- In December 2022, STMicroelectronics announced a collaboration with Soitec to qualify Soitec’s SmartSiC technology for its upcoming 200mm silicon carbide substrate manufacturing. This partnership aims to enable volume production in the midterm, strengthening STMicroelectronics’ production capabilities and supporting growth in the global silicon carbide power semiconductor market
- In November 2022, Infineon Technologies signed a non-binding Memorandum of Understanding for a multi-year supply cooperation with Stellantis’s direct Tier 1 suppliers. The agreement, valued at over EUR 1 billion, plans to deliver CoolSiC bare die chips in the latter half of the decade, enhancing Infineon’s market position and contributing significantly to the expansion of the global silicon carbide power semiconductor market
