-
In February 2025, Veeco shipped its NSA500™ Nanosecond Annealing system to a leading-edge semiconductor company for high-volume production of 2-nanometer gate-all-around logic chips. This system offers precise annealing capabilities, crucial for advanced semiconductor manufacturing processes.
- In 2025, Entegris showcased its new Flex Mixing System at the Advanced Therapies 2025 event. This system is designed to replace traditional large-scale mixing solutions, offering enhanced efficiency in cell culture media and buffer preparation. It addresses challenges like eliminating low-density media clumps and enabling rapid mixing.
- In April 2025, Veeco Instruments Inc. was honored with Intel’s prestigious EPIC Supplier Award, recognizing its exceptional commitment to quality, innovation, and performance excellence in the semiconductor supply chain.
- In November 2024, SCREEN introduced the SS-3200 for 200mm wafers, expanding its spin scrubber lineup. This system offers a throughput of up to 500 wafers per hour, more than tripling the capacity of its predecessor. Designed for power devices in automotive and power control systems, the SS-3200 reduces environmental impact by using less de-ionized water per wafer. Its slide-out spin chambers and optional hot plate enhance maintenance and drying capabilities. Sales commenced in December 2024, aiming to support the mass production of next-generation power devices.
- In July 2024, Tokyo Electron launched the Acrevia pattern shaping tool. Utilizing directional gas cluster beams, Acrevia precisely etches feature sidewalls, enhancing pattern fidelity in EUV lithography. The system includes low-damage cleaning capabilities, aligning with TEL's commitment to advanced cleaning solutions. Samsung Electronics began testing Acrevia for their foundry business, indicating its potential in high-precision applications. This launch reflects TEL's focus on integrating
