- In June 2024, Teledyne e2v HiRel announced the launch of two enhanced plastic low noise amplifiers, the TDLNA2050EP and TDLNA0430EP, aimed at very high frequency to S-band applications. These components, built on a 250 nm pHEMT process, offer low noise figures, compact size, and low power consumption. Designed for high-reliability environments, the amplifiers are expected to enhance performance in aerospace and defense electronics, supporting market demand for efficient and miniaturized solutions
- In May 2024, Apogee Semiconductor introduced its AF54RHC GEO family of radiation-hardened integrated circuits, specifically built for use in medium Earth orbit, geosynchronous Earth orbit, and deep space missions. Along with this launch, the company also upgraded its LEO IC family’s TID radiation tolerance. These advancements significantly improve mission durability and reliability, boosting Apogee's presence in the space-grade electronics market
- In November 2023, Infineon Technologies expanded its portfolio by launching new radiation-hardened asynchronous static RAMs featuring RADSTOP technology. These QML-V certified memory components are tailored for space and extreme environment applications, offering unmatched access speeds and a small footprint. The products aim to meet the stringent radiation and performance needs of aerospace missions, strengthening Infineon's role in the high-density memory segment
- In July 2021, Renesas Electronics Corporation unveiled a new suite of radiation-hardened plastic ICs targeted at satellite power management. The product line includes buck regulators, digital isolators, and GaN FET drivers, delivering high reliability with a lower size, weight, and power (SWaP) profile. Offering a cost-effective alternative to ceramic solutions, the development enhances Renesas’ position in supporting advanced satellite systems operating in MEO and GEO environment
