- In December 2023, Samsung Electronics unveiled its 256GB 3D NAND Flash memory, leveraging 236-layer stacking technology, offering 20% higher storage density for SSDs and mobile devices, adopted by major data center providers in the U.S. and China.
- In February 2024, Micron Technology launched the LPDDR5X DRAM, optimized for AI and 5G applications, delivering 15% faster data transfer rates, integrated into flagship smartphones and edge devices across Europe and Asia-Pacific.
- In April 2024, SK Hynix partnered with TSMC to develop HBM4 memory for AI workloads, enhancing bandwidth by 25%, with production set to begin in 2025 for data center applications in North America.
- In July 2024, Kioxia introduced a 2TB QLC NAND Flash module, designed for enterprise SSDs, reducing power consumption by 18%, gaining traction in cloud computing markets in Japan and the U.S.
- In September 2023, Intel launched its Optane Persistent Memory 300 series, combining DRAM-like speed with non-volatile storage, adopted in over 50 data centers across Europe for high-performance computing.
