Latest Developments in Global Moisture Curing Adhesives Market

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Latest Developments in Global Moisture Curing Adhesives Market

  • Chemical and Materials
  • Sep 2024
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

  • In May 2024, H.B. Fuller completed the acquisition of ND Industries, a leading provider of specialty adhesives and fastener locking solutions for automotive, electronics, aerospace, and industrial applications. This strategic move expands H.B. Fuller’s high-margin product portfolio, integrating ND Industries’ Vibra-Tite® brand into its existing epoxy, cyanoacrylate, UV-curable, and anaerobic adhesive range. The acquisition strengthens H.B. Fuller’s global presence, adding five U.S. locations and 300 employees to its Engineering Adhesives business unit
  • In November 2023, MasterSil 711Med successfully passed ISO 10993-5 testing, confirming its non-cytotoxicity standards for medical device manufacturing. This one-part RTV silicone requires no mixing, offering flowable application for bonding, sealing, coating, and form-in-place gasketing. Engineered for high durability, it withstands sterilization methods such as gamma radiation, EtO, and liquid sterilants. The compound provides electrical insulation, thermal resistance up to 400°F, and superior flexibility, ensuring long-term reliability in medical environments
  • In June 2023, Dymax introduced HLC-M-1000, the first medical adhesive in its Hybrid Light-Curable (HLC) series. This innovative formulation combines Dymax’s light-curable technology with rapid moisture cure from anionics, enabling instant bonding in dark areas and enhanced adhesion to opaque substrates. Designed for medical device assembly, HLC-M-1000 meets biocompatibility standards and is optimized for catheters, tube sets, autoinjectors, and endoscopes. The adhesive cures under broad-spectrum light and low-intensity exposure, ensuring efficient application
  • In November 2022, Henkel introduced Loctite Ablestik ICP 2120, an electrically conductive adhesive (ECA) designed to enhance electrical grounding performance in compact camera modules (CCMs). This room-temperature moisture cure formulation protects heat-sensitive substrates, ensuring high reliability and yield rates in mobile device manufacturing. Loctite Ablestik ICP 2120 offers low direct contact resistance (DCR) and high thermal conductivity (7.0 W/m-K), optimizing electrostatic discharge removal and heat dissipation. Its low modulus improves drop performance, making it ideal for miniaturized electronics
  • In February 2022, Arkema finalized the acquisition of Ashland’s Performance Adhesives business, reinforcing its Adhesive Solutions segment and advancing its strategy to become a pure Specialty Materials player by 2024. This acquisition, valued at USD 1.65 billion, integrates Ashland’s pressure-sensitive, structural, and flexible packaging adhesives into Arkema’s portfolio. The deal enhances Bostik’s capabilities, expanding its presence in high-performance industrial adhesives. With six production plants and 330 employees, Ashland’s expertise complements Arkema’s global adhesive market leadership