Table of Content
1 INTRODUCTION
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 OVERVIEW OF GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET
1.4 CURRENCY AND PRICING
1.5 LIMITATION
1.6 MARKETS COVERED
2 MARKET SEGMENTATION
2.1 KEY TAKEAWAYS
2.2 ARRIVING AT THE GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET
2.2.1 VENDOR POSITIONING GRID
2.2.2 TECHNOLOGY LIFE LINE CURVE
2.2.3 MARKET GUIDE
2.2.4 COMPANY POSITIONING GRID
2.2.5 COMAPANY MARKET SHARE ANALYSIS
2.2.6 MULTIVARIATE MODELLING
2.2.7 TOP TO BOTTOM ANALYSIS
2.2.8 STANDARDS OF MEASUREMENT
2.2.9 VENDOR SHARE ANALYSIS
2.2.10 DATA POINTS FROM KEY PRIMARY INTERVIEWS
2.2.11 DATA POINTS FROM KEY SECONDARY DATABASES
2.3 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET: RESEARCH SNAPSHOT
2.4 ASSUMPTIONS
3 MARKET OVERVIEW
3.1 DRIVERS
3.2 RESTRAINTS
3.3 OPPORTUNITIES
3.4 CHALLENGES
4 EXECUTIVE SUMMARY
5 PREMIUM INSIGHT
5.1 PORTERS FIVE FORCES
5.2 REGULATORY STANDARDS
5.3 TECHNOLOGICAL TRENDS
5.4 PATENT ANALYSIS
5.5 CASE STUDY
5.6 VALUE CHAIN ANALYSIS
5.7 COMPANY COMPARITIVE ANALYSIS
5.8 PRICING ANALYSIS
6 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, BY TYPE
6.1 OVERVIEW
6.2 MOSFETS
6.3 HYBRID MODULES
6.4 BIPOLAR JUNCTION TRANSISTOR (BJT)
6.5 SCHOTTKY BARRIER DIODES (SBDS)
6.6 SIC BARE DIE
6.7 PIN DIODE
6.8 JUNCTION FET (JFET)
6.9 OTHERS
7 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, BY VOLTAGE RANGE
7.1 OVERVIEW
7.2 LESS THAN 300 V
7.3 301 V TO 900 V
7.4 901 V TO 1700 V
7.5 1701 V & ABOVE
8 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, BY WAFER SIZE
8.1 OVERVIEW
8.2 2 INCH
8.3 4 INCH
8.4 6 INCH & ABOVE
9 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, BY WAFER TYPE
9.1 OVERVIEW
9.2 SIC EPITAXIAL WAFERS
9.3 BLANK SIC WAFERS
10 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, BY APPLICATION
10.1 OVERVIEW
10.2 POWER SUPPLIES
10.2.1 BY TYPE
10.2.1.1. MOSFETS
10.2.1.2. HYBRID MODULES
10.2.1.3. BIPOLAR JUNCTION TRANSISTOR (BJT)
10.2.1.4. SCHOTTKY BARRIER DIODES (SBDS)
10.2.1.5. SIC BARE DIE
10.2.1.6. PIN DIODE
10.2.1.7. JUNCTION FET (JFET)
10.2.1.8. OTHERS
10.3 INDUSTRIAL MOTOR DRIVES
10.3.1 BY TYPE
10.3.1.1. MOSFETS
10.3.1.2. HYBRID MODULES
10.3.1.3. BIPOLAR JUNCTION TRANSISTOR (BJT)
