET process node with Multi-Bridge Channel FET (MBCFET) technology. This second-generation 3nm node delivers up to 39% higher performance and 49% improved power efficiency compared to previous nodes, targeting high-performance computing and mobile applications
- In March 2023, Qualcomm Technologies, Inc. completed its acquisition of NUVIA, a CPU and technology design company, to enhance its CPU roadmap leveraging FinFET technology. This strategic move strengthens Qualcomm’s position in delivering high-performance processors for Windows, Android, and Chrome ecosystems using advanced FinFET nodes
- In October 2022, Avicena demonstrated its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2022. This 1Tbps microLED-based Transceiver IC, built on a 16nm FinFET CMOS process, aims to address bandwidth and proximity constraints in high-performance computing applications
