- In June 2024, Multibeam Corp. introduced its MB platform, the first-ever Multicolumn E-Beam Lithography (MEBL) system, designed to improve chip manufacturing. This fully automated, precision-patterning technology is intended for mass production, with applications in rapid prototyping, advanced packaging, high-mix production, chip identification, compound semiconductors, and more
- In January 2024, ZEISS, in collaboration with ASML Holding, launched high NA-EUV lithography technology, which will enable a threefold increase in transistor density for advanced microchips. This breakthrough European technology, featuring ZEISS's ultra-precise optical system developed over 25 years, is set to power the first series production of next-generation microchips in 2025
- In October 2023, Canon released the FPA-1200NZ2C nanoimprint semiconductor manufacturing equipment, designed to carry out circuit pattern transfers, an essential step in semiconductor production
- In December 2022, Bruker Corporation acquired Neurescence Inc., a leading developer of ultralight fiber-bundle Multiscopes™ for optical functional neuroimaging in multi-regions. This acquisition strengthens Bruker's position in the field of freely behaving animal imaging and photostimulation, expanding their research and imaging capabilities for emerging trends
- In July 2021, Qualcomm partnered with General Motors to incorporate AI and 5G connectivity into future automotive systems. This collaboration aims to develop next-generation telematics systems and enhance the performance of ADAS and autonomous driving by powering digital cockpits