10.3.1.4. SCHOTTKY BARRIER DIODES (SBDS)
10.3.1.5. SIC BARE DIE
10.3.1.6. PIN DIODE
10.3.1.7. JUNCTION FET (JFET)
10.3.1.8. OTHERS
10.4 ELECTRIC VEHICLES (EV)
10.4.1 BY TYPE
10.4.1.1. MOSFETS
10.4.1.2. HYBRID MODULES
10.4.1.3. BIPOLAR JUNCTION TRANSISTOR (BJT)
10.4.1.4. SCHOTTKY BARRIER DIODES (SBDS)
10.4.1.5. SIC BARE DIE
10.4.1.6. PIN DIODE
10.4.1.7. JUNCTION FET (JFET)
10.4.1.8. OTHERS
10.5 INVERTERS
10.5.1 BY TYPE
10.5.1.1. MOSFETS
10.5.1.2. HYBRID MODULES
10.5.1.3. BIPOLAR JUNCTION TRANSISTOR (BJT)
10.5.1.4. SCHOTTKY BARRIER DIODES (SBDS)
10.5.1.5. SIC BARE DIE
10.5.1.6. PIN DIODE
10.5.1.7. JUNCTION FET (JFET)
10.5.1.8. OTHERS
10.6 RF DEVICES
10.6.1 BY TYPE
10.6.1.1. MOSFETS
10.6.1.2. HYBRID MODULES
10.6.1.3. BIPOLAR JUNCTION TRANSISTOR (BJT)
10.6.1.4. SCHOTTKY BARRIER DIODES (SBDS)
10.6.1.5. SIC BARE DIE
10.6.1.6. PIN DIODE
10.6.1.7. JUNCTION FET (JFET)
10.6.1.8. OTHERS
10.7 PHOTOVOLTAICS
10.7.1 BY TYPE
10.7.1.1. MOSFETS
10.7.1.2. HYBRID MODULES
10.7.1.3. BIPOLAR JUNCTION TRANSISTOR (BJT)
10.7.1.4. SCHOTTKY BARRIER DIODES (SBDS)
10.7.1.5. SIC BARE DIE
10.7.1.6. PIN DIODE
10.7.1.7. JUNCTION FET (JFET)
10.7.1.8. OTHERS
10.8 OTHERS
11 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, BY VERTICAL
11.1 OVERVIEW
11.2 RENEWABLES / GRIDS
11.2.1 SOLAR INVERTERS
11.2.2 AUXILIARY POWER SUPPLY (APS)
11.2.3 ENERGY STORAGE SYSTEMS
11.3 AEROSPACE & DEFENSE
11.3.1 FLIGHT ACTUATORS
11.3.2 PROPULSION DRIVE
11.3.3 E-FUSE TECHNOLOGY
11.3.4 POWER DISTRIBUTION
11.3.5 TRACTION DRIVE
11.4 AUTOMOTIVE & TRANSPORTATION
11.4.1 DC FAST CHARGING
11.4.2 ON-BOARD CHARGERS (OBCS)
11.4.3 ON-BOARD DC-DC CONVERSION
11.4.4 OTHERS
11.5 DATA CENTERS
11.5.1 POWER SUPPLY UNITS (PSU)
11.5.2 POWER FACTOR CORRECTION (PFC)
11.5.3 DC-DC CONVERSION
11.5.4 BACKUP POWER
11.5.5 TELECOM/5G POWER SUPPLIES
11.5.6 OTHERS
11.6 INDUSTRIAL
11.6.1 SEMICONDUCTOR CAPITAL EQUIPMENT
11.6.2 INDUCTION HEATING
11.6.3 WELDING / PLASMA CUTTING
11.6.4 UNINTERRUPTIBLE POWER SUPPLY (UPS)
11.6.5 ROBOTICS
11.7 MEDICAL
11.7.1 AC-DC CONVERSION
11.7.2 DC-DC CONVERSION
11.7.3 OTHERS
11.8 CONSUMER ELECTRONICS
11.9 OTHERS
12 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, BY GEOGRAPHY
GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)
12.1 NORTH AMERICA
12.1.1 U.S.
12.1.2 CANADA
12.1.3 MEXICO
12.2 EUROPE
12.2.1 GERMANY
12.2.2 FRANCE
12.2.3 U.K.
12.2.4 ITALY
12.2.5 SPAIN
12.2.6 RUSSIA
12.2.7 TURKEY
12.2.8 BELGIUM
12.2.9 NETHERLANDS
12.2.10 NORWAY
12.2.11 FINLAND
12.2.12 SWITZERLAND
12.2.13 DENMARK
12.2.14 SWEDEN
12.2.15 POLAND
12.2.16 REST OF EUROPE
12.3 ASIA PACIFIC
12.3.1 JAPAN
12.3.2 CHINA
12.3.3 SOUTH KOREA
12.3.4 INDIA
12.3.5 AUSTRALIA
12.3.6 NEW ZEALAND
12.3.7 SINGAPORE
12.3.8 THAILAND
12.3.9 MALAYSIA
12.3.10 INDONESIA
12.3.11 PHILIPPINES
12.3.12 TAIWAN
12.3.13 VIETNAM
12.3.14 REST OF ASIA PACIFIC
12.4 SOUTH AMERICA
12.4.1 BRAZIL
12.4.2 ARGENTINA
12.4.3 REST OF SOUTH AMERICA
12.5 MIDDLE EAST AND AFRICA
12.5.1 SOUTH AFRICA
12.5.2 EGYPT
12.5.3 SAUDI ARABIA
12.5.4 U.A.E
12.5.5 OMAN
12.5.6 BAHRAIN
12.5.7 ISRAEL
12.5.8 KUWAIT
12.5.9 QATAR
12.5.10 REST OF MIDDLE EAST AND AFRICA
12.6 KEY PRIMARY INSIGHTS: BY MAJOR COUNTRIES
13 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET,COMPANY LANDSCAPE
13.1 COMPANY SHARE ANALYSIS: GLOBAL
13.2 COMPANY SHARE ANALYSIS: NORTH AMERICA
13.3 COMPANY SHARE ANALYSIS: EUROPE
13.4 COMPANY SHARE ANALYSIS: ASIA PACIFIC
13.5 MERGERS & ACQUISITIONS
13.6 NEW PRODUCT DEVELOPMENT AND APPROVALS
13.7 EXPANSIONS
13.8 REGULATORY CHANGES
13.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS
14 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, SWOT & DBMR ANALYSIS
15 GLOBAL SILICON CARBIDE POWER SEMICONDUCTORS MARKET, COMPANY PROFILE
15.1 ROHM CO., LTD
15.1.1 COMPANY SNAPSHOT
15.1.2 REVENUE ANALYSIS
15.1.3 GEOGRAPHIC PRESENCE
15.1.4 PRODUCT PORTFOLIO
15.1.5 RECENT DEVELOPMENT
15.2 DANFOSS
15.2.1 COMPANY SNAPSHOT
15.2.2 REVENUE ANALYSIS
15.2.3 GEOGRAPHIC PRESENCE
15.2.4 PRODUCT PORTFOLIO
15.2.5 RECENT DEVELOPMENT
15.3 MICROCHIP TECHNOLOGY INC.
15.3.1 COMPANY SNAPSHOT
15.3.2 REVENUE ANALYSIS
15.3.3 GEOGRAPHIC PRESENCE
15.3.4 PRODUCT PORTFOLIO
15.3.5 RECENT DEVELOPMENT
15.4 STMICROELECTRONICS
15.4.1 COMPANY SNAPSHOT
15.4.2 REVENUE ANALYSIS
15.4.3 GEOGRAPHIC PRESENCE
15.4.4 PRODUCT PORTFOLIO
15.4.5 RECENT DEVELOPMENT
15.5 INFINEON TECHNOLOGIES AG
15.5.1 COMPANY SNAPSHOT
15.5.2 REVENUE ANALYSIS
15.5.3 GEOGRAPHIC PRESENCE
15.5.4 PRODUCT PORTFOLIO
15.5.5 RECENT DEVELOPMENT
15.6 WOLFSPEED, INC.
15.6.1 COMPANY SNAPSHOT
15.6.2 REVENUE ANALYSIS
15.6.3 GEOGRAPHIC PRESENCE
15.6.4 PRODUCT PORTFOLIO
15.6.5 RECENT DEVELOPMENT
15.7 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
15.7.1 COMPANY SNAPSHOT
15.7.2 REVENUE ANALYSIS
15.7.3 GEOGRAPHIC PRESENCE
15.7.4 PRODUCT PORTFOLIO
15.7.5 RECENT DEVELOPMENT
15.8 ALLEGRO MICROSYSTEMS, INC
15.8.1 COMPANY SNAPSHOT
15.8.2 REVENUE ANALYSIS
15.8.3 GEOGRAPHIC PRESENCE
15.8.4 PRODUCT PORTFOLIO
15.8.5 RECENT DEVELOPMENT
15.9 FUJI ELECTRIC CO., LTD
15.9.1 COMPANY SNAPSHOT
15.9.2 REVENUE ANALYSIS
15.9.3 GEOGRAPHIC PRESENCE
15.9.4 PRODUCT PORTFOLIO
15.9.5 RECENT DEVELOPMENT
15.1 GENESIC SEMICONDUCTOR INC. (A PART OF NAVITAS SEMICONDUCTOR)
15.10.1 COMPANY SNAPSHOT
15.10.2 REVENUE ANALYSIS
15.10.3 GEOGRAPHIC PRESENCE
15.10.4 PRODUCT PORTFOLIO
15.10.5 RECENT DEVELOPMENT
15.11 HITACHI POWER SEMICONDUCTOR DEVICE, LTD
15.11.1 COMPANY SNAPSHOT
15.11.2 REVENUE ANALYSIS
15.11.3 GEOGRAPHIC PRESENCE
15.11.4 PRODUCT PORTFOLIO
15.11.5 RECENT DEVELOPMENT
15.12 LITTELFUSE, INC.
15.12.1 COMPANY SNAPSHOT
15.12.2 REVENUE ANALYSIS
15.12.3 GEOGRAPHIC PRESENCE
15.12.4 PRODUCT PORTFOLIO
15.12.5 RECENT DEVELOPMENT
15.13 MITSUBISHI ELECTRIC CORPORATION
15.13.1 COMPANY SNAPSHOT
15.13.2 REVENUE ANALYSIS
15.13.3 GEOGRAPHIC PRESENCE
15.13.4 PRODUCT PORTFOLIO
15.13.5 RECENT DEVELOPMENT
15.14 RENESAS ELECTRONICS CORPORATION
15.14.1 COMPANY SNAPSHOT
15.14.2 REVENUE ANALYSIS
15.14.3 GEOGRAPHIC PRESENCE
15.14.4 PRODUCT PORTFOLIO
15.14.5 RECENT DEVELOPMENT
15.15 SEMIQ INC.
15.15.1 COMPANY SNAPSHOT
15.15.2 REVENUE ANALYSIS
15.15.3 GEOGRAPHIC PRESENCE
15.15.4 PRODUCT PORTFOLIO
15.15.5 RECENT DEVELOPMENT
15.16 TEXAS INSTRUMENTS INCORPORATED
15.16.1 COMPANY SNAPSHOT
15.16.2 REVENUE ANALYSIS
15.16.3 GEOGRAPHIC PRESENCE
15.16.4 PRODUCT PORTFOLIO
15.16.5 RECENT DEVELOPMENT
15.17 TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
15.17.1 COMPANY SNAPSHOT
15.17.2 REVENUE ANALYSIS
15.17.3 GEOGRAPHIC PRESENCE
15.17.4 PRODUCT PORTFOLIO
15.17.5 RECENT DEVELOPMENT
15.18 UNITEDSIC (A PART OF QORVO)
15.18.1 COMPANY SNAPSHOT
15.18.2 REVENUE ANALYSIS
15.18.3 GEOGRAPHIC PRESENCE
15.18.4 PRODUCT PORTFOLIO
15.18.5 RECENT DEVELOPMENT
15.19 SAMSUNG
15.19.1 COMPANY SNAPSHOT
15.19.2 REVENUE ANALYSIS
15.19.3 GEOGRAPHIC PRESENCE
15.19.4 PRODUCT PORTFOLIO
15.19.5 RECENT DEVELOPMENT
15.2 XIAMEN POWERWAY ADVANCED MATERIAL CO. LTD.
15.20.1 COMPANY SNAPSHOT
15.20.2 REVENUE ANALYSIS
15.20.3 GEOGRAPHIC PRESENCE
15.20.4 PRODUCT PORTFOLIO
15.20.5 RECENT DEVELOPMENT
15.21 WEEN SEMICONDUCTORS
15.21.1 COMPANY SNAPSHOT
15.21.2 REVENUE ANALYSIS
15.21.3 GEOGRAPHIC PRESENCE
15.21.4 PRODUCT PORTFOLIO
15.21.5 RECENT DEVELOPMENT
15.22 TOYOTA MOTOR CORPORATION
15.22.1 COMPANY SNAPSHOT
15.22.2 REVENUE ANALYSIS
15.22.3 GEOGRAPHIC PRESENCE
15.22.4 PRODUCT PORTFOLIO
15.22.5 RECENT DEVELOPMENT
15.23 MAXPOWER SIC SEMICONDUCTOR CO., LTD
15.23.1 COMPANY SNAPSHOT
15.23.2 REVENUE ANALYSIS
15.23.3 GEOGRAPHIC PRESENCE
15.23.4 PRODUCT PORTFOLIO
15.23.5 RECENT DEVELOPMENT
15.24 NEXPERIA
15.24.1 COMPANY SNAPSHOT
15.24.2 REVENUE ANALYSIS
15.24.3 GEOGRAPHIC PRESENCE
15.24.4 PRODUCT PORTFOLIO
15.24.5 RECENT DEVELOPMENT
NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDY AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST
16 CONCLUSION
17 QUESTIONNAIRE
18 RELATED REPORTS
19 ABOUT DATA BRIDGE MARKET RESEARCH
